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Package/Assembly Qualification Test Report: QS24 (QTR: 2014-00397 REV: 01)5/5/2015
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Semiconductor Qualification Test Report: MESFET-F (QTR: 2013-00247)4/22/2015
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PCN: MS, QS, SOT, SOIC Packages - Sn/Pb Plating Vendor Change1/17/2014
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HMC Legacy PCN: QS##, QS##E and QS##G,QS##GE packages - Relocation of pre-existing production equipment to new building2/1/2013
HMC183
SP8T非反射开关，采用SMT封装，DC - 2 GHz
顶部
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建议可替代器件：
评估套件 (1)
参考资料
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QSOP 24 Tape Specification (QS24)4/17/2015
工具及仿真模型
S参数
ZIP
HMC183 S-Parameters
1.19 M
