ADG1211

PRODUCTION

Low Capacitance, Low Charge Injection ±15 V/+12 V iCMOS Quad SPST Switches

Data Sheet (Rev. D) Product Selection Table

Part Models: 5
1ku List Price: Starting From $2.35

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Overview

1 pF off capacitance
2.6 pF on capacitance
<1 pC charge injection
33 V supply range
120 Ω on resistance
Fully specified at ±15 V, +12 V
No V_L supply required
3 V logic-compatible inputs
Rail-to-rail operation
16-lead TSSOP and 16-lead LFCSP
Typical power consumption: <0.03 μW

The ADG1211 / ADG1212 / ADG1213 are monolithic complementary metal-oxide semiconductor (CMOS) devices containing four independently selectable switches designed on an iCMOS^® (industrial CMOS) process. iCMOS is a modular manufacturing process combining high voltage CMOS and bipolar technologies. It enables the development of a wide range of high performance analog ICs capable of 33 V operation in a footprint that no previous generation of high voltage devices has been able to achieve. Unlike analog ICs using conventional CMOS processes, iCMOS components can tolerate high supply voltages while providing increased performance, dramatically lower power consumption, and reduced package size.

The ultralow capacitance and charge injection of these switches make them ideal solutions for data acquisition and sample-and-hold applications, where low glitch and fast settling are required. Fast switching speed coupled with high signal bandwidth make the devices suitable for video signal switching.

iCMOS construction ensures ultralow power dissipation, making the devices ideally suited for portable and battery-powered instruments.

The ADG1211 / ADG1212 / ADG1213 contain four independent single-pole/single-throw (SPST) switches. The ADG1211 and ADG1212 differ only in that the digital control logic is inverted. The ADG1211 switches are turned on with Logic 0 on the appropriate control input, while Logic 1 is required for the ADG1212. The ADG1213 has two switches with digital control logic similar to that of the ADG1211; the logic is inverted on the other two switches. The ADG1213 exhibits break-before-make switching action for use in multiplexer applications.

Each switch conducts equally well in both directions when on and has an input signal range that extends to the supplies. In the off condition, signal levels up to the supplies are blocked.

Product Highlights

Ultralow capacitance.
<1 pC charge injection.
3 V logic-compatible digital inputs: V_IH = 2.0 V, V_IL = 0.8 V.
No V_L logic power supply required.
Ultralow power dissipation: <0.03 μW.
16-lead TSSOP and 3 mm × 3 mm LFCSP packages.

Applications

Automatic test equipment
Data acquisition systems
Battery-powered systems
Sample-and-hold systems
Audio signal routing
Video signal routing
Communication systems

Part Models: 5
1ku List Price: Starting From $2.35

Documentation

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
ADG1211YCPZ-500RL7	16-Lead LFCSP (3mm x 3mm w/ EP)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADG1211YCPZ-REEL7	16-Lead LFCSP (3mm x 3mm w/ EP)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADG1211YRUZ	16-Lead TSSOP	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADG1211YRUZ-REEL	16-Lead TSSOP	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADG1211YRUZ-REEL7	16-Lead TSSOP	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Feb 13, 2014 - 14_0038 Conversion of 3x3mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.
		PCN14_0038_Form Material_Report Detailed Change Description Package Outline Drawing Qualification Report Summary
ADG1211YCPZ-500RL7	PRODUCTION
ADG1211YCPZ-REEL7	PRODUCTION
Aug 10, 2012 - 12_0201 Timing Specification Correction in the ADG1211/ADG1212/ADG1213 datasheet
		PCN12_0201_Form Material_Report Datasheet Specification Comparison
ADG1211YCPZ-500RL7	PRODUCTION
ADG1211YCPZ-REEL7	PRODUCTION
ADG1211YRUZ	PRODUCTION
ADG1211YRUZ-REEL	PRODUCTION
ADG1211YRUZ-REEL7	PRODUCTION
Nov 16, 2009 - 06_0157 Qualification of the 8" H6 Thin Film BiPolar Wafer Fab Process at Analog Devices, Limerick, Ireland
		Material_Report PCN06_0157_Form RQR03599A
ADG1211YCPZ-500RL7	PRODUCTION
ADG1211YCPZ-REEL7	PRODUCTION
ADG1211YRUZ	PRODUCTION
ADG1211YRUZ-REEL	PRODUCTION
ADG1211YRUZ-REEL7	PRODUCTION
Oct 26, 2009 - 09_0202 Inclusion of Banding Tape for LFCSP REEL7 parts.
		Material_Report PCN09_0202_Form Proposal for Inclusion of Banding Tape
ADG1211YCPZ-500RL7	PRODUCTION
Jan 27, 2009 - 09_0013 Changes to Idd Specifications on ADG12xx, ADG14xx and ADG13xx datasheets
		Form Material_Report PCN attachment_ICMOS IDD changes
ADG1211YCPZ-500RL7	PRODUCTION
ADG1211YCPZ-REEL7	PRODUCTION
ADG1211YRUZ	PRODUCTION
ADG1211YRUZ-REEL	PRODUCTION
ADG1211YRUZ-REEL7	PRODUCTION
Oct 23, 2009 - 09_0153 Jiangsu Changjiang Electronics Technology Co. Ltd. (JCET) and Advanced Semiconductor Engineering (ASE) as additional Assembly Subcontractors for 8L SOIC, 8L MSOP, 16L TSSOP and 8L PDIP.
		ADI_PCN_09_0153_Rev_-_FG parts review_rev6_ASE ADI_PCN_09_0153_Rev_-_FG parts review_rev6_JCET ADI_PCN_09_0153_Rev_-_Material Set Changes_rev1 Material_Report PCN09_0153_Form Summary of Supporting data_rev5
ADG1211YRUZ	PRODUCTION
ADG1211YRUZ-REEL	PRODUCTION
ADG1211YRUZ-REEL7	PRODUCTION

This is the most up-to-date revision of the Data Sheet.

Software Resources

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Tools & Simulations

LTspice

Models for the following parts are available in LTspice:

ADG1211

SPICE Model 1

ADG1211 SPICE Macro Model

LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.

Evaluation Kits

Evaluation Board for 16 lead TSSOP Devices in the Switch/Mux Portfolio

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Features and Benefits

16 lead TSSOP evaluation board
Clamp to allow the main device to be changed easily
Gold pin connectors to allow the addition of passive components
SMB connectors for the input/output of signals
Additional space on board to allow for prototyping

Product Details

The EVAL-16TSSOPEBZ evaluation board evaluates 16-lead TSSOP devices in the Switches and Multiplexers Portfolio that are purchased separately. A clamp is supplied with the EVAL-16TSSOPEBZ to secure a 16-lead TSSOP device to the evaluation board without the need for soldering, making the board reusable for multiple devices.

A 16-lead TSSOP device can be clamped or soldered to the center of the evaluation board. Each pin of the device has a corresponding link from K1 to K16 that can be set to either VDD or GND. A wire screw terminal supplies VDD and GND. SMB connectors on the board allow additional external signals to be supplied to the device. In addition, there is space available at the top of the board for prototyping.

Full specifications of the device under test (DUT) are available in the corresponding product data sheet, which should be consulted in conjunction with this user guide when using the evaluation board.