OP27S
量产航空航天用低噪声精密运算放大器
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OP27精密运算放大器兼有OP07的低失调电压和漂移特性与高速、低噪声特性。失调电压低至25 µV，最大漂移为0.6 µV/°C，因而该器件是精密仪器仪表应用的理想之选。极低噪声、低1/f噪声转折频率以及高增益(180万)，能够使低电平信号得到精确的高增益放大。8 MHz增益带宽积和2.8 V/µs压摆率则可以在高速数据采集系统中实现出色的动态精度。
利用偏置电流消除电路，OP27可实现典型值±10nA的低输入偏置电流。
输出级具有良好的负载驱动能力。±10 V保证摆幅（600 Ω负载）和低输出失真使OP27成为音频应用的较佳选择。
电源抑制比(PSRR)和共模抑制比(CMRR)均超过120 dB。借助这些特性以及0.2 µV/月的长期漂移，电路设计人员能够获得以前只有分立式设计才能达到的性能水平。
参考资料
数据手册 3
交叉参考指南 1
高剂量率辐射报告 1
低剂量率辐射报告 1
辐射报告 1
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| 产品型号 | 引脚/封装图-中文版 | 文档 | CAD 符号，脚注和 3D模型 |
|---|---|---|---|
| 5962L9468003VHA | 10-Lead FlatPack | ||
| 5962R9468002V2A | 20-Lead LCC | ||
| 5962R9468002VGA | 10 ld Flat Pack | ||
| 5962R9468002VHA | 10-Lead FlatPack | ||
| 5962R9468002VPA | 8-Lead CerDIP | ||
| JM38510/13503BGA | 8 ld Header | ||
| JM38510/13503BPA | 8-Lead CerDIP | ||
| JM38510/13503SGA | ROUND HEADER/METAL CAN | ||
| JM38510/13503SPA | 8-Lead CerDIP | ||
| OP270000C | CHIPS OR DIE | ||
| OP27AL-EMX | 10-Lead FlatPack | ||
| OP27R000C | CHIPS OR DIE |
| 产品型号 | 产品生命周期 | PCN |
|---|---|---|
| 未找到匹配项目 | ||
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7月 30, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices |
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| 5962L9468003VHA | ||
| 5962R9468002V2A | ||
| 5962R9468002VGA | ||
| 5962R9468002VHA | ||
| 5962R9468002VPA | ||
| JM38510/13503SGA | ||
| JM38510/13503SPA | ||
| OP270000C | ||
| OP27R000C | ||
|
10月 29, 2017 - 17_0079 Qualification of TeamQuest Technology Inc., Philippines as an Alternate Test Site for TC-Vos Testing |
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| 5962L9468003VHA | ||
| 5962R9468002V2A | ||
| 5962R9468002VGA | ||
| 5962R9468002VHA | ||
| 5962R9468002VPA | ||
| JM38510/13503SGA | ||
| JM38510/13503SPA | ||
|
11月 18, 2015 - 15_0219 Laser Marking Standardization for Aerospace Packages |
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| 5962L9468003VHA | ||
| 5962R9468002V2A | ||
| 5962R9468002VGA | ||
| 5962R9468002VHA | ||
| 5962R9468002VPA | ||
| JM38510/13503BGA | 量产 | |
| JM38510/13503BPA | 量产 | |
| JM38510/13503SGA | ||
| JM38510/13503SPA | ||
| OP270000C | ||
| OP27R000C | ||
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10月 2, 2013 - 13_0163 Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices |
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| 5962L9468003VHA | ||
| 5962R9468002V2A | ||
| 5962R9468002VGA | ||
| 5962R9468002VHA | ||
| 5962R9468002VPA | ||
| JM38510/13503SGA | ||
| JM38510/13503SPA | ||
|
11月 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages. |
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| 5962L9468003VHA | ||
| 5962R9468002VHA | ||
| 5962R9468002VPA | ||
| JM38510/13503BPA | 量产 | |
| JM38510/13503SPA | ||
|
11月 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines |
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| 5962L9468003VHA | ||
| 5962R9468002V2A | ||
| 5962R9468002VGA | ||
| 5962R9468002VHA | ||
| 5962R9468002VPA | ||
| JM38510/13503BGA | 量产 | |
| JM38510/13503BPA | 量产 | |
| JM38510/13503SGA | ||
| JM38510/13503SPA | ||
|
11月 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines |
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| 5962L9468003VHA | ||
| 5962R9468002V2A | ||
| 5962R9468002VGA | ||
| 5962R9468002VHA | ||
| 5962R9468002VPA | ||
| JM38510/13503BGA | 量产 | |
| JM38510/13503BPA | 量产 | |
| JM38510/13503SGA | ||
| JM38510/13503SPA | ||
|
6月 1, 2011 - 11_0088 Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages |
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| 5962R9468002V2A | ||
| JM38510/13503BGA | 量产 | |
| JM38510/13503SGA | ||
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9月 29, 2022 - 22_0195 Shipment Carrier Change for TO-99 Header Package |
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| 5962R9468002VGA | ||
| JM38510/13503SGA | ||
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9月 21, 2009 - 09_0188 Change of Bottom Brand from Ink to Laser for Aerospace Cerpak Packages |
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| 5962R9468002VHA | ||
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2月 9, 2009 - 08_0073 Change of Seal Glass Material for Cerdip & Cerpak Packages |
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| 5962R9468002VHA | ||
| 5962R9468002VPA | ||
| JM38510/13503SPA | ||
|
4月 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices |
||
| JM38510/13503BGA | 量产 | |
| JM38510/13503BPA | 量产 | |
|
6月 6, 2012 - 12_0066 Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite |
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| JM38510/13503BGA | 量产 | |
| JM38510/13503BPA | 量产 | |
|
2月 1, 2010 - 09_0196 Change In Location of Q Compliance Indicator Location for JAN/38510 Product |
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| JM38510/13503BGA | 量产 | |
| JM38510/13503BPA | 量产 | |
| JM38510/13503SGA | ||
| JM38510/13503SPA | ||
|
7月 31, 2009 - 09_0106 Removal of Die Fab Code from Topside Marking of Remaining Mil-Grade Products |
||
| JM38510/13503BGA | 量产 | |
| JM38510/13503BPA | 量产 | |
这是最新版本的数据手册
工具及仿真模型
LTspice
LTspice中提供以下器件型号：
- OP27
LTspice®是一款强大高效的免费仿真软件、原理图采集和波形观测器，为改善模拟电路的仿真提供增强功能和模型。