OP467S

数据手册 1

• OP467S: Military Data Sheet 05/14/2008

辐射报告 1

• OP467S Displacement Damage Test Report 04/14/2023

高剂量率辐射报告 1

• OP467S High Dose Rate Radiation Report 07/31/2015

ADI 始终高度重视提供符合最高质量和可靠性水平的产品。我们通过将质量和可靠性检查纳入产品和工艺设计的各个范围以及制造过程来实现这一目标。出货产品的“零缺陷”始终是我们的目标。查看我们的质量和可靠性计划和认证以了解更多信息。

产品型号	引脚/封装图-中文版	文档	CAD 符号，脚注和 3D模型
5962-9325801V2A	20-Lead LCC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
5962R9325801VCA	14-Lead CerDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
5962R9325801VDA	14-Lead FlatPack (0.26 in x 0.39 in x 0.115 in)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
OP467-000C	CHIPS OR DIE	Material Declaration Reliablity Data	Ultra Librarian SamacSys
OP467AM-EMX	14-Lead CerDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
OP467R000C	CHIPS OR DIE	Material Declaration Reliablity Data	Ultra Librarian SamacSys

根据型号筛选

产品型号	产品生命周期	PCN
7月 30, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
		PCN16_0026_Form Material_Report Qualification Results Summary
5962-9325801V2A	量产
5962R9325801VCA	量产
5962R9325801VDA	量产
11月 18, 2015 - 15_0219 Laser Marking Standardization for Aerospace Packages
		PCN15_0219_Form Material_Report Qualification Results Summary
5962-9325801V2A	量产
5962R9325801VCA	量产
5962R9325801VDA	量产
6月 20, 2014 - 14_0144 OP467S Aerospace Class S Models Change In Wafer Diameter
		PCN14_0144_Form Material_Report Qualification Results Summary
5962-9325801V2A	量产
5962R9325801VCA	量产
5962R9325801VDA	量产
10月 2, 2013 - 13_0163 Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices
		PCN13_0163_Form Material_Report Qualification Plan Summary
5962-9325801V2A	量产
5962R9325801VCA	量产
5962R9325801VDA	量产
11月 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
		PCN11_0050_Form Material_Report
5962-9325801V2A	量产
5962R9325801VCA	量产
5962R9325801VDA	量产
11月 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
		PCN11_0182_Form Material_Report
5962-9325801V2A	量产
5962R9325801VCA	量产
5962R9325801VDA	量产
6月 1, 2011 - 11_0088 Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages
		PCN11_0088_Form Material_Report Marking Comparison
5962-9325801V2A	量产
11月 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
		PCN12_0199_Form Material_Report Qualification Report Summary Datasheet Specification Comparison
5962R9325801VCA	量产
5962R9325801VDA	量产
2月 9, 2009 - 08_0073 Change of Seal Glass Material for Cerdip & Cerpak Packages
		08_0073AQualPlan Material_Report PCN08_0073_Form
5962R9325801VCA	量产
5962R9325801VDA	量产
9月 21, 2009 - 09_0188 Change of Bottom Brand from Ink to Laser for Aerospace Cerpak Packages
		09_0188supportingInfo Material_Report PCN09_0188_Form
5962R9325801VDA	量产