Overview
Features and Benefits
- Integrated fully differential ADC driver with signal scaling
- Wide input common-mode voltage range
- High common-mode rejection
- Single-ended to differential conversion
- Pin selectable input range with over-range
- Input Ranges with 4.096V REFBUF: ±10V, ±5V, ±4.096V, ±2.5V and ±1.5V
- Gain/Attenuation Options: 0.37, 0.73, 0.87, 1.38 and 2.25
- Critical passive components
- 0.005% precision matched resistor array for FDA
- 9 mm × 9 mm, 0.8 mm pitch, 100-ball BGA package
- 2.5× footprint reduction versus discrete solution
- Low power, dynamic power scaling, power-down mode
- 143 mW typical at 15 MSPS
- Throughput: 15 MSPS, no pipeline delay
- INL error: ±7.5 ppm typical, ±15 ppm maximum
- (Gain = 0.73, gain = 0.87, gain = 1.38, gain = 2.25)
- SINAD: 90 dB typical at 1 kHz (gain = 0.37 and gain = 0.73)
- THD: −121 dB at 1 kHz, −112 dB at 100 kHz (gain = 0.73)
- Gain error: ±0.005%FS typical
- Gain error drift: ±0.11 ppm/°C typical
- On-board reference buffer with VCMO generation
- Serial LVDS interface
- Wide operating temperature range: −40°C to +85°C
Product Details
The ADAQ23876 is a precision, high speed, μModule® data acquisition solution that reduces the development cycle of a precision measurement systems by transferring the design burden of component selection, optimization, and layout from the designer to the device.
Using System-in-Package (SIP) technology, the ADAQ23876 reduces end system component count by combining multiple common signal processing and conditioning blocks in a single device, including a low noise, fully differential ADC driver (FDA), a stable reference buffer, and a high speed, 16-bit, 15 MSPS successive approximation register (SAR) ADC.
The ADAQ23876 also incorporates the critical passive components with superior matching and drift characteristics using Analog Devices, Inc., iPassive® technology to minimize temperature dependent error sources and to offer optimized performance. The fast settling of the ADC driver stage and no latency of the SAR ADC provide a unique solution for high channel count multiplexed signal chain architectures and control loop applications.
The small footprint, 9 mm × 9 mm BGA package enables smaller form factor instruments without sacrificing performance. The system integration solves many design challenges while the device still provides the flexibility of a configurable ADC driver feedback loop to allow gain or attenuation adjustments, as well as fully differential or single-ended to differential input. A single 5 V supply operation is possible while achieving optimum performance from the device.
The ADAQ23876 features a serial LVDS digital interface with one-lane or two-lane output modes, allowing the user to optimize the interface data rate for each application. The specified operation of the μModule is from −40°C to +85°C.
APPLICATIONS
- Automatic test equipment
- Data acquisition
- Hardware in the Loop (HiL)
- Power analyzers
- Nondestructive test (acoustic emissions)
- Mass spectrometry
- Traveling wave fault location
- Medical imaging and instruments
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Markets and Technologies
Product Lifecycle
Recommended for New Designs
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.
Evaluation Kits (1)
Documentation & Resources
Tools & Simulations
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Reference Designs (2)
Design Resources
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
Part Number | Material Declaration | Reliability Data | Pin/Package Drawing | CAD Symbols, Footprints & 3D Models |
---|---|---|---|---|
ADAQ23876BBCZ | Material Declaration | Reliability Data | 100-Ball CSP-BGA (9mm x 9mm x 2.268mm) | |
Wafer Fabrication Data |
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Pricing displayed is based on 1-piece. The USA list pricing shown is for budgetary use only, shown in United States dollars (FOB USA per unit), and is subject to change. International prices may vary due to local duties, taxes, fees and exchange rates.