MAX20049

• 已安装MAX20049ATEA/VY+(提供其他IC选项)：
  • V_OUT1 = 3.8V
  • V_OUT2 = 1.8V
  • V_OUT3 = 3.3V
  • V_OUT4 = 1.2V
• 提供PGOOD PCB焊盘，用于电压监测
• 使用电阻R4和R5可配置SUP1和SUP2
• 使用跳线JU1可选择LDOIN3输入
• 经过验证的PCB布局
• 完全装配并经过测试

MAX20049评估套件(EV kit)为完全装配并经过测试的应用电路，用于评估MAX20049微型、双通道、降压型转换器，器件带有双LDO。评估套件配置为利用单路输入电压源提供四路输出电压。两个降压型转换器(OUT1、OUT2)和LDO3支持高输入电压源(最大17V)。IC也具有高PSRR和低噪声LDO4。每个降压型转换器可提供高达500mA负载电流，LDO3可提供100mA，LDO4可提供400mA。

应用

• 摄像机模块 — 全景、后、前摄像机
• 负载点

• MAX96793-based MIPI CSI-2 to GMSL3/GMSL2 serializer
• 12Gbps GMSL3 forward link, backward compatible with 6Gbps / 3Gbps GMSL2
• Single MIPI CSI-2 input with support for up to 4 D-PHY lanes at 2.5Gbps per lane
• Single GMSL output over 50Ω coax
• 187.5Mbps bidirectional control channel with I²C and GPIO support
• Compact camera-side EVK form factor based on the AD-GMSL717MIPI-EVK concept

The AD-GMSL793MIPI-EVK is a compact evaluation board that bridges a MIPI CSI-2 camera interface to a single GMSL3 or GMSL2 serial link using the MAX96793 serializer. It is the next-generation counterpart to the AD-GMSL717MIPI-EVK concept, extending the serializer side from GMSL2 to GMSL3 at up to 12Gbps forward-link rate, while retaining backward compatibility with GMSL2 at 6Gbps or 3Gbps for broader ecosystem support.

The board is intended for rapid evaluation of MIPI camera modules in systems that use GMSL transport to connect remote cameras to centralized processing platforms. Like the AD-GMSL717MIPI-EVK, the board is designed around a compact mechanical format for easy integration into robotics, machine vision, automotive prototyping, and embedded imaging systems.

When paired with a compatible deserializer platform such as the AD-GMSL792MIPI-EVK board, the AD-GMSL793MIPI-EVK can be used as the serializer-side endpoint in a complete MIPI-to-GMSL3/GMSL2-to-MIPI evaluation chain.

APPLICATIONS

• Advanced driver assistance systems (ADAS) camera prototyping
• Embedded vision and robotics
• Industrial automation and machine vision
• High-resolution remote cameras and distributed sensing nodes
• Development of next-generation GMSL3 camera links with fallback to GMSL2