ADG5236

RECOMMENDED FOR NEW DESIGNS

High Voltage Latch-Up Proof, Dual SPDT Switches

Data Sheet (Rev. B) Product Selection Table

Part Models: 3
1ku List Price: Starting From $2.66

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Part Details

Latch-up proof
2.5 pF off source capacitance
12 pF off drain capacitance
−0.6 pC charge injection
Low leakage: 0.4 nA maximum at 85ºC

±9 V to ±22 V dual-supply operation
9 V to 40 V single-supply operation
48 V supply maximum ratings
Fully specified at ±15 V, ±20 V, +12 V, and +36 V
V_SS to V_DD analog signal range

Part Models: 3
1ku List Price: Starting From $2.66

Documentation

Data Sheet 1

ADG5236: High Voltage Latch-Up Proof, Dual SPDT Switches Data Sheet (Rev.B) 07/18/2011

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
ADG5236BCPZ-RL7	16-Lead LFCSP (4mm x 4mm)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG5236BRUZ	16-Lead TSSOP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG5236BRUZ-RL7	16-Lead TSSOP	Material Declaration Reliablity Data	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN
No Match Found
Jul 17, 2023 - 23_0095 Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages
		PCN23_0095_Form Material_Report Qualification Results Summary Detailed Change Description
ADG5236BCPZ-RL7	PRODUCTION
Aug 12, 2022 - 21_0271 Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages
		PCN21_0271_Form Material_Report Detailed Change Description Qualification Results Summary
ADG5236BCPZ-RL7	PRODUCTION
Oct 18, 2016 - 16_0036 Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products
		PCN16_0036_Form Material_Report Qualification Results Summary Qualification Results Summary Qualification Results Summary Test Correlation Report
ADG5236BCPZ-RL7	PRODUCTION
Sep 15, 2015 - 15_0082 ADG5204 and ADG5236 Redesign
		PCN15_0082_Form Material_Report Qualification Results Summary
ADG5236BCPZ-RL7	PRODUCTION
ADG5236BRUZ	PRODUCTION
ADG5236BRUZ-RL7	PRODUCTION
Sep 29, 2014 - 13_0248 Assembly and Test Transfer of Select 4x4 and 5x5mm LFCSP Products using 8900 Die Attach to STATS ChipPAC China
		PCN13_0248_Form Material_Report Detailed Change Description Qualification Results Summary Test Correlation Report
ADG5236BCPZ-RL7	PRODUCTION
Nov 12, 2013 - 13_0230 Assembly and Test Transfer of Select 3.5x3.5, 4x3, 4x4, and 5x5mm LFCSP Products to STATS ChipPAC China
		PCN13_0230_Form Material_Report Detailed Change Description Qualification Plan Summary Test Correlation Plan
ADG5236BCPZ-RL7	PRODUCTION
Apr 5, 2021 - 21_0035 Amkor Philippines as an Alternate Site for TSSOP_4.4
		PCN21_0035_Form Material_Report Qualification Results Summary Other
ADG5236BRUZ	PRODUCTION
ADG5236BRUZ-RL7	PRODUCTION
Jan 20, 2012 - 11_0218 Halogen Free Material Change for Certain TSSOP Products at Carsem
		PCN11_0218_Form Material_Report Qualification Report Summary
ADG5236BRUZ	PRODUCTION
ADG5236BRUZ-RL7	PRODUCTION

This is the most up-to-date revision of the Data Sheet.

Tools & Simulations

LTspice 1

ADG5236 - Robust Switches and Multiplexers

Models for the following parts are available in LTspice:

ADG5236

LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.

Evaluation Kits

Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio

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Features and Benefits

16-lead, 4 mm × 4 mm LFCSP evaluation board
Easily changeable clamshell socket for the main device
Gold pin connectors for the addition of passive components
SMB connectors for the input and output of signals
Additional space on board for prototyping

Product Details

The EVAL-16LFCSPEBZ enables easy evaluation of the 16-lead lead frame chip scale package (LFCSP) devices in the Switches and Multiplexers Portfolio that are purchased separately. The EVAL-16LFCSPEBZ is supplied with a clamshell socket to secure a 16-lead LFCSP device to the evaluation board without the need for soldering. In addition, there are three sets of gold pin connectors in each trace, for board flexibility and reusability for multiple evaluations.

Figure 1 in the user guide shows the EVAL-16LFCSPEBZ. A 16-lead LFCSP device can be inserted into the socket in the center of the evaluation board. Each device pin has a corresponding three-pin header link, from K1 to K16. This can either be connected to an external signal source by removing the corresponding link or use the link to choose between V_DD or GND. A wire screw terminal, J5, supplies the V_DD and GND. The Subminiature Version B (SMB) connectors on the EVAL-16LFCSPEBZ allow additional external signals to be supplied to the device. In addition, there is a perfboard space and two 16-lead LFCSP pads (3 mm x 3 mm and 2.1 mm x 2.1 mm) available on top of the EVAL-16LFCSPEBZ for prototyping.

The full specifications of the device under test (DUT) are available in the corresponding product data sheet, which must be consulted with the EVAL-16LFCSPEBZ user guide when using the EVAL-16LFCSPEBZ.