ADG5236
Info : RECOMMENDED FOR NEW DESIGNS
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ADG5236

High Voltage Latch-Up Proof, Dual SPDT Switches

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Info : RECOMMENDED FOR NEW DESIGNS tooltip
Info : RECOMMENDED FOR NEW DESIGNS tooltip
Part Details
Part Models 3
1ku List Price Starting From $2.66
Features
  • Latch-up proof
  • 2.5 pF off source capacitance
  • 12 pF off drain capacitance
  • −0.6 pC charge injection
  • Low leakage: 0.4 nA maximum at 85ºC
  • ±9 V to ±22 V dual-supply operation
  • 9 V to 40 V single-supply operation
  • 48 V supply maximum ratings
  • Fully specified at ±15 V, ±20 V, +12 V, and +36 V
  • VSS to VDD analog signal range
Additional Details
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The ADG5236 is a monolithic CMOS device containing two independently selectable single-pole/double throw (SPDT) switches. An EN input on the LFCSP package enables or disables the device. When disabled, all channels switch off. Each switch conducts equally well in both directions when on and has an input signal range that extends to the supplies. In the off condition, signal levels up to the supplies are blocked. Both switches exhibit break-before-make switching action for use in multiplexer applications.

The ultralow capacitance and charge injection of these switches make them ideal solutions for data acquisition and sample-and-hold applications, where low glitch and fast settling are required. Fast switching speed together with high signal bandwidth make the device suitable for video signal switching.

APPLICATIONS

  • Automatic test equipment
  • Data acquisition
  • Instrumentation
  • Avionics
  • Audio and video switching
  • Communication systems

PRODUCT HIGHLIGHTS

  1. Trench Isolation Guards Against Latch-Up. A dielectric trench separates the P and N channel transistors thereby preventing latch-up even under severe overvoltage conditions.
  2. Ultralow capacitance and < 1 pC charge injection.
  3. Dual-Supply Operation. For applications where the analog signal is bipolar, the ADG5236 can be operated from dual supplies up to ±22 V.
  4. Single-Supply Operation. For applications where the analog signal is unipolar, the ADG5236 can be operated from a single rail power supply up to 40 V.
  5. 3 V Logic Compatible Digital Inputs. VINH = 2.0 V, VINL = 0.8 V.
  6. No VL Logic Power Supply Required.
Part Models 3
1ku List Price Starting From $2.66

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADG5236BCPZ-RL7
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ADG5236BRUZ
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ADG5236BRUZ-RL7
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Part Models

Product Lifecycle

PCN

Jul 17, 2023

- 23_0095

Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages

Aug 12, 2022

- 21_0271

Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages

Oct 18, 2016

- 16_0036

Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products

Sep 15, 2015

- 15_0082

ADG5204 and ADG5236 Redesign

ADG5236BCPZ-RL7

PRODUCTION

ADG5236BRUZ

PRODUCTION

ADG5236BRUZ-RL7

PRODUCTION

Sep 29, 2014

- 13_0248

Assembly and Test Transfer of Select 4x4 and 5x5mm LFCSP Products using 8900 Die Attach to STATS ChipPAC China

Nov 12, 2013

- 13_0230

Assembly and Test Transfer of Select 3.5x3.5, 4x3, 4x4, and 5x5mm LFCSP Products to STATS ChipPAC China

Apr 5, 2021

- 21_0035

Amkor Philippines as an Alternate Site for TSSOP_4.4

Jan 20, 2012

- 11_0218

Halogen Free Material Change for Certain TSSOP Products at Carsem

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Jul 17, 2023

- 23_0095

arrow down

Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages

Aug 12, 2022

- 21_0271

arrow down

Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages

Oct 18, 2016

- 16_0036

arrow down

Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products

Sep 15, 2015

- 15_0082

arrow down

ADG5204 and ADG5236 Redesign

ADG5236BCPZ-RL7

PRODUCTION

ADG5236BRUZ

PRODUCTION

ADG5236BRUZ-RL7

PRODUCTION

Sep 29, 2014

- 13_0248

arrow down

Assembly and Test Transfer of Select 4x4 and 5x5mm LFCSP Products using 8900 Die Attach to STATS ChipPAC China

Nov 12, 2013

- 13_0230

arrow down

Assembly and Test Transfer of Select 3.5x3.5, 4x3, 4x4, and 5x5mm LFCSP Products to STATS ChipPAC China

Apr 5, 2021

- 21_0035

arrow down

Amkor Philippines as an Alternate Site for TSSOP_4.4

Jan 20, 2012

- 11_0218

arrow down

Halogen Free Material Change for Certain TSSOP Products at Carsem

Software & Part Ecosystem

Software & Part Ecosystem

Evaluation Kit

Evaluation Kits 1

reference details image

EVAL-16LFCSP

Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio

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EVAL-16LFCSP

Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio

Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio

Features and Benefits

  • 16-lead, 4 mm × 4 mm LFCSP evaluation board
  • Easily changeable clamshell socket for the main device
  • Gold pin connectors for the addition of passive components
  • SMB connectors for the input and output of signals
  • Additional space on board for prototyping

Product Detail

The EVAL-16LFCSPEBZ enables easy evaluation of the 16-lead lead frame chip scale package (LFCSP) devices in the Switches and Multiplexers Portfolio that are purchased separately. The EVAL-16LFCSPEBZ is supplied with a clamshell socket to secure a 16-lead LFCSP device to the evaluation board without the need for soldering. In addition, there are three sets of gold pin connectors in each trace, for board flexibility and reusability for multiple evaluations.

Figure 1 in the user guide shows the EVAL-16LFCSPEBZ. A 16-lead LFCSP device can be inserted into the socket in the center of the evaluation board. Each device pin has a corresponding three-pin header link, from K1 to K16. This can either be connected to an external signal source by removing the corresponding link or use the link to choose between VDD or GND. A wire screw terminal, J5, supplies the VDD and GND. The Subminiature Version B (SMB) connectors on the EVAL-16LFCSPEBZ allow additional external signals to be supplied to the device. In addition, there is a perfboard space and two 16-lead LFCSP pads (3 mm x 3 mm and 2.1 mm x 2.1 mm) available on top of the EVAL-16LFCSPEBZ for prototyping.

The full specifications of the device under test (DUT) are available in the corresponding product data sheet, which must be consulted with the EVAL-16LFCSPEBZ user guide when using the EVAL-16LFCSPEBZ.

Tools & Simulations

Tools & Simulations 1

LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.

Reference Designs

Reference Designs 1

Multichannel Data Acquisition Circuit

18-Bit, 1.33 MSPS, 16-Channel Data Acquisition System

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