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  2. Processors and Microcontrollers
  3. Processors and DSP
  4. Blackfin Embedded Processors
  5. ADSP-BF537


Overview

Features and Benefits

  • Up to 600MHz High Performance Blackfin processor
  • 132KB of on chip full speed SRAM
  • 10-stage RISC MCU/DSP pipeline with mixed 16-/32-bit ISA for optimal code density
  • Powerful and flexible cache architecture suitable for soft real-time control tasks and industry-standard operating systems, plus hard real-time signal processing
  • Full SIMD architecture, including instructions for accelerated video and image processing
  • Embedded IEEE 802.3 Compliant 10/100 Ethernet MAC with buffered oscillator output to a separate PHY
  • Controller Area Network (CAN) 2.0B interface
  • Two-Wire Interface Controller
  • Glueless Video Capture/Display Port

Product Details

The Blackfin® Processor family has been expanded to address the ever-increasing need for pervasive embedded network connectivity with two new family members. This connectivity is powerful when utilized in conjunction with the high performance 16-/32-bit Blackfin embedded processor core, the flexible cache architecture, the enhanced DMA subsystem, and the Dynamic Power Management (DPM) functionality. System designers can take advantage of the combined control and signal processing capabilities of the processor core across a wide range of end applications through the scalability of the pin and code compatibility of these new family members.

The ADSP-BF536 and ADSP-BF537 are a functional extension of the popular ADSP-BF531 / ADSP-BF532 / ADSP-BF533 processors, and they are ideally suited for a variety of networked applications. The ADSP-BF537 is the higher performance series member, with more embedded memory enabling higher throughput needs for embedded applications such as video security/surveillance and industrial-environment-based distributed control/factory automation applications. The ADSP-BF536 offers exceptional performance and is designed for low cost connected devices such as remote monitoring devices, VoIP, point-of-sale terminals, and biometrics/security applications. Both devices are ideally suited for a broad range of industrial, instrumentation, medical, and consumer appliance applications— allowing for scalability based upon the required network bandwidth and mix of control, plus signal processing needed in the end product.

Product Lifecycle icon-recommended Production

At least one model within this product family is in production and available for purchase. The product is appropriate for new designs but newer alternatives may exist.

Evaluation Kits (5)

Documentation & Resources

  • View All (101)
  • Data Sheets (1)
  • Application Notes (56)
  • User Guides (6)
  • Processor Manuals (3)
  • Software Manuals (11)
  • Emulator Manuals (3)
  • Integrated Circuit Anomalies (1)
  • Product Highlight (4)
  • Product Selection Guide (1)
  • Circuit Note (3)
  • Technical Articles (12)
  • Application Notes
    Software Manuals
    Technical Articles

    Software & Systems Requirements

    Software & Tools Anomalies

    Middleware

    Software Development Tools

    Tools & Simulations

    Software Development Kit

    Blackfin Software Development Kit (SDK) Downloads

    The Blackfin® SDK contains free applications software with source code and utilities information and tools that allow you to develop Blackfin processor based applications.

    Design Resources

    ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well.  "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.

    Part Number Material Declaration Reliability Data Pin/Package Drawing CAD Symbols, Footprints & 3D Models
    ADSP-BF537BBCZ-5A Material Declaration Reliability Data 182-Ball CSPBGA (12mm x 12mm x 1.7mm)
    ADSP-BF537BBCZ-5AV Material Declaration Reliability Data 182-Ball CSPBGA (12mm x 12mm x 1.7mm)
    ADSP-BF537BBCZ-5B Material Declaration Reliability Data 208-Ball CSPBGA (17mm x 17mm x 1.75mm)
    ADSP-BF537BBCZ-5BV Material Declaration Reliability Data 208-Ball CSPBGA (17mm x 17mm x 1.75mm)
    ADSP-BF537KBCZ-6AV Material Declaration Reliability Data 182-Ball CSPBGA (12mm x 12mm x 1.7mm)
    ADSP-BF537KBCZ-6BV Material Declaration Reliability Data 208-Ball CSPBGA (17mm x 17mm x 1.75mm)
    Wafer Fabrication Data

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    Pricing displayed is based on 1-piece. The USA list pricing shown is for budgetary use only, shown in United States dollars (FOB USA per unit), and is subject to change. International prices may vary due to local duties, taxes, fees and exchange rates.