概览
优势和特点
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产品详情
The ADSP-BF533 provides a high performance, power-efficient processor choice for today's most demanding convergent signal processing applications. The high performance 16-bit/32-bit Blackfin® embedded processor core, the flexible cache architecture, the enhanced DMA subsystem, and the dynamic power management (DPM) functionality allow system designers a flexible platform to address a wide range of applications including consumer, communications, automotive, and industrial/instrumentation.
Architectural Features- High performance 16-bit/32-bit embedded processor core
- 10-stage RISC MCU/DSP pipeline with mixed 16-bit/32-bit ISA for optimal code density
- Full SIMD architecture, including instructions for accelerated video and image processing
- Memory management unit (MMU) supporting full memory protection for an isolated and secure environment
- Up to 148 kB of on-chip SRAM
- Glueless video capture and display port
- Two dual-channel, full-duplex, synchronous serial ports supporting eight stereo I2S channels
- 12 DMA channels supporting one- and two-dimensional data transfers
- Memory controller providing glueless connection to multiple banks of external SDRAM, SRAM, Flash, or ROM
- 160-ball mini-BGA, 169-ball PBGA packages
- Industrial temperature ranges (40°C to 85°C) and commercial temperature ranges (0°C to 70°C) available
产品生命周期
量产
该产品系列中至少有一个型号已量产并可供采购。该产品适合用于新设计，但也可能有更新的替代产品。
评估套件 (5)
文档
应用笔记 (74)
用户手册 (8)
软件使用手册 (11)
仿真器使用手册 (6)
软件代码及系统需求
Middleware
Lightweight TCP/IP (lwIP) Stack
Software Development Tools
CrossCore® Embedded Studio
Software Modules
MPEG-4 SP/ASP 解码器(Blackfin)
工具及仿真模型
软件开发工具包（SDK）
The Blackfin® SDK contains free applications software with source code and utilities information and tools that allow you to develop Blackfin processor based applications.
BSDL模型
Surface Mount Assembly Recommendations for Plastic Ball Grid Array (PBGA) Packages
参考资料
客户案例 (12)
技术文章 (9)
设计资源
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PCN-PDN信息
样片申请及购买
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