ADPA9005

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1GHz to 28GHz, 37.5dBm, GaN Power Amplifier

ADPA9005, 1-28GHz, 37.5dBm PA

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产品技术资料帮助

ADI公司所提供的资料均视为准确、可靠。但本公司不为用户在应用过程中侵犯任何专利权或第三方权利承担任何责任。技术指标的修改不再另行通知。本公司既没有含蓄的允许，也不允许借用ADI公司的专利或专利权的名义。本文出现的商标和注册商标所有权分别属于相应的公司。

概述

  • Frequency range: 1GHz to 28GHz
  • Internally matched and AC-coupled input and output
  • Integrated temperature-compensated RF power detector
  • Power gain: 9.5dB typical with PIN = 28.0dBm from 6GHz to 25GHz
  • POUT: 37.5dBm typical with PIN = 28.0dBm from 6GHz to 25GHz
  • Small signal gain: 20.5dB typical from 6GHz to 25GHz
  • OIP3: 39.5dBm typical from 6GHz to 25GHz
  • VDD: 20V typical
  • IDQ: 560mA
  • 14-terminal, 7mm × 7mm, LCC_HS package
ADPA9005
1GHz to 28GHz, 37.5dBm, GaN Power Amplifier
ADPA9005 Functional Block Diagram ADPA9005 Typical Application Circuit ADPA9005 Pin Configuration
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参考资料

数据手册 1

用户手册 1

评估设计文件 1

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软件资源

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基于EM的RF数字孪生模型

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工具及仿真模型

S-参数 1

评估套件

eval board
schematic 1
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EVAL-ADPA9005

Evaluating the ADPA9005 1GHz to 28GHz, 37.5dBm, GaN Power Amplifier

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特性和优点

  • 4-layer Rogers 4003C evaluation board with heat spreader
  • End launch, 2.92mm RF connectors
  • Through calibration path

产品详情

The ADPA9005-EVALZ consist of a 4-layer printed circuit board (PCB) fabricated from 8mil thick Rogers 4003C copper clad, forming a nominal thickness of 64 mils, mounted to an aluminum heat spreader. The evaluation board incorporates a copper coin beneath the exposed paddle of the ADPA9005, in addition to the heat spreader, providing enhanced thermal dissipation and mechanical support for the PCB. The mounting holes on the heat spreader allow attachment to larger heatsinks to improve thermal management. The RFIN and RFOUT ports are populated by 2.92mm female coaxial connectors, and their respective RF traces are of 50Ω characteristic impedance. The ADPA9005-EVALZ is populated with components suitable for use over the entire operating temperature range of the ADPA9005.

The RF transmission lines are 50Ω grounded coplanar waveguides. The package ground leads and the exposed pad connect directly to the ground plane. Multiple vias are used to connect the top and bottom ground planes, with particular focus on the area directly beneath the ground paddle to provide adequate electrical conduction and thermal conduction to the heat spreader.

The power supply decoupling capacitors shown in Figure 5 in the data sheet represent the configuration used to characterize the device.

For full details on the ADPA9005, see the ADPA9005 data sheet, which must be consulted in conjunction with this user guide when using the ADPA9005-EVALZ evaluation board.
EVAL-ADPA9005
Evaluating the ADPA9005 1GHz to 28GHz, 37.5dBm, GaN Power Amplifier
ADPA9005-EVALZ Top Angle Evaluation Board ADPA9005-EVALZ Top Evaluation Board ADPA9005-EVALZ Bottom Evaluation Board

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