製品概要

機能と利点

EM-Plug models are an EM-based RF digital twin capturing RF IC behavior across substrates, layouts and transitions for high-frequency designs. They’re lightweight, modular, and have accurate EM-level modeling.

3D PCB model with connector and RF trace cross-section diagram.

  • Why it matters: Matching and bandwidth change with substrate and layout, but these effects cannot be captured using S-parameters alone.
  • The blind spot: S-parameters place the reference plane at the chip boundary or 50Ω trace, leaving substrate- and transition-dependent behavior behind the reference plane.
  • What changes: EM-Plug models bring transition behavior into simulation, eliminating the need for a “trial and error”-based test PCB approach.
  • CAD tool support: EM-Plug models are provided for ANSYS HFSS. Models are not encrypted, enabling import into other 3D EM solvers as needed.

The compatible parts listed was last updated on 5/7/2026.

*互換製品

What Are EM-Plugs and How Do They Work?

EM-Plug models separate the intrinsic RF core from the EM-modeled interface at the on-chip reference plane. Together, 3D EM simulation of the EM-Plug model and the RF core represent the complete behavior in the layout.

  • RF core: Intrinsic/core RF IC behavior.
  • EM-Plug: Interface EM model of the chip to substrate including the transition(layout).
  • Combined model: Input EM-Plug + RF core + EM-Plug = Complete RF behavior.

RF circuit diagram combining 3D EM-plugs and RF-core.

Package and transition examples across multiple integration styles.

What EM-Plug Models Enable

  • No PCB trial-and-error: Matching and transition optimization without building test boards or fixtures, enabling higher first-pass success.
  • Lightweight, practical simulation: Much faster (hours to minutes) and easier to iterate than full-chip encrypted EM models.

EM Plug

3D render of a green PCB with components on a blue interposer.
  • Chip to PCB transition
  • Simulation & measurement based
  • Fast overall design time
  • No IP restriction
  • Tool independent
  • Heavy computation not required

Full Wave EM Model

3D stacked chip on interposer with vertical connections.
  • Complete chip and PCB transition
  • Simulation based
  • Long simulation time
  • Requires encryption, involves IP
  • Tool independent due to encryption
  • Heavy computation required

Matrix Board

Analog Devices ADRF5032 characterization board.
  • Blind PCB transitions
  • Measurement based
  • Manufacturing time
  • No IP restriction
  • Requires PCB tool expertise
  • Manufacturing cost

EM-Plug model vs. full-wave EM model vs matrix board (workflow comparison).


  • Modular design exploration: Multiple transitions and PCB stack-ups could be analyzed.

PCB stack-up comparison: 8 mil, 4 mil without.

  • Capture all critical variables: Landing pattern, stack-up (thickness/εr), coplanar/microstrip/stripline, solder/mask, and placement/bondwire.

Coplanar Waveguide, Microstrip, and Stripline transmission lines.

Use EM sweeps to evaluate implementation sensitivity and optimize early.

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