LTM3360B

预发布

5VIN, 33A High-Density Step-Down DC-to-DC μModule Regulator with I2C and Integrated Capacitors

产品技术资料帮助

ADI公司所提供的资料均视为准确、可靠。但本公司不为用户在应用过程中侵犯任何专利权或第三方权利承担任何责任。技术指标的修改不再另行通知。本公司既没有含蓄的允许,也不允许借用ADI公司的专利或专利权的名义。本文出现的商标和注册商标所有权分别属于相应的公司。

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概述

  • Highest Output Current to Total Solution Footprint (1A/mm2), Integrates all CINs, COUTs, and Inductors
  • Fast Transient Response
  • VIN Range: 2.9V to 5.5V
  • VOUT Range: 0.3V to 1V
  • Remote Differential Output Sense Pins
  • VOUT + DC accuracy: ±1%
  • I2C Serial Interface—Telemetry Readback Includesm VOUT, IOUT, VIN, and Die Temperature
  • Analog IMON pin for Output Current Monitoring
  • Fixed Clock Frequency of 5MHz, External SYNC from 4.5MHz to 5.5MHz
  • Parallel Operation: Multiphase up to 12 phases and Stackable to > 1000A
  • Advanced Thermally Enhanced 160-Lead, 6.55mm × 5mm × 3.31mm, BGA Package

The LTM®3360B is a high-current, high-density, lowvoltage buck power μModule® (micromodule) regulator optimized for high-output current applications. The 2.9V to 5.5V input voltage range accommodates an intermediate bus voltage (IBV) of 5V ±10% or 3.3V ±10%. The current output capability of 33A can be paralleled to provide >1000A in a multiphase, stacked from a main-tosubordinate device configuration. Regulated output voltages down to 0.3V are achieved using a current mode architecture, which is capable of small on-time at very high frequencies. Select an appropriate feedback resistor divider to configure the output voltage. The 0.3V (default) feedback voltage is 8-bit adjustable through an I2C for margining or dynamic voltage scaling. Keep the feedback voltage close to 0.3V for the best phase-margin voltage regulation loop. The high fixed clock frequency of 5MHz which is double the switching frequency of 2.5MHz each phase permits integration of input and output capacitors and a power inductor, resulting in the highest density of output current-to-board footprint achievable in the industry today with minimal external components required. The LTM3360B is offered in a ball grid array (BGA) package, 0.4mm ball pitch, with excellent thermal performance and integrated inductors, input, and output capacitors. The LTM3360B is lead(Pb)-free and RoHS-compliant.

APPLICATIONS

  • Data Centers xPU Core, Application-Specific Integrated Circuit (ASIC), Field-Programmable Gate Array (FPGA) Supplies
  • Optical Modules
  • Industrial and Communications
  • Distributed DC Point-of-Load (POL) Power Systems

LTM3360B
5VIN, 33A High-Density Step-Down DC-to-DC μModule Regulator with I2C and Integrated Capacitors
LTM3360B Typical Application LTM3360B Efficiency LTM3360B Simplified Block Diagram LTM3360B Pin Configuration LTM3360B Chip Illustration
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