ADG5436
Info : RECOMMENDED FOR NEW DESIGNS
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ADG5436

High Voltage Latch-Up Proof, Dual SPDT Switches

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Info : RECOMMENDED FOR NEW DESIGNS tooltip
Info : RECOMMENDED FOR NEW DESIGNS tooltip
Part Details
Part Models 3
1ku List Price Starting From $2.66
Features
  • Latch-up proof
  • 8 kV HBM ESD rating
  • Low on resistance (<10 Ω)
  • ±9 V to ±22 V dual-supply operation
  • 9 V to 40 V single-supply operation
  • 48 V supply maximum ratings
  • Fully specified at ±15 V, ±20 V, +12 V, and +36 V
  • VSS to VDD analog signal range
Additional Details
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The ADG5436 is a monolithic CMOS device containing two independently selectable single-pole/double-throw (SPDT) switches. An EN input on the LFCSP package enables or disables the device. When disabled, all channels switch off. Each switch conducts equally well in both directions when on and has an input signal range that extends to the supplies. In the off condition, signal levels up to the supplies are blocked. Both switches exhibit break-before-make switching action for use in multiplexer applications.

The on-resistance profile is very flat over the full analog input range, ensuring excellent linearity and low distortion when switching audio signals.

Product Highlights

  1. Trench isolation guards against latch-up. A dielectric trench separates the P and N channel transistors thereby preventing latch-up even under severe overvoltage conditions.
  2. Low RON.
  3. Dual-supply operation. For applications where the analog signal is bipolar, the ADG5436 can be operated from dual supplies up to ±22 V.
  4. Single-supply operation. For applications where the analog signal is unipolar, the ADG5436 can be operated from a single-rail power supply up to 40 V.
  5. 3 V logic compatible digital inputs: VINH = 2.0 V, VINL = 0.8 V.
  6. No VL logic power supply required.

Applications

  • Relay replacement
  • Automatic test equipment Data acquisition
  • Instrumentation
  • Avionics Audio and video switching
  • Communication systems
Part Models 3
1ku List Price Starting From $2.66

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADG5436BCPZ-REEL7
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ADG5436BRUZ
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ADG5436BRUZ-REEL7
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Part Models

Product Lifecycle

PCN

Jul 17, 2023

- 23_0095

Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages

Aug 12, 2022

- 21_0271

Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages

Sep 26, 2017

- 17_0145

ADG5412/ADG5413, ADG5404, and ADG5436 Datasheet Specification Change

ADG5436BCPZ-REEL7

PRODUCTION

ADG5436BRUZ

PRODUCTION

ADG5436BRUZ-REEL7

PRODUCTION

Oct 18, 2016

- 16_0036

Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products

Sep 29, 2014

- 13_0248

Assembly and Test Transfer of Select 4x4 and 5x5mm LFCSP Products using 8900 Die Attach to STATS ChipPAC China

Nov 12, 2013

- 13_0230

Assembly and Test Transfer of Select 3.5x3.5, 4x3, 4x4, and 5x5mm LFCSP Products to STATS ChipPAC China

Jun 7, 2011

- 11_0115

ADG5412/ADG5413/ADG5436/ADG5404/ADG5408/ADG5409/ADG5433/ADG5434 N-plug layer Edits

ADG5436BCPZ-REEL7

PRODUCTION

ADG5436BRUZ

PRODUCTION

ADG5436BRUZ-REEL7

PRODUCTION

Apr 5, 2021

- 21_0035

Amkor Philippines as an Alternate Site for TSSOP_4.4

Jan 20, 2012

- 11_0218

Halogen Free Material Change for Certain TSSOP Products at Carsem

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Jul 17, 2023

- 23_0095

arrow down

Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages

Aug 12, 2022

- 21_0271

arrow down

Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages

Sep 26, 2017

- 17_0145

arrow down

ADG5412/ADG5413, ADG5404, and ADG5436 Datasheet Specification Change

ADG5436BCPZ-REEL7

PRODUCTION

ADG5436BRUZ

PRODUCTION

ADG5436BRUZ-REEL7

PRODUCTION

Oct 18, 2016

- 16_0036

arrow down

Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products

Sep 29, 2014

- 13_0248

arrow down

Assembly and Test Transfer of Select 4x4 and 5x5mm LFCSP Products using 8900 Die Attach to STATS ChipPAC China

Nov 12, 2013

- 13_0230

arrow down

Assembly and Test Transfer of Select 3.5x3.5, 4x3, 4x4, and 5x5mm LFCSP Products to STATS ChipPAC China

Jun 7, 2011

- 11_0115

arrow down

ADG5412/ADG5413/ADG5436/ADG5404/ADG5408/ADG5409/ADG5433/ADG5434 N-plug layer Edits

ADG5436BCPZ-REEL7

PRODUCTION

ADG5436BRUZ

PRODUCTION

ADG5436BRUZ-REEL7

PRODUCTION

Apr 5, 2021

- 21_0035

arrow down

Amkor Philippines as an Alternate Site for TSSOP_4.4

Jan 20, 2012

- 11_0218

arrow down

Halogen Free Material Change for Certain TSSOP Products at Carsem

Software & Part Ecosystem

Software & Part Ecosystem

Evaluation Kit

Evaluation Kits 2

reference details image

EVAL-16LFCSP

Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio

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EVAL-16LFCSP

Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio

Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio

Features and Benefits

  • 16-lead, 4 mm × 4 mm LFCSP evaluation board
  • Easily changeable clamshell socket for the main device
  • Gold pin connectors for the addition of passive components
  • SMB connectors for the input and output of signals
  • Additional space on board for prototyping

Product Detail

The EVAL-16LFCSPEBZ enables easy evaluation of the 16-lead lead frame chip scale package (LFCSP) devices in the Switches and Multiplexers Portfolio that are purchased separately. The EVAL-16LFCSPEBZ is supplied with a clamshell socket to secure a 16-lead LFCSP device to the evaluation board without the need for soldering. In addition, there are three sets of gold pin connectors in each trace, for board flexibility and reusability for multiple evaluations.

Figure 1 in the user guide shows the EVAL-16LFCSPEBZ. A 16-lead LFCSP device can be inserted into the socket in the center of the evaluation board. Each device pin has a corresponding three-pin header link, from K1 to K16. This can either be connected to an external signal source by removing the corresponding link or use the link to choose between VDD or GND. A wire screw terminal, J5, supplies the VDD and GND. The Subminiature Version B (SMB) connectors on the EVAL-16LFCSPEBZ allow additional external signals to be supplied to the device. In addition, there is a perfboard space and two 16-lead LFCSP pads (3 mm x 3 mm and 2.1 mm x 2.1 mm) available on top of the EVAL-16LFCSPEBZ for prototyping.

The full specifications of the device under test (DUT) are available in the corresponding product data sheet, which must be consulted with the EVAL-16LFCSPEBZ user guide when using the EVAL-16LFCSPEBZ.

reference details image

EVAL-16TSSOP

Evaluation Board for 16 lead TSSOP Devices in the Switch/Mux Portfolio

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EVAL-16TSSOP

Evaluation Board for 16 lead TSSOP Devices in the Switch/Mux Portfolio

Evaluation Board for 16 lead TSSOP Devices in the Switch/Mux Portfolio

Features and Benefits

  • 16 lead TSSOP evaluation board
  • Clamp to allow the main device to be changed easily
  • Gold pin connectors to allow the addition of passive components
  • SMB connectors for the input/output of signals
  • Additional space on board to allow for prototyping

Product Detail

The EVAL-16TSSOPEBZ evaluation board evaluates 16-lead TSSOP devices in the Switches and Multiplexers Portfolio that are purchased separately. A clamp is supplied with the EVAL-16TSSOPEBZ to secure a 16-lead TSSOP device to the evaluation board without the need for soldering, making the board reusable for multiple devices.

A 16-lead TSSOP device can be clamped or soldered to the center of the evaluation board. Each pin of the device has a corresponding link from K1 to K16 that can be set to either VDD or GND. A wire screw terminal supplies VDD and GND. SMB connectors on the board allow additional external signals to be supplied to the device. In addition, there is space available at the top of the board for prototyping.

Full specifications of the device under test (DUT) are available in the corresponding product data sheet, which should be consulted in conjunction with this user guide when using the evaluation board.

Tools & Simulations

Tools & Simulations 2

LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.

Reference Designs

Reference Designs 1

Figure 1. CN0582 Simplified System Block Diagram

USB 3.0 Quad-Channel IEPE Vibration Sensor Measurement System

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CN0582

USB 3.0 Quad-Channel IEPE Vibration Sensor Measurement System

CN0582

Circuits from the lab

tooltip Info:Circuits from the lab
USB 3.0 Quad-Channel IEPE Vibration Sensor Measurement System

Features and Benefits

  • 4-Channels of Analog Input
  • IEPE, 4-20mA Sensor Compatible
  • Frequency Generator Output
View Detailed Reference Design external link

Design & Integration Tools

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Videos

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Mar 07, 2023

01:00

CN0582: USB 3.0 Quad-Channel IEPE Vibration Sensor Measurement System​

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