ADV7180
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ADV7180

10-Bit, 4× Oversampling SDTV Video Decoder

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Part Details
Part Models 20
1ku List Price Starting From $4.87
Features
  • Automotive versions qualified per AEC-Q100, Grade 1
  • Worldwide NTSC/PAL/SECAM color demodulation support
  • One 10-bit ADC, 4× oversampling for CVBS, 2× oversampling for Y/C mode, and 2× oversampling for YPrPb (per channel)
  • 3 video input channels with on-chip antialiasing filter
  • CVBS (composite), Y/C (S-video), and YPrPb (component) video input support
  • 5-line adaptive comb filters and CTI/DNR video enhancement
  • Adaptive Digital Line Length Tracking (ADLLT), signal processing, and enhanced FIFO management give mini-TBC functionality
  • See data sheet for additional features
Additional Details
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The ADV7180 automatically detects and converts standard analog baseband television signals compatible with worldwide NTSC, PAL, and SECAM standards into 4:2:2 component video data compatible with the 8-bit ITU-R BT.656 interface standard.

The simple digital output interface connects gluelessly to a wide range of MPEG encoders, codecs, mobile video processors, and Analog Devices, Inc., digital video encoders, such as the ADV7391. External HS, VS, and FIELD signals provide timing references for LCD controllers and other video ASICs, if required. Accurate 10-bit analog-to-digital conversion provides professional quality video performance for consumer applications with true 8-bit data resolution. Three analog video input channels accept standard composite, S-video, or component video signals, supporting a wide range of consumer video sources. AGC and clamp-restore circuitry allow an input video signal peak-to-peak range to 1.0 V. Alternatively, these can be bypassed for manual settings.

The line-locked clock output allows the output data rate, timing signals, and output clock signals to be synchronous, asynchronous, or line locked even with ±5% line length variation. Output control signals allow glueless interface connections in many applications. The ADV7180 is programmed via a 2-wire, serial bidirectional port (I2C® compatible) and is fabricated in a 1.8 V CMOS process. Its monolithic CMOS construction ensures greater functionality with lower power dissipation. LFCSP package options makes the decoder ideal for space-constrained portable applications. A 64-lead LQFP package is pin compatible with the ADV7181C.

The 48-Lead LQFP, 40-lead LFCSP, and 32-lead LFCSP use one pin to output VS or FIELD.

APPLICATIONS

  • Digital camcorders and PDAs
  • Low cost SDTV PIP decoder for digital TVs
  • Multichannel DVRs for video security
  • AV receivers and video transcoding
  • PCI-/USB-based video capture and TV tuner cards
  • Personal media players and recorders
  • Smartphone/multimedia handsets
  • In-car/automotive infotainment units
  • Rearview camera/vehicle safety systems
Part Models 20
1ku List Price Starting From $4.87

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
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ADV7180BSTZ
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May 13, 2024

- 24_0009

Qualification of Alternative Wafer Fab for TSMC 0.18um Mixed Signal CMOS Process

ADV7180BCP32Z

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ADV7180WBSTZ-REEL

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Jun 5, 2014

- 13_0303

Assembly Transfer to Amkor Philippines and Test Transfer to STATS ChipPAC China of Select 5x5 LFCSP Products

Jun 26, 2023

- 23_0025

Package Outline Drawing and Data Sheet Revision for Select LFCSP Products in Amkor

Dec 7, 2016

- 16_0033

Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select QFP Products

ADV7180BST48Z

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ADV7180BST48Z-RL

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ADV7180BSTZ

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Oct 22, 2009

- 09_0227

Metal2 mask edit for ADV7180BSTZ & ADV7180WBSTZ

ADV7180BSTZ

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ADV7180BSTZ-REEL

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ADV7180WBSTZ-REEL

PRODUCTION

Jan 5, 2009

- 07_0077

Certification of STATSChipPAC Shanghai, China and AMKOR Philippines as additional sources for Assembly & Test of QFP Packages

Jun 25, 2014

- 13_0266

Test Transfer of Select LFCSP Products to STATS ChipPAC China

ADV7180WBCP32Z

PRODUCTION

ADV7180WBCP32Z-RL

PRODUCTION

May 1, 2024

- 24_0009

Qualification of Alternative Wafer Fab for TSMC 0.18um Mixed Signal CMOS Process

Sep 10, 2014

- 14_0177

Conversion of 6x6mm LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines

Filter by Model

reset

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Part Models

Product Lifecycle

PCN

May 13, 2024

- 24_0009

arrow down

Qualification of Alternative Wafer Fab for TSMC 0.18um Mixed Signal CMOS Process

ADV7180BCP32Z

PRODUCTION

ADV7180BCP32Z-RL

PRODUCTION

ADV7180BCPZ

PRODUCTION

ADV7180BCPZ-REEL

PRODUCTION

ADV7180BST48Z

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ADV7180BST48Z-RL

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ADV7180BSTZ

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ADV7180BSTZ-REEL

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ADV7180KCP32Z

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ADV7180KST48Z

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ADV7180WBCP32Z

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ADV7180WBST48Z

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ADV7180WBST48Z-RL

PRODUCTION

ADV7180WBSTZ

PRODUCTION

ADV7180WBSTZ-REEL

PRODUCTION

Jun 5, 2014

- 13_0303

arrow down

Assembly Transfer to Amkor Philippines and Test Transfer to STATS ChipPAC China of Select 5x5 LFCSP Products

Jun 26, 2023

- 23_0025

arrow down

Package Outline Drawing and Data Sheet Revision for Select LFCSP Products in Amkor

Dec 7, 2016

- 16_0033

arrow down

Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select QFP Products

ADV7180BST48Z

PRODUCTION

ADV7180BST48Z-RL

PRODUCTION

ADV7180BSTZ

PRODUCTION

ADV7180BSTZ-REEL

PRODUCTION

ADV7180KST48Z

PRODUCTION

ADV7180KST48Z-RL

PRODUCTION

ADV7180WBST48Z

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ADV7180WBST48Z-RL

PRODUCTION

ADV7180WBSTZ

PRODUCTION

ADV7180WBSTZ-REEL

PRODUCTION

Oct 22, 2009

- 09_0227

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Metal2 mask edit for ADV7180BSTZ & ADV7180WBSTZ

ADV7180BSTZ

PRODUCTION

ADV7180BSTZ-REEL

PRODUCTION

ADV7180WBSTZ

PRODUCTION

ADV7180WBSTZ-REEL

PRODUCTION

Jan 5, 2009

- 07_0077

arrow down

Certification of STATSChipPAC Shanghai, China and AMKOR Philippines as additional sources for Assembly & Test of QFP Packages

Jun 25, 2014

- 13_0266

arrow down

Test Transfer of Select LFCSP Products to STATS ChipPAC China

ADV7180WBCP32Z

PRODUCTION

ADV7180WBCP32Z-RL

PRODUCTION

May 1, 2024

- 24_0009

arrow down

Qualification of Alternative Wafer Fab for TSMC 0.18um Mixed Signal CMOS Process

Sep 10, 2014

- 14_0177

arrow down

Conversion of 6x6mm LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines

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