ADG1211
Low Capacitance, Low Charge Injection ±15 V/+12 V iCMOS Quad SPST Switches
Show More
Not the part you were looking for?
2
Ask a Question
Submit your question below and we will return the best answer from ADI’s knowledge database:
Search
Other places you can find help
Support
Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.
Visit the ADI Support Page
Features
- 1 pF off capacitance
- 2.6 pF on capacitance
- <1 pC charge injection
- 33 V supply range
- 120 Ω on resistance
- Fully specified at ±15 V, +12 V
- No VL supply required
- 3 V logic-compatible inputs
- Rail-to-rail operation
- 16-lead TSSOP and 16-lead LFCSP
- Typical power consumption: <0.03 μW
.svg?rev=fd385c90e2cf4716ae9a8c8d20e6b8e3&la=en&h=24&w=24&hash=A302DF48F94BAAA11877AF223F27157A){kind=icon}
The ADG1211 / ADG1212 / ADG1213 are monolithic complementary metal-oxide semiconductor (CMOS) devices containing four independently selectable switches designed on an iCMOS® (industrial CMOS) process. iCMOS is a modular manufacturing process combining high voltage CMOS and bipolar technologies. It enables the development of a wide range of high performance analog ICs capable of 33 V operation in a footprint that no previous generation of high voltage devices has been able to achieve. Unlike analog ICs using conventional CMOS processes, iCMOS components can tolerate high supply voltages while providing increased performance, dramatically lower power consumption, and reduced package size.
The ultralow capacitance and charge injection of these switches make them ideal solutions for data acquisition and sample-and-hold applications, where low glitch and fast settling are required. Fast switching speed coupled with high signal bandwidth make the devices suitable for video signal switching.
iCMOS construction ensures ultralow power dissipation, making the devices ideally suited for portable and battery-powered instruments.
The ADG1211 / ADG1212 / ADG1213 contain four independent single-pole/single-throw (SPST) switches. The ADG1211 and ADG1212 differ only in that the digital control logic is inverted. The ADG1211 switches are turned on with Logic 0 on the appropriate control input, while Logic 1 is required for the ADG1212. The ADG1213 has two switches with digital control logic similar to that of the ADG1211; the logic is inverted on the other two switches. The ADG1213 exhibits break-before-make switching action for use in multiplexer applications.
Each switch conducts equally well in both directions when on and has an input signal range that extends to the supplies. In the off condition, signal levels up to the supplies are blocked.
Product Highlights
- Ultralow capacitance.
- <1 pC charge injection.
- 3 V logic-compatible digital inputs: VIH = 2.0 V, VIL = 0.8 V.
- No VL logic power supply required.
- Ultralow power dissipation: <0.03 μW.
- 16-lead TSSOP and 3 mm × 3 mm LFCSP packages.
Applications
- Automatic test equipment
- Data acquisition systems
- Battery-powered systems
- Sample-and-hold systems
- Audio signal routing
- Video signal routing
- Communication systems
2
Ask a Question
Submit your question below and we will return the best answer from ADI’s knowledge database:
Search
Other places you can find help
Support
Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.
Visit the ADI Support Page
{{modalTitle}}
{{modalDescription}}
{{dropdownTitle}}
- {{defaultSelectedText}} {{#each projectNames}}
- {{name}} {{/each}} {{#if newProjectText}}
-
{{newProjectText}}
{{/if}}
{{newProjectTitle}}
{{projectNameErrorText}}
ADG1211
Documentation
Filters
1 Applied
-
All
-
User Guide
-
Application Note
-
Technical Articles
-
Data Sheet
-
All
-
English
-
Chinese
-
Japanese
Data Sheet
2
User Guide
1
Application Note
4
Technical Articles
2
URL
URL
Documentation
Data Sheet 1
User Guide 1
Application Note 2
Technical Articles 1
Circuit Note 1
Product Selection Guide 1
Analog Dialogue 2
Video
1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADG1211YCPZ-500RL7 |
16-Lead LFCSP (3mm x 3mm w/ EP)
|
|
|
| ADG1211YCPZ-REEL7 |
16-Lead LFCSP (3mm x 3mm w/ EP)
|
|
|
| ADG1211YRUZ |
16-Lead TSSOP
|
|
|
| ADG1211YRUZ-REEL |
16-Lead TSSOP
|
|
|
| ADG1211YRUZ-REEL7 |
16-Lead TSSOP
|
|
- ADG1211YCPZ-500RL7
- Pin/Package Drawing
-
16-Lead LFCSP (3mm x 3mm w/ EP)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADG1211YCPZ-REEL7
- Pin/Package Drawing
-
16-Lead LFCSP (3mm x 3mm w/ EP)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADG1211YRUZ
- Pin/Package Drawing
-
16-Lead TSSOP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADG1211YRUZ-REEL
- Pin/Package Drawing
-
16-Lead TSSOP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADG1211YRUZ-REEL7
- Pin/Package Drawing
-
16-Lead TSSOP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
Feb 13, 2014
- 14_0038
Conversion of 3x3mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.
ADG1211YCPZ-500RL7
PRODUCTION
ADG1211YCPZ-REEL7
PRODUCTION
Aug 10, 2012
- 12_0201
Timing Specification Correction in the ADG1211/ADG1212/ADG1213 datasheet
ADG1211YCPZ-500RL7
PRODUCTION
ADG1211YCPZ-REEL7
PRODUCTION
ADG1211YRUZ
PRODUCTION
ADG1211YRUZ-REEL
PRODUCTION
ADG1211YRUZ-REEL7
PRODUCTION
Nov 16, 2009
- 06_0157
Qualification of the 8" H6 Thin Film BiPolar Wafer Fab Process at Analog Devices, Limerick, Ireland
ADG1211YCPZ-500RL7
PRODUCTION
ADG1211YCPZ-REEL7
PRODUCTION
ADG1211YRUZ
PRODUCTION
ADG1211YRUZ-REEL
PRODUCTION
ADG1211YRUZ-REEL7
PRODUCTION
Oct 26, 2009
- 09_0202
Inclusion of Banding Tape for LFCSP REEL7 parts.
ADG1211YCPZ-500RL7
PRODUCTION
Jan 27, 2009
- 09_0013
Changes to Idd Specifications on ADG12xx, ADG14xx and ADG13xx datasheets
ADG1211YCPZ-500RL7
PRODUCTION
ADG1211YCPZ-REEL7
PRODUCTION
ADG1211YRUZ
PRODUCTION
ADG1211YRUZ-REEL
PRODUCTION
ADG1211YRUZ-REEL7
PRODUCTION
Oct 23, 2009
- 09_0153
Jiangsu Changjiang Electronics Technology Co. Ltd. (JCET) and Advanced Semiconductor Engineering (ASE) as additional Assembly Subcontractors for 8L SOIC, 8L MSOP, 16L TSSOP and 8L PDIP.
ADG1211YRUZ
PRODUCTION
ADG1211YRUZ-REEL
PRODUCTION
ADG1211YRUZ-REEL7
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
Feb 13, 2014
- 14_0038
Conversion of 3x3mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.
ADG1211YCPZ-500RL7
PRODUCTION
ADG1211YCPZ-REEL7
PRODUCTION
Aug 10, 2012
- 12_0201
Timing Specification Correction in the ADG1211/ADG1212/ADG1213 datasheet
ADG1211YCPZ-500RL7
PRODUCTION
ADG1211YCPZ-REEL7
PRODUCTION
ADG1211YRUZ
PRODUCTION
ADG1211YRUZ-REEL
PRODUCTION
ADG1211YRUZ-REEL7
PRODUCTION
Nov 16, 2009
- 06_0157
Qualification of the 8" H6 Thin Film BiPolar Wafer Fab Process at Analog Devices, Limerick, Ireland
ADG1211YCPZ-500RL7
PRODUCTION
ADG1211YCPZ-REEL7
PRODUCTION
ADG1211YRUZ
PRODUCTION
ADG1211YRUZ-REEL
PRODUCTION
ADG1211YRUZ-REEL7
PRODUCTION
Oct 26, 2009
- 09_0202
Inclusion of Banding Tape for LFCSP REEL7 parts.
ADG1211YCPZ-500RL7
PRODUCTION
Jan 27, 2009
- 09_0013
Changes to Idd Specifications on ADG12xx, ADG14xx and ADG13xx datasheets
ADG1211YCPZ-500RL7
PRODUCTION
ADG1211YCPZ-REEL7
PRODUCTION
ADG1211YRUZ
PRODUCTION
ADG1211YRUZ-REEL
PRODUCTION
ADG1211YRUZ-REEL7
PRODUCTION
Oct 23, 2009
- 09_0153
Jiangsu Changjiang Electronics Technology Co. Ltd. (JCET) and Advanced Semiconductor Engineering (ASE) as additional Assembly Subcontractors for 8L SOIC, 8L MSOP, 16L TSSOP and 8L PDIP.
ADG1211YRUZ
PRODUCTION
ADG1211YRUZ-REEL
PRODUCTION
ADG1211YRUZ-REEL7
PRODUCTION
Software & Part Ecosystem
Evaluation Kits 1
EVAL-16TSSOP
Evaluation Board for 16 lead TSSOP Devices in the Switch/Mux Portfolio
Product Detail
The EVAL-16TSSOPEBZ evaluation board evaluates 16-lead TSSOP devices in the Switches and Multiplexers Portfolio that are purchased separately. A clamp is supplied with the EVAL-16TSSOPEBZ to secure a 16-lead TSSOP device to the evaluation board without the need for soldering, making the board reusable for multiple devices.
A 16-lead TSSOP device can be clamped or soldered to the center of the evaluation board. Each pin of the device has a corresponding link from K1 to K16 that can be set to either VDD or GND. A wire screw terminal supplies VDD and GND. SMB connectors on the board allow additional external signals to be supplied to the device. In addition, there is space available at the top of the board for prototyping.
Full specifications of the device under test (DUT) are available in the corresponding product data sheet, which should be consulted in conjunction with this user guide when using the evaluation board.
Tools & Simulations 2
LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.
To launch ready-to-run LTspice demonstration circuits for this part:
Step 1: Download and install LTspice on your computer.
Step 2: Click on the link in the section below to download a demonstration circuit.
Step 3: If LTspice does not automatically open after clicking the link below, you can instead run the simulation by right clicking on the link and selecting “Save Target As.” After saving the file to your computer, start LTspice and open the demonstration circuit by selecting ‘Open’ from the ‘File’ menu.
Lt Spice
SPICE Model 1
Reference Designs 1
CN0359
Fully Automatic High Performance Conductivity Measurement System
Circuits from the lab
Info:Circuits from the lab
