ADG5208
Info : RECOMMENDED FOR NEW DESIGNS
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ADG5208

High Voltage Latch-Up Proof, 4-/8-Channel Multiplexers

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Info : RECOMMENDED FOR NEW DESIGNS tooltip
Info : RECOMMENDED FOR NEW DESIGNS tooltip
Part Details
Part Models 4
1ku List Price Starting From $2.84
Features
  • Latch-up proof
  • 2.9 pF off source capacitance
  • 17 pF off drain capacitance
  • 0.4 pC charge injection
  • Low on resistance: 160 Ω typical
  • ±9 V to ±22 V dual-supply operation
  • 9 V to 40 V single-supply operation
  • 48 V supply maximum ratings
  • Fully specified at ±15 V, ±20 V, +12 V, and +36 V
  • See data sheet for additional features
ADG5208-EP supports defense and aerospace applications (AQEC standard)
  • Download ADG5208-EP data sheet (pdf)
  • Military temperature range: –55°C to +125°C
  • Controlled manufacturing baseline
  • One assembly and test site
  • One fabrication site
  • Enhanced product change notification
  • Qualification data available on request
  • V62/15601 DSCC Drawing Number

Additional Details
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The ADG5208/ADG5209 are monolithic CMOS analog multiplexers comprising eight single channels and four differential channels, respectively. The ADG5208 switches one of eight inputs to a common output, as determined by the 3-bit binary address lines, A0, A1, and A2. The ADG5209 switches one of four differential inputs to a common differential output, as determined by the 2-bit binary address lines, A0 and A1.

An EN input on both devices enables or disables the device. When EN is disabled, all channels switch off. The ultralow capacitance and charge injection of these switches make them ideal solutions for data acquisition and sample-and-hold applications, where low glitch and fast settling are required. Fast switching speed coupled with high signal bandwidth make these devices suitable for video signal switching.

Each switch conducts equally well in both directions when on, and each switch has an input signal range that extends to the power supplies. In the off condition, signal levels up to the supplies are blocked.

The ADG5208/ADG5209 do not have VL pins; instead, the logic power supply is generated internally by an on-chip voltage generator.

Product Highlights

  1. Trench Isolation Guards Against Latch-Up.
    A dielectric trench separates the P and N channel transistors
    to prevent latch-up even under severe overvoltage conditions.
  2. 0.4 pC Charge Injection.
  3. Dual-Supply Operation.
    For applications where the analog signal is bipolar, the 
    ADG5208/ADG5209 can be operated from dual supplies of up to ±22 V.
  4. Single-Supply Operation.
    For applications where the analog signal is unipolar, the
    ADG5208/ADG5209 can be operated from a single rail power supply of up to 40 V.
  5. 3 V Logic-Compatible Digital Inputs.
    VINH = 2.0 V, VINL = 0.8 V.
  6. No VL Logic Power Supply Required.


Applications

      • Automatic test equipment
      • Data acquisition
      • Instrumentation
      • Avionics
      • Audio and video switching
      • Communication systems


Part Models 4
1ku List Price Starting From $2.84

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADG5208BCPZ-RL7
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ADG5208BRUZ
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  • HTML
ADG5208BRUZ-RL7
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ADG5208SRUZ-EP-RL7
  • HTML
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Part Models

Product Lifecycle

PCN

Jul 17, 2023

- 23_0095

Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages

Aug 12, 2022

- 21_0271

Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages

Oct 18, 2016

- 16_0036

Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products

Jul 30, 2015

- 15_0159

ADG5208 and ADG5209 LFCSP Redesign resulting in Data Sheet Specification Changes

Sep 29, 2014

- 13_0248

Assembly and Test Transfer of Select 4x4 and 5x5mm LFCSP Products using 8900 Die Attach to STATS ChipPAC China

Nov 12, 2013

- 13_0230

Assembly and Test Transfer of Select 3.5x3.5, 4x3, 4x4, and 5x5mm LFCSP Products to STATS ChipPAC China

Jul 23, 2015

- 14_0067

ADG5208 and ADG5209 TSSOP Redesign resulting in Data Sheet Specification Changes

Jan 20, 2012

- 11_0218

Halogen Free Material Change for Certain TSSOP Products at Carsem

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Jul 17, 2023

- 23_0095

arrow down

Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages

Aug 12, 2022

- 21_0271

arrow down

Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages

Oct 18, 2016

- 16_0036

arrow down

Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products

Jul 30, 2015

- 15_0159

arrow down

ADG5208 and ADG5209 LFCSP Redesign resulting in Data Sheet Specification Changes

Sep 29, 2014

- 13_0248

arrow down

Assembly and Test Transfer of Select 4x4 and 5x5mm LFCSP Products using 8900 Die Attach to STATS ChipPAC China

Nov 12, 2013

- 13_0230

arrow down

Assembly and Test Transfer of Select 3.5x3.5, 4x3, 4x4, and 5x5mm LFCSP Products to STATS ChipPAC China

Jul 23, 2015

- 14_0067

arrow down

ADG5208 and ADG5209 TSSOP Redesign resulting in Data Sheet Specification Changes

Jan 20, 2012

- 11_0218

arrow down

Halogen Free Material Change for Certain TSSOP Products at Carsem

Software & Part Ecosystem

Software & Part Ecosystem

Evaluation Kit

Evaluation Kits 2

reference details image

EVAL-16LFCSP

Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio

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EVAL-16LFCSP

Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio

Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio

Features and Benefits

  • 16-lead, 4 mm × 4 mm LFCSP evaluation board
  • Easily changeable clamshell socket for the main device
  • Gold pin connectors for the addition of passive components
  • SMB connectors for the input and output of signals
  • Additional space on board for prototyping

Product Detail

The EVAL-16LFCSPEBZ enables easy evaluation of the 16-lead lead frame chip scale package (LFCSP) devices in the Switches and Multiplexers Portfolio that are purchased separately. The EVAL-16LFCSPEBZ is supplied with a clamshell socket to secure a 16-lead LFCSP device to the evaluation board without the need for soldering. In addition, there are three sets of gold pin connectors in each trace, for board flexibility and reusability for multiple evaluations.

Figure 1 in the user guide shows the EVAL-16LFCSPEBZ. A 16-lead LFCSP device can be inserted into the socket in the center of the evaluation board. Each device pin has a corresponding three-pin header link, from K1 to K16. This can either be connected to an external signal source by removing the corresponding link or use the link to choose between VDD or GND. A wire screw terminal, J5, supplies the VDD and GND. The Subminiature Version B (SMB) connectors on the EVAL-16LFCSPEBZ allow additional external signals to be supplied to the device. In addition, there is a perfboard space and two 16-lead LFCSP pads (3 mm x 3 mm and 2.1 mm x 2.1 mm) available on top of the EVAL-16LFCSPEBZ for prototyping.

The full specifications of the device under test (DUT) are available in the corresponding product data sheet, which must be consulted with the EVAL-16LFCSPEBZ user guide when using the EVAL-16LFCSPEBZ.

reference details image

EVAL-16TSSOP

Evaluation Board for 16 lead TSSOP Devices in the Switch/Mux Portfolio

zoom

EVAL-16TSSOP

Evaluation Board for 16 lead TSSOP Devices in the Switch/Mux Portfolio

Evaluation Board for 16 lead TSSOP Devices in the Switch/Mux Portfolio

Features and Benefits

  • 16 lead TSSOP evaluation board
  • Clamp to allow the main device to be changed easily
  • Gold pin connectors to allow the addition of passive components
  • SMB connectors for the input/output of signals
  • Additional space on board to allow for prototyping

Product Detail

The EVAL-16TSSOPEBZ evaluation board evaluates 16-lead TSSOP devices in the Switches and Multiplexers Portfolio that are purchased separately. A clamp is supplied with the EVAL-16TSSOPEBZ to secure a 16-lead TSSOP device to the evaluation board without the need for soldering, making the board reusable for multiple devices.

A 16-lead TSSOP device can be clamped or soldered to the center of the evaluation board. Each pin of the device has a corresponding link from K1 to K16 that can be set to either VDD or GND. A wire screw terminal supplies VDD and GND. SMB connectors on the board allow additional external signals to be supplied to the device. In addition, there is space available at the top of the board for prototyping.

Full specifications of the device under test (DUT) are available in the corresponding product data sheet, which should be consulted in conjunction with this user guide when using the evaluation board.

Tools & Simulations

Tools & Simulations 2

LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.

Reference Designs

Reference Designs 1

Multichannel Data Acquisition Circuit

18-Bit, 1.33 MSPS, 16-Channel Data Acquisition System

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