PCBs Layout Guidelines for RF & Mixed-Signal

Sep 14 2011
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Abstract

This application note provides guidelines and suggestions for RF printed-circuit board (PCB) design and layout, including some discussion of mixed-signal applications. The material provides "best practices" guidance, and should be used in conjunction with all other design and manufacturing guidelines that may apply to particular components, PCB manufacturers, and material sets as applicable.

This application note applies to all Analog Device wireless products.

Introduction

This application note provides guidelines and suggestions for RF printed-circuit board (PCB) design and layout, including some discussion of mixed-signal applications, such as digital, analog, and RF components on the same PCB. The material is arranged by topic areas and provides "best practices" guidance. It should be used in conjunction with all other design and manufacturing guidelines that may apply to particular components, PCB manufacturers, and material sets as applicable.

RF Transmission Lines

Many of Analog Devices' RF components require controlled impedance transmission lines that will transport RF power to (or from) IC pins on the PCB. These transmission lines can be implemented on a exterior layer (top or bottom), or buried in an internal layer. Guidelines for these transmission lines include discussions relating to the microstrip, suspended stripline, coplanar waveguide (grounded), and characteristic impedance. It also describes transmission line bends and corner compensation, and layer changes for transmission lines.


Microstrip


This type of transmission line consists of fixed-width metal routing (the conductor), along with a solid unbroken ground plane located directly underneath (on the adjacent layer). For example, a microstrip on Layer 1 (top metal) requires a solid ground plane on Layer 2 (Figure 1). The width of the routing, the thickness of the dielectric layer, and the type of dielectric determine the characteristic impedance (typically 50Ω or 75Ω).

Isometric view Microstrip example.

Figure 1. Microstrip example (isometric view).

Suspended Stripline


This line consists of a fixed-width routing on an inner layer, with solid ground planes above and below the center conductor. The conductor can be located midway between the ground planes (Figure 2), or it can be offset (Figure 3). This is the appropriate method for RF routing on inner layers.

Suspended stripline (end view).

Figure 2. Suspended stripline (end view).

Offset suspended stripline. A variant of the stripline, for PCBs with unequal layer thicknesses (end view).

Figure 3. Offset suspended stripline. A variant of the stripline, for PCBs with unequal layer thicknesses (end view).

Coplanar Waveguide (Grounded)


A coplanar waveguide provides for better isolation between nearby RF lines, as well as other signal lines (end view). This medium consists of a center conductor with ground planes on either side and below (Figure 4).

Coplanar waveguide provides for better isolation between nearby RF lines and other signal lines.

Figure 4. A coplanar waveguide provides for better isolation between nearby RF lines and other signal lines.

Via "fences" are recommended on both sides of a coplanar waveguide, as shown in Figure 5. This top view provides an example of a row of ground vias on each top metal gound plane on either side of the center conductor. Return currents induced on the top layer are shorted to the underlying ground layer.

Via fences are recommended on both sides of a coplanar waveguide.

Figure 5. Via fences are recommended on both sides of a coplanar waveguide.

Characteristic Impedance


There are several calculators available to properly set the signal conductor line width to achieve the target impedance. However, caution should be used when entering the dielectric constant of the layers. The outer laminated layers of typical PCBs often contain less glass content than the core of the board, and consequently the dielectric constant is lower. For example, FR4 core is generally given as εR = 4.2, whereas the outer laminate (prepreg) layers are typically εR = 3.8. Examples given below for reference only, metal thickness assumed for 1oz copper (1.4 mils, 0.036mm).

Table 1. Examples of Characteristic Impedance
Media Dielectric Layer Thickness in mils (mm) Center Conductor in mils (mm) Gap Characteristic Impedance
Microstrip Prepreg (3.8) 6 (0.152) 11.5 (0.292) N/A 50.3
10 (0.254) 20 (0.508) 50.0
Diff. Pair Prepreg (3.8) 6 (0.152) 25 (0.635) 6 (0.152) 50.6
Stripline FR4 (4.5) 12 (0.305) 3.7 (0.094) N/A 50.0
Offset Stripline Prepreg (3.9)
6 (0.152) upper, 4.8 (0.122)

N/A

50.1
10 (0.254) lower
Coplanar WG Prepreg (3.8)
6 (0.152) 14 (0.35) 20 (0.50) 49.7

Transmission Line Bends and Corner Compensation


When transmission lines are required to bend (change direction) due to routing constraints, use a bend radius that is at least 3 times the center conductor width. In other words:

Bend Radius ≥ 3 × (Line Width).

This will minimize any characteristics impedance changes moving through the bend.

In cases where a gradually curved bend is not possible, the transmission line can undergo a right-angle bend (noncurved). See Figure 6. However, this must be compensated to reduce the impedance discontinuity caused by the local increase in effective line width going through the bend. A standard compensation method is the angled miter, as illustrated below. The optimum microstrip right-angle miter is given by the formula of Douville and James:

Equation 1.

Where M is the fraction (%) of the miter compared to the unmitered bend. This formula is independent of the dielectric constant, and is subject to the constraint that w/h ≥ 0.25.

Similar methods can be employed for other transmission lines. If there is any uncertainty as to the correct compensation, the bend should be modeled using an electromagnetic simulator if the design requires high-performance transmission lines.

When a curved bend is not possible, the transmission line can undergo a right-angle bend.

Figure 6. When a curved bend is not possible, the transmission line can undergo a right-angle bend.

Layer Changes for Transmission Lines


When layout constraints required that a transmission line move to a different layer, it is recommended that at least two via holes be used for each transition to minimize the via inductance loading. A pair of vias will effectively cut the transition inductance by 50%, and the largest diameter via should be utilized that is compatible with the transmission line width. For example, on a 15-mil microstrip line, a via diameter (finished plated diameter) of 15 mils to 18 mils would be used. If space does not permit the use of larger vias, then three transition vias of smaller diameter should be used.

Signal Line Isolation

Care must be taken to prevent unintended coupling between signal lines. Some examples of potential coupling and preventative measures:

  • RF Transmission Lines: Lines should be kept as far apart as possible, and should not be routed in close proximity for extended distances. Coupling between parallel microstrip lines will increase with decreasing separation and increasing parallel routing distance. Lines that cross on separate layers should have a ground plane keeping them apart. Signal lines that will carry high power levels should be kept away from all other lines whenever possible. The grounded coplanar waveguide provides for excellent isolation between lines. It is impractical to achieve isolation better than approximately -45dB between RF lines on small PCBs.
  • High-Speed Digital Signal Lines: These lines should be routed separately on a different layer than the RF signal lines, to prevent coupling. Digital noise (from clocks, PLLs, etc.) can couple onto RF signal lines, and these can be modulated onto RF carriers. Alternatively, in some cases digital noise can be up/down-converted.
  • VCC/Power Lines: These should be routed on a dedicated layer. Adequate decoupling/bypass capacitors should be provided at the main VCC distribution node, as well as at VCC branches. The choice of the bypass capacitances must be made based on the overall frequency response of the RF IC, and the expected frequency distribution nature of any digital noise from clocks and PLLs. These lines should also be separated from any RF lines that will transmit large amounts of RF power.

Ground Planes

The recommended practice is to use a solid (continuous) ground plane on Layer 2, assuming Layer 1 is used for the RF components and transmission lines. For striplines and offset striplines, ground planes above and below the center conductor are required. These planes must not be shared or assigned to signal or power nets, but must be uniquely allocated to ground. Partial ground planes on a layer, sometimes required by design constraints, must underlie all RF components and transmission lines. Ground planes must not be broken under transmission line routing.

Ground vias between layers should be added liberally throughout the RF portion of the PCB. This helps prevent accrual of parasitic ground inductance due to ground-current return paths. The vias also help to prevent cross-coupling from RF and other signal lines across the PCB.

Special Consideration on Bias and Ground Layers

The layers assigned to system bias (DC supply) and ground must be considered in terms of the return current for the components. The general guidance is to not have signals routed on layers between the bias layer and the ground layer.

Incorrect layer assignment: there are signal layers between the bias layer and ground-current return path on ground layer. Bias line noise can be coupled to the signal layers.

Figure 7. Incorrect layer assignment: there are signal layers between the bias layer and ground-current return path on ground layer. Bias line noise can be coupled to the signal layers.

Better layer assignment: there are no signal layers between the bias and ground return layers.

Figure 8. Better layer assignment: there are no signal layers between the bias and ground return layers.

Power (Bias) Routing and Supply Decoupling

A common practice is to use a "star" configuration for the power-supply routes, if a component has several supply connections (Figure 9). A larger decoupling capacitor (tens of µFds) is mounted at the "root" of the star, and smaller capacitors at each of the star branches. The value of these latter capacitors depends on the operating frequency range of the RF IC, and their specific functionality (i.e., interstage vs. main supply decoupling). An example is shown below.

Component has several supply connections, the power-supply routes can be arranged in a star configuration

Figure 9. If a component has several supply connections, the power-supply routes can be arranged in a star configuration.

The "star" configuration avoids long ground return paths that would result if all the pins connected to the same bias net were connected in series. A long ground return path would cause a parasitic inductance that could lead to unintended feedback loops. The key consideration with supply decoupling is that the DC supply connections must be electrically defined as AC ground.

Selection of Decoupling or Bypass Capacitors

Real capacitors have limited effective frequency ranges due to their self-resonant frequency (SRF). The SRF is available from the manufacturer, but sometimes must be characterized by direct measurement. Above the SRF, the capacitor is inductive, and therefore will not perform the decoupling or bypass function. When broadband decoupling is required, standard practice is to use several capacitors of increasing size (capacitance), all connected in parallel. The smaller value capacitors normally have higher SRFs (for example, a 0.2pF value in a 0402 SMT package with an SRF = 14GHz), while the larger values have lower SRFs (for example, a 2pF value in the same package with an SRF = 4GHz). A typical arrangement is depicted in Table 2.

Table 2. Useful Frequency Ranges of Capacitors
Component Capacitance Package SRF Useful Frequency Range*
Ultra-High Range 20pF 0402 2.5GHz 800MHz to 2.5GHz
Very High Range 100pF 0402 800MHz 250MHz to 800MHz
High Range 1000pF 0402 250MHz 50MHz to 250MHz
Midrange 1µF 0402 60MHz 100kHz to 60MHz
Low Range 10µF 0603 600kHz 10kHz to 600kHz
*Low end of useful frequency range defined as less than 5Ω of capacitive reactance.

Bypass Capacitor Layout Considerations

Since the supply lines must be AC ground, it is important to minimize the parasitic inductance added to the AC ground return path. These parasitic inductances can be caused by layout or component orientation choices, such as the orientation of a decoupling capacitor's ground. There are two basic methods, shown in Figure 10 and Figure 11.

Figure 10. This configuration presents the smallest total footprint for the bypass capcitor and related vias.

Figure 10. This configuration presents the smallest total footprint for the bypass capacitor and related vias.

In this configuration, the vias connecting the VCC pad on the top layer to the inner power plane (layer) potentially impede the AC ground current return, forcing a longer return path with resulting higher parasitic inductance. Any AC current flowing into the VCC pin passes through the bypass capacitor to its ground side before returning on the inner ground layer. This configuration presents the smallest total footprint for the bypass capacitor and related vias.

Figure 11. This configuration requires more PCB area.

Figure 11. This configuration requires more PCB area.

In this alternate configuration, the AC ground return paths are not blocked by the power-plane vias. Generally this configuration requires somewhat more PCB area.

Grounding of Shunt-Connected Components

For shunt-connected (grounded) components (such as power-supply decoupling capacitors), the recommended practice is to use at least two grounding vias for each component (Figure 12). This reduces the effect of via parasitic inductance. Via ground "islands" can be used for groups of shunt-connected components.

Figure 12. Using at least two grounding vias for each components reduces the effect of via parasitic inductance.

Figure 12. Using at least two grounding vias for each components reduces the effect of via parasitic inductance.

IC Ground Plane ("Paddle")

Most ICs require a solid ground plane on the component layer (top or bottom of PCB) directly underneath the component. This ground plane will carry DC and RF return currents through the PCB to the assigned ground plane. The secondary function of this component "ground paddle" is to provide a thermal heatsink, so the paddle should include the maximum number of thru vias that are allowed by the PCB design rules. The example below shows a 5 × 5 array of via holes embedded in the central ground plane (on the component layer) directly under the RF IC (Figure 13). The maximum number of vias that can be accommodated by other layout considerations should be used. These vias are ideally thru-vias (i.e., penetrate all the way through the PCB), and must be plated. If possible, the vias should be filled with thermally conductive paste to enhance the heatsink (the paste is applied after via plating and prior to final board plating).

Figure 13. A 5 × 5 array of via holes embedded in the central ground plane directly under the RF IC.

Figure 13. A 5 × 5 array of via holes embedded in the central ground plane directly under the RF IC.



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315MHz/434MHz Low-Power, 3V/5V ASK/FSK Superheterodyne Receiver

MAX2693L

GPS/GNSS Low-Noise Amplifiers with Integrated LDO

MAX2385

CDMA + GPS LNA/Mixers

MAX2670

GPS/GNSS Front-End Amplifier

MAX2664

VHF/UHF Low-Noise Amplifiers

MAX2042A

SiGe, High-Linearity, 1600MHz to 3900MHz Upconversion/Downconversion Mixer with LO Buffer

MAX7044

300MHz to 450MHz High-Efficiency, Crystal-Based +13dBm ASK Transmitter

MAX19983A

Dual, SiGe, High-Linearity, High-Gain, 650MHz to 850MHz Downconversion Mixer with LO Buffer/Switch

MAX2361

Complete Dual-Band Quadrature Transmitters

MAX2654

1575MHz/1900MHz Variable-IP3 Low-Noise Amplifiers

MAX2822

2.4GHz 802.11b Zero-IF Transceiver with Integrated PA and Tx/Rx Switch

MAX2359

Quadruple-Mode PCS/Cellular/GPS LNA/Mixers

MAX77271

Multimode PA Step-Down Converter with Linear Bypass Mode

MAX2640

300MHz to 2500MHz SiGe Ultra-Low-Noise Amplifiers

MAX9982

825MHz to 915MHz, SiGe High-Linearity Active Mixer

MAX2136

ISDB-T/DVB-T Low-IF Tuner

MAX2421

900MHz Image-Reject Transceivers

MAX2010

500MHz to 1100MHz Adjustable RF Predistorter

MAX19790

250MHz to 4000MHz Dual, Analog Voltage Variable Attenuator

MAX2752

2.4GHz Monolithic Voltage-Controlled Oscillators

MAX2688

GPS/GNSS Low-Noise Amplifiers

MAX2351

Quadruple-Mode PCS/Cellular/GPS LNA/Mixers

MAX7030

Low-Cost, 315MHz and 433.92MHz ASK Transceiver with Fractional-N PLL

MAX9995

Dual, SiGe, High-Linearity, 1700MHz to 2700MHz Downconversion Mixer with LO Buffer/Switch

MAX2058

700MHz to 1200MHz High-Linearity, SPI-Controlled DVGA with Integrated Loopback Mixer

MAX2335

450MHz CDMA/OFDM LNA/Mixer

MAX2503

Complete Cellular Baseband-to-RF Transmitters with PA

MAX2321

Adjustable, High-Linearity, SiGe, Dual-Band, LNA/Mixer ICs

MAX2608

45MHz to 650MHz, Integrated IF VCOs with Differential Output

MAX2694

GPS/GNSS Low-Noise Amplifiers

MAX2680

400MHz to 2.5GHz, Low-Noise, SiGe Downconverter Mixers

MAX2471

10MHz to 500MHz, VCO Buffer Amplifiers with Differential Outputs

MAX2852

5GHz Receiver

MAX2557

Multiband, Multimode RF-to-Bits Femto-Basestation Radio Receiver

MAX2613

40MHz to 4GHz Linear Broadband Amplifiers

MAX2044

SiGe, High-Linearity, 2300MHz to 4000MHz Upconversion/Downconversion Mixer with LO Buffer

MAX2308

CDMA IF VGAs and I/Q Demodulators with VCO and Synthesizer

MAX2114

DBS Direct Downconverter

MAX2388

W-CDMA LNA/Mixer ICs

MAX2104

Direct-Conversion Tuner IC for Digital DBS Applications

MAX2206

RF Power Detectors in UCSP

MAX2667

GPS/GNSS Ultra-Low-Noise-Figure LNAs

MAX2264

2.7V, Single-Supply, Cellular-Band Linear Power Amplifiers

MAX2825

2.4GHz/5GHz, Single-Band and Dual-Band, 802.11g/a RF Transceiver ICs

MAX7060

280MHz to 450MHz Programmable ASK/FSK Transmitter

MAX9984

SiGe High-Linearity, 400MHz to 1000MHz Downconversion Mixer with LO Buffer/Switch

MAX2240

2.5GHz, +20dBm Power Amplifier IC in UCSP Package

MAX2701

1.8GHz to 2.5GHz, Direct-Downconversion Receivers

MAX2310

CDMA IF VGAs and I/Q Demodulators with VCO and Synthesizer

MAX1470

315MHz Low-Power, +3V Superheterodyne Receiver

MAX2597

Femto-Basestation Bits-to-RF Radio Transmitter

MAX19793

1500MHz to 6000MHz Dual Analog Voltage Variable Attenuator with On-Chip 10-Bit SPI-Controlled DAC

MAX2391

W-CDMA/W-TDD/TD-SCDMA Zero-IF Receivers

MAX4002

2.5GHz 45dB RF-Detecting Controllers

MAX7057

300MHz to 450MHz Frequency-Programmable ASK/FSK Transmitter

MAX2374

SiGe, Variable IIP3, Low-Noise Amplifier in UCSP Package

MAX2769B

Universal GPS Receiver

MAX2364

Complete Dual-Band Quadrature Transmitters

MAX2653

GSM900 and DCS1800/PCS1900 Dual-Band, Low-Noise Amplifiers

MAX2358

Quadruple-Mode PCS/Cellular/GPS LNA/Mixers

MAX7033

315MHz/433MHz ASK Superheterodyne Receiver with AGC Lock

MAX2141

Low-Power XM Satellite Radio Receiver

MAX2643

900MHz SiGe, High-Variable IP3, Low-Noise Amplifier

MAX1385

Dual RF LDMOS Bias Controllers with I²C/SPI Interface

MAX8805Z

600mA/650mA PWM Step-Down Converters in 2mm x 2mm WLP for WCDMA PA Power

MAX2420

900MHz Image-Reject Transceivers

MAX2506

Complete Cellular Baseband-to-RF Transmitters with PA

MAX19997

Dual, SiGe, High-Linearity, High-Gain, 2300MHz to 2700MHz Downconversion Mixer with LO Buffer/Switch

MAX8805

600mA/650mA PWM Step-Down Converters in 2mm x 2mm WLP for WCDMA PA Power

MAX2023

High-Dynamic-Range, Direct Up-/Downconversion 1500MHz to 2500MHz Quadrature Mod/Demod

MAX2410

Low-Cost RF Up/Downconverter with LNA and PA Driver

MAX2741

Integrated L1-Band GPS Receiver

MAX5860

Scalable High-Density Downstream Cable QAM Modulator

MAX2057

1300MHz to 2700MHz Variable-Gain Amplifier with Analog Gain Control

MAX2616

40MHz to 4GHz Linear Broadband Amplifiers

MAX9947

AISG Integrated Transceiver

MAX2047

High-Gain Vector Multipliers

MAX9933

2MHz to 1.6GHz 45dB RF-Detecting Controllers and RF Detector

MAX2117

Complete, Direct-Conversion Tuner for MMDS Applications

MAX2324

Adjustable, High-Linearity, SiGe, Dual-Band, LNA/Mixer ICs

MAX2209

RF Power Detector

MAX2683

3.5GHz Downconverter Mixers with Selectable LO Doubler

MAX2851

5GHz, 5-Channel MIMO Receiver

MAX2267

+2.7V, Single-Supply, Cellular-Band Linear Power Amplifiers

MAX2460

900MHz Image-Reject Transceivers

MAX2632

VHF-to-Microwave, +3V, General-Purpose Amplifiers

MAX2165

Single-Conversion DVB-H Tuner

MAX2235

+3.6V, 1W Autoramping Power Amplifier for 900MHz Applications

MAX2602

3.6V, 1W RF Power Transistors for 900MHz Applications

MAX2307

Low-Power, Cellular Upconverter-Driver

MAX2387

W-CDMA LNA/Mixer ICs

MAX2666

Tiny Low-Noise Amplifiers for HSPA/LTE

MAX2838

3.3GHz to 3.9GHz Wireless Broadband RF Transceiver

MAX3509

Upstream CATV Amplifier

MAX2656

1575MHz/1900MHz Variable-IP3 Low-Noise Amplifiers

MAX9987

+14dBm to +20dBm LO Buffers/Splitters with ±1dB Variation

MAX1473

315MHz/433MHz ASK Superheterodyne Receiver with Extended Dynamic Range

MAX19792

500MHz to 4000MHz Dual Analog Voltage Variable Attenuator with On-Chip 10-Bit SPI-Controlled DAC

MAX2390

W-CDMA/W-TDD/TD-SCDMA Zero-IF Receivers

MAX2754

1.2GHz VCO with Linear Modulation Input

MAX2830

2.4GHz to 2.5GHz 802.11g/b RF Transceiver with PA and Rx/Tx/Diversity Switch

MAX2363

Complete Dual-Band Quadrature Transmitters

MAX9990

+14dBm to +20dBm LO Buffers with ±1dB Variation

MAX2090

50MHz to 1000MHz Analog VGA with Threshold Alarm Circuit and Error Amplifier for Level Control

MAX7032

Low-Cost, Crystal-Based, Programmable, ASK/FSK Transceiver with Fractional-N PLL

MAX2642

900MHz SiGe, High-Variable IP3, Low-Noise Amplifier

MAX8805Y

600mA/650mA PWM Step-Down Converters in 2mm x 2mm WLP for WCDMA PA Power

MAX19996

SiGe, High-Linearity, High-Gain, 2000MHz to 3000MHz Downconversion Mixer with LO Buffer

MAX2022

High-Dynamic-Range, Direct Up/Downconversion 1500MHz to 3000MHz Quadrature Modulator/Demodulator

MAX2120

Complete, Direct-Conversion Tuner for DVB-S and Free-to-Air Applications

MAX2720

1.7GHz to 2.5GHz, Direct I/Q Modulator with VGA and PA Driver

MAX2511

Low-Voltage IF Transceiver with Limiter and RSSI

MAX2615

40MHz to 4GHz Linear Broadband Amplifiers

MAX2046

High-Gain Vector Multipliers

MAX2605

45MHz to 650MHz, Integrated IF VCOs with Differential Output

MAX2750AUA

2.4GHz Monolithic Voltage-Controlled Oscillator

MAX2870

23.5MHz to 6000MHz Fractional/Integer-N Synthesizer/VCO

MAX2116

Complete DBS Direct-Conversion Tuner ICs with Monolithic VCOs

MAX2323

Triple/Dual-Mode CDMA LNA/Mixers

MAX3541

Complete Single-Conversion Television Tuner

MAX2106

DBS Direct Downconverter

MAX2208

RF Power Detectors in UCSP

MAX2682

400MHz to 2.5GHz, Low-Noise, SiGe Downconverter Mixers

MAX2473

500MHz to 2500MHz, VCO Buffer Amplifiers

MAX2266

2.7V, Single-Supply, Cellular-Band Linear Power Amplifiers

MAX2136A

Global Automotive TV Tuner

MAX2181

FM Automotive Low-Noise Amplifier

MAX2463

900MHz Image-Reject Transceivers

MAX2631

VHF-to-Microwave, +3V, General-Purpose Amplifiers

MAX2171

Direct-Conversion to Low-IF Tuners for Digital Audio Broadcast

MAX3580

Direct-Conversion TV Tuner

MAX2063

Dual 50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Digital VGA

MAX2900

200mW Single-Chip Transmitter ICs for 868MHz/915MHz ISM Bands

MAX19997A

Dual, SiGe High-Linearity, High-Gain, 1800MHz to 2900MHz Downconversion Mixer with LO Buffer/Switch

MAX3524

Low-Noise, High-Linearity Broadband Amplifier

MAX19996A

SiGe, High-Linearity, 2000MHz to 3900MHz Downconversion Mixer with LO Buffer

MAX3514

Upstream CATV Amplifiers

MAX2669

GPS/GNSS Ultra-Low-Noise-Figure LNAs

MAX2837

2.3GHz to 2.7GHz Wireless Broadband RF Transceiver

MAX2551

Band II and V WCDMA Femtocell Transceiver with GSM Monitoring

MAX2366

Complete Dual-Band Quadrature Transmitters

MAX2655

1575MHz/1900MHz Variable-IP3 Low-Noise Amplifiers

MAX2827

2.4GHz/5GHz, Single-Band and Dual-Band, 802.11g/a RF Transceiver ICs

MAX9986

SiGe High-Linearity, 815MHz to 995MHz Downconversion Mixer with LO Buffer/Switch

MAX2645

3.4GHz to 3.8GHz SiGe Low-Noise Amplifier/PA Predriver

MAX2242

2.4GHz to 2.5GHz Linear Power Amplifier

MAX2181A

FM Automotive Low-Noise Amplifier

MAX2162S

ISDB-T 1- and 3-Segment Low-IF Tuners

MAX19999

Dual, SiGe High-Linearity, 3000MHz to 4000MHz Downconversion Mixer with LO Buffer

MAX2312

CDMA IF VGAs and I/Q Demodulators with VCO and Synthesizer

MAX1472

300MHz-to-450MHz Low-Power, Crystal-Based ASK Transmitter

MAX2161S

ISDB-T 1- and 3-Segment Low-IF Tuners

MAX2599

Femto Basestation Bits-to-RF Radio Transmitter

MAX2406

Low-Cost Downconverter with Low-Noise Amplifier

MAX2393

W-CDMA/W-TDD/TD-SCDMA Zero-IF Receivers

MAX2671

400MHz to 2.5GHz Upconverters

MAX2009

1200MHz to 2500MHz Adjustable RF Predistorter

MAX2585

Advanced Multimode Complete RF-to-Baseband Receiver

MAX2661

400MHz to 2.5GHz Upconverters

MAX2160

ISDB-T Single-Segment Low-IF Tuners

MAX2422

900MHz Image-Reject Transceivers

MAX2326

Adjustable, High-Linearity, SiGe, Dual-Band, LNA/Mixer ICs

MAX19985

Dual, SiGe, High-Linearity, High-Gain, 700MHz to 1000MHz Downconversion Mixer with LO Buffer/Switch

MAX2695

WLAN/WiMAX Low-Noise Amplifiers

MAX2685

Low-Cost, 900MHz, Low-Noise Amplifier and Downconverter Mixer

MAX7058

315MHz/390MHz Dual-Frequency ASK Transmitter

MAX2584A

Complete RF-to-Baseband Receiver

MAX2634

315MHz/433MHz Low-Noise Amplifier for Automotive RKE

MAX2065

50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Analog/Digital VGA

MAX5862

High-Density Downstream Cable QAM Modulator

MAX2059

1700MHz to 2200MHz, High-Linearity, SPI-Controlled DVGA with Integrated Loopback Mixer

MAX2510

Low-Voltage IF Transceiver with Limiter RSSI and Quadrature Modulator

MAX2500

Complete Cellular Baseband-to-RF Transmitters with PA

MAX3540

Complete Single-Conversion Television Tuner

MAX2105

Direct-Conversion Tuner ICs for Digital DBS Applications

MAX2269

+2.7V, Single-Supply, Cellular-Band Linear Power Amplifiers

MAX9989

+14dBm to +20dBm LO Buffers with ±1dB Variation

MAX2548

Quad-Band TDD-WCDMA RF-to-Bits Radio Receiver

MAX12005

Satellite IF Switch

MAX2170

Direct-Conversion to Low-IF Tuners for Digital Audio Broadcast

MAX2620

10MHz to 1050MHz Integrated RF Oscillator with Buffered Outputs

MAX2245

2.5GHz, 22dBm/20dBm Power Amplifiers with Analog Closed-Loop Power Control

MAX2686L

GPS/GNSS Low-Noise Amplifiers with Integrated LDO

MAX2062

Dual 50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Analog/Digital VGA

MAX2395

WCDMA Quasi-Direct Modulator with VGA and PA Driver

MAX2309

CDMA IF VGAs and I/Q Demodulators with VCO and Synthesizer

MAX2389

W-CDMA LNA/Mixer ICs

MAX2674

GPS/GNSS LNAs with Antenna Switch and Bias

MAX2203

RMS Power Detector

MAX2668

Tiny Low-Noise Amplifiers for HSPA/LTE

MAX2832

2.4GHz to 2.5GHz, 802.11g RF Transceivers with Integrated PA

MAX3503

Upstream CATV Amplifier

MAX2550

Band I, V, and VIII WCDMA Femtocell Transceiver with GSM Monitoring

MAX2365

Complete Dual-Band Quadrature Transmitters

MAX2658

GPS/GNSS Low-Noise Amplifiers

MAX2826

2.4GHz/5GHz, Single-Band and Dual-Band, 802.11g/a RF Transceiver ICs

MAX12000

1575MHz GPS Front-End Amplifier

MAX2644

2.4GHz SiGe, High IP3 Low-Noise Amplifier

MAX1386

Dual RF LDMOS Bias Controllers with I²C/SPI Interface

MAX2820A

2.4GHz 802.11b Zero-IF Transceivers

MAX19998

SiGe, High-Linearity, 2300MHz to 4000MHz Downconversion Mixer with LO Buffer

MAX2014

50MHz to 1000MHz, 75dB Logarithmic Detector/Controller

MAX2598

Quad-Band TDD-WCDMA Bits-to-RF Radio Transmitter

MAX19794

10MHz to 500MHz Dual Analog Voltage Variable Attenuator with On-Chip 10-Bit SPI-Controlled DAC

MAX2500B

Complete Cellular Baseband-to-RF Transmitter with PA

MAX19985A

Dual, SiGe, High-Linearity, High-Gain, 700MHz to 1000MHz Downconversion Mixer with LO Buffer/Switch

MAX2392

W-CDMA/W-TDD/TD-SCDMA Zero-IF Receivers

MAX2660

400MHz to 2.5GHz Upconverters

MAX2650

DC-to-Microwave, +5V Low-Noise Amplifier

MAX2092

700MHz to 2700MHz Analog VGA with Threshold Alarm Circuit and Error Amplifier for Level Control

MAX7034

315MHz/434MHz ASK Superheterodyne Receiver

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