ADSP-BF701
Low Power 200MHz Blackfin+ Embedded Processor with 128KByte L2 SRAM & DDR2/LPDDR Interface
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Overview
Features and Benefits
- Blackfin+ core with up to 200 MHz performance
- Dual 16-bit or single 32-bit MAC support per cycle
- 16-bit complex MAC and many other instruction set enhancements
- Instruction set compatible with previous Blackfin product
- On-Chip Memory
- 136KB L1 SRAM with multi-parity-bit protection (64KB instruction, 64KB data, 8KB scratchpad)
- 128KByte on-chip L2 SRAM with ECC protection
- 512KByte On-chip L2 ROM
- L3 interface providing 16-bit interface to DDR2 or LPDDR SDRAM devices (up to 200 MHz)
- Key Peripherals include
- USB2.0 HS OTG
- 2x CAN2.0B
- ePPI Video I/O
- 2x SPORTs (w/I2S)
- 2xQuad-SPI / 1xDual-SPI (w/ Host mode option)
- I2C
- 2xUART
- SD/SDIO/MMC (8-bit)
- 4-ch 12-bit 1MSPS ADC
- Security and one-time-programmable memory
- Crypto hardware accelerators for fast secure boot/IP protection
- memDMA encryption/decryption for fast run-time security
- Low-cost packaging
- 184-Ball CSP_BGA package (12 mm × 12mm × 0.8mm pitch), RoHS compliant
- Low system power with < 53 mW at 200 MHz at 25°C TJUNCTION
Product Details
This device is a member of the ADSP-BF70x Blackfin Digital Signal Processor (DSP) product family. The new Blackfin+ processor core combines dual-MAC 16-bit, 32-bit MAC and 16-bit complex MAC in to a state-of-the-art signal processing engine. It also combines advantages of a clean, orthogonal RISC-like microprocessor instruction set, and single-instruction, multiple-data (SIMD) multimedia capabilities within a single instruction-set architecture. Further new enhancements to the Blackfin+ core add cache enhancements, branch prediction and other instruction set improvements—all while maintaining instruction set compatibility to previous Blackfin products.The processor offers performance up to 200 MHz, as well as lowest power consumption at <53mW. Produced with a low-power and low-voltage design methodology, they provide world-class power management and performance.
By integrating a rich set of industry-leading system peripherals , large on-chip memory & a high speed external memory interface, this Blackfin processor is the platform of choice for next-generation applications that require RISC-like programmability, multimedia support, and leading-edge signal processing in one integrated package. These applications span a wide array of markets, from automotive systems to embedded industrial, instrumentation, video/image analysis, biometric and control applications.
Product Lifecycle
Production
At least one model within this product family is in production and available for purchase. The product is appropriate for new designs but newer alternatives may exist.
Evaluation Kits (3)
Documentation & Resources
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EE-394: ADSP-BF70x Blackfin+™ Processor Optimization Techniques (Rev. 1)12/16/2016
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• EE-394: Associated Code
ZIP -
EE-395: Interfacing the AD7689 ADC to ADSP-BF70x Blackfin+™ Processors (Rev. 1)12/15/2016
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• EE-395: Code Example
ZIP -
EE-386: Using the Security Packet Engine to Protect Data (Rev. 1)10/20/2016
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• EE-386: Associated Code
ZIP -
EE-378: Processor Comparison Guide (ADSP-BF60x/BF70x vs ADSP-SC58x/2158x) (Rev. 1)1/19/2016
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EE-376: ADSP-BF70x Blackfin+ Processor System Optimization Techniques1/7/2016
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• EE-376: Associated ZIP File
ZIP -
EE-385: Implementing the RSA Cryptosystem with the Public Key Accelerator12/18/2015
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• EE-385: Associated Code
ZIP -
EE-373: Tuning the Dynamic Branch Predictor for ADSP-BF70x Blackfin™ Processors (Rev. 1)7/14/2015
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• EE-373: Associated File
ZIP -
EE-374: Implementing Second-Stage Loaders on ADSP-BF707 Blackfin® Processors (Rev. 1)6/15/2015
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• EE-374: Associated File
ZIP -
EE-360: Utilizing the Trigger Routing Unit for System Level Synchronization (Rev. 1)2/14/2015
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• EE-360: Code Example
ZIP -
EE-368: ADSP-BF70x Blackfin+ Processors Cryptographic Algorithm Validation (Rev. 1)12/11/2014
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• EE-368: Code Example
ZIP -
EE-366: Secure Booting Guide for Blackfin+® and SHARC+® Processors (Rev. 2)11/26/2014
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• EE-366: Code Example
ZIP -
EE-261: Understanding Jitter Requirements of PLL-Based Processors (Rev. 1)2/15/2005
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Blackfin ADSP-BF70x Series of DSP Processors10/15/2014
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ADSP-BF70x-Series2/14/2015
Software & Systems Requirements
Middleware
Operating Systems and Middleware
Analog Devices, in collaboration with several Alliance partners, provides the following operating system and middleware offerings to enable a user-friendly programming environment for applications developed using the Blackfin® and SHARC® processor families. These real-time kernels and services software seamlessly integrate with CrossCore® Embedded Studio.
Software Development Tools
CrossCore® Embedded Studio
CCES is a world-class integrated development environment (IDE) for the ADI Blackfin®, SHARC® and Arm® processor families.
Tools & Simulations
BSDL Model File
Design Resources
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
| Part Number | Material Declaration | Reliability Data | Pin/Package Drawing | CAD Symbols, Footprints & 3D Models |
|---|---|---|---|---|
| ADSP-BF701BBCZ-2 | Material Declaration | Reliability Data | 184-Ball CSPBGA (12mm x 12mm x 1.7mm) | |
| ADSP-BF701KBCZ-1 | Material Declaration | Reliability Data | 184-Ball CSPBGA (12mm x 12mm x 1.7mm) | |
| ADSP-BF701KBCZ-2 | Material Declaration | Reliability Data | 184-Ball CSPBGA (12mm x 12mm x 1.7mm) | |
| Wafer Fabrication Data |
PCN-PDN Information
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Sample & Buy
Ordering FAQs
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Buy Now Pricing
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List Pricing
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Lead Times
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Sampling
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Evaluation Boards
Pricing displayed is based on 1-piece.
Up to two boards can be purchased through Analog.com. To order more than two, please purchase through one of our listed distributors.
Pricing displayed is based on 1-piece. The USA list pricing shown is for budgetary use only, shown in United States dollars (FOB USA per unit), and is subject to change. International prices may vary due to local duties, taxes, fees and exchange rates.