OP07S

PRODUCTION

Aerospace Ultra Low Offset Voltage Op Amp

Part Models: 8
1ku List Price: Starting From $28.36

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Overview

Low V_OS: 75 µV Max
Low V_OS Drift: 1.3 µV/°C Max
Ultrastable vs. Time: 1.5 µV/Month Max

Low Noise: 0.6 µV p-p Max
Wide Input Voltage Range: ±14 V
Wide Supply Voltage Range: 3 V to 18 V

The OP07 has very low input offset voltage that is obtained by trimming at the wafer stage. These low offset voltages generally eliminate any need for external nulling. The OP07 also features low input bias current and high open-loop gain. The low offsets and high open-loop gain make the OP07 particularly useful for high gain instrumentation applications.

The wide input voltage range of ±13 V minimum combined with a high CMRR and high input impedance provide high accuracy in the noninverting circuit configuration. Excellent linearity and gain accuracy can be maintained even at high closed-loop gains. Stability of offsets and gain with time or variations in temperature is excellent. The accuracy and stability of the OP07, even at high gain, combined with the freedom from external nulling have made the OP07 an industry standard for instrumentation applications.

Part Models: 8
1ku List Price: Starting From $28.36

Documentation

Data Sheet 3

OP07S: Military JM38510/ (JAN) Specification 03/17/2021

OP07S: Die Data Sheet 03/17/2021

OP07S: Military Data Sheets 03/17/2021

Cross Reference Guide 1

JAN to Generic Cross Reference 01/22/2009

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
5962R9863901VGA	8 ld Header	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
5962R9863901VHA	10-Lead FlatPack	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
5962R9863901VPA	8-Lead CerDIP	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
JM38510/13501BGA	ROUND HEADER/METAL CAN	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
JM38510/13501BPA	8-Lead CerDIP	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
JM38510/13502BGA	ROUND HEADER/METAL CAN	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
OP070000C	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
OP07R000C	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Jul 30, 2025 - 25_0176 OP07S and OP77S Aerospace Models Change in Wafer Diameter
		PCN25_0176_Form Material_Report Qualification Plan
5962R9863901VGA	PRODUCTION
5962R9863901VHA	PRODUCTION
5962R9863901VPA	PRODUCTION
OP070000C	PRODUCTION
OP07R000C	PRODUCTION
Sep 29, 2022 - 22_0195 Shipment Carrier Change for TO-99 Header Package
		PCN22_0195_Form Material_Report Qualification Results Summary
5962R9863901VGA	PRODUCTION
Oct 18, 2019 - 19_0226 OP07 Output Voltage Swing Datasheet Clarification for Aerospace and JANB Models.
		PCN19_0226_Form Material_Report
5962R9863901VGA	PRODUCTION
5962R9863901VHA	PRODUCTION
5962R9863901VPA	PRODUCTION
JM38510/13501BGA	PRODUCTION
JM38510/13501BPA	PRODUCTION
JM38510/13502BGA	PRODUCTION
Jul 30, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
		PCN16_0026_Form Material_Report Qualification Results Summary
5962R9863901VGA	PRODUCTION
5962R9863901VHA	PRODUCTION
5962R9863901VPA	PRODUCTION
OP070000C	PRODUCTION
OP07R000C	PRODUCTION
Oct 29, 2017 - 17_0079 Qualification of TeamQuest Technology Inc., Philippines as an Alternate Test Site for TC-Vos Testing
		PCN17_0079_Form Material_Report Test Correlation Report
5962R9863901VGA	PRODUCTION
5962R9863901VHA	PRODUCTION
Nov 18, 2015 - 15_0219 Laser Marking Standardization for Aerospace Packages
		PCN15_0219_Form Material_Report Qualification Results Summary
5962R9863901VGA	PRODUCTION
5962R9863901VHA	PRODUCTION
5962R9863901VPA	PRODUCTION
JM38510/13501BGA	PRODUCTION
JM38510/13501BPA	PRODUCTION
JM38510/13502BGA	PRODUCTION
OP070000C	PRODUCTION
OP07R000C	PRODUCTION
Oct 2, 2013 - 13_0163 Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices
		PCN13_0163_Form Material_Report Qualification Plan Summary
5962R9863901VGA	PRODUCTION
5962R9863901VHA	PRODUCTION
5962R9863901VPA	PRODUCTION
Nov 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
		PCN11_0050_Form Material_Report
5962R9863901VGA	PRODUCTION
5962R9863901VHA	PRODUCTION
5962R9863901VPA	PRODUCTION
JM38510/13501BGA	PRODUCTION
JM38510/13501BPA	PRODUCTION
JM38510/13502BGA	PRODUCTION
Nov 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
		PCN11_0182_Form Material_Report
5962R9863901VGA	PRODUCTION
5962R9863901VHA	PRODUCTION
5962R9863901VPA	PRODUCTION
JM38510/13501BGA	PRODUCTION
JM38510/13501BPA	PRODUCTION
JM38510/13502BGA	PRODUCTION
Nov 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
		PCN12_0199_Form Material_Report Qualification Report Summary Datasheet Specification Comparison
5962R9863901VHA	PRODUCTION
5962R9863901VPA	PRODUCTION
JM38510/13501BPA	PRODUCTION
Sep 21, 2009 - 09_0188 Change of Bottom Brand from Ink to Laser for Aerospace Cerpak Packages
		09_0188supportingInfo Material_Report PCN09_0188_Form
5962R9863901VHA	PRODUCTION	09_0188supportingInfo Material_Report PCN09_0188_Form
Feb 9, 2009 - 08_0073 Change of Seal Glass Material for Cerdip & Cerpak Packages
		08_0073AQualPlan Material_Report PCN08_0073_Form
5962R9863901VHA	PRODUCTION
5962R9863901VPA	PRODUCTION
Aug 11, 2025 - 25_0151 Qualification of Wafer Fabrication Site Analog Devices, Inc. Camas WA for (6um Bipolar) Products
		PCN25_0151_Form Material_Report Qualification Results Summary
JM38510/13501BGA	PRODUCTION
JM38510/13501BPA	PRODUCTION
JM38510/13502BGA	PRODUCTION
Apr 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
		PCN16_0026_Form Material_Report Qualification Results Summary
JM38510/13501BGA	PRODUCTION
JM38510/13501BPA	PRODUCTION
JM38510/13502BGA	PRODUCTION
Jun 6, 2012 - 12_0066 Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite
		PCN12_0066_Form Material_Report Qualification Report Summary
JM38510/13501BGA	PRODUCTION
JM38510/13501BPA	PRODUCTION
JM38510/13502BGA	PRODUCTION
Jun 1, 2011 - 11_0088 Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages
		PCN11_0088_Form Material_Report Marking Comparison
JM38510/13501BGA	PRODUCTION
JM38510/13502BGA	PRODUCTION
Feb 1, 2010 - 09_0196 Change In Location of Q Compliance Indicator Location for JAN/38510 Product
		Material_Report PCN09_0196_Form QMarkSupportingInfo
JM38510/13501BGA	PRODUCTION
JM38510/13501BPA	PRODUCTION
JM38510/13502BGA	PRODUCTION
Jul 31, 2009 - 09_0106 Removal of Die Fab Code from Topside Marking of Remaining Mil-Grade Products
		09_0106Supporting Material_Report PCN09_0106_Form
JM38510/13501BGA	PRODUCTION
JM38510/13501BPA	PRODUCTION
JM38510/13502BGA	PRODUCTION

This is the most up-to-date revision of the Data Sheet.

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OP07

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