MAX32666
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MAX32666

Low-Power ARM Cortex-M4 with FPU-Based Microcontroller with Bluetooth 5 for Wearables

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Generation UB MCUs are Built to Run Complex Applications Demanded by Battery-Powered and Wirelessly Connected Devices

Info : RECOMMENDED FOR NEW DESIGNS tooltip
Info : RECOMMENDED FOR NEW DESIGNS tooltip
Part Details
Part Models 8
1ku List Price Starting From $7.48
Features
  • High-Efficiency Microcontroller and Audio DSP for Wearable and Hearable Devices
    • Arm Cortex-M4 with FPU Up to 96MHz
    • Optional Second Arm Cortex-M4 with FPU Optimized for Data Processing
    • Low-Power 7.3728MHz System Clock Option
    • 1MB Flash, Organized into Dual Banks 2 x 512KB
    • 560KB SRAM; 3 x 16KB Cache
  • Bluetooth 5 Low Energy Radio
    • 1Mbps and 2Mbps Data Throughput
    • Long Range (125kbps and 500kbps)
    • Advertising Extension
    • Rx Sensitivity: -95dbm; Tx Power Up to +4.5dbm
    • On-Chip Matching with Single-Ended Antenna Port
  • Power Management Maximizes Operating Time for Battery Applications
    • Integrated SIMO SMPS for Coin-Cell Operation
    • Dynamic Voltage Scaling Minimizes Active Core Power Consumption
    • 27.3µA/MHz at 3.3V Executing from Cache
    • Selectable SRAM Retention in Low Power Modes with RTC Enabled
  • Multiple Peripherals for System Control
    • Three QSPI Master/Slave with Three Chip Selects Each, Three 4-Wire UARTs, Three I2C Master/Slave, Up to 50 GPIOs
    • QSPI (SPIXF) with Real-Time Flash Decryption
    • QSPI (SPIXR) RAM Interface Provides SRAM Expansion
    • 8-Input, 10-Bit Delta-Sigma ADC 7.8ksps
    • USB 2.0 HS Engine with Internal Transceiver
    • PDM Interface Supports Two Digital Microphones
    • I2S with TDM, Six 32-Bit Timers, Two High-Speed Timers, 1-Wire® Master, 16 Pulse Train (PWM) Engines
    • Secure Digital Interface Supports SD3.0/SDIO3.0/eMMC4.51
  • Secure Valuable IP/Data with Hardware Security
    • Trust Protection Unit (TPU) with MAA Supports Fast ECDSA and Modular Arithmetic
    • AES/SHA-2/DES/3DES Hardware Accelerator
    • TRNG Seed Generator
  • Ensure Software Integrity and Loading
    • Secure Bootloader (SCPBL)
    • Secure Boot
Additional Details
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DARWIN is a new breed of low-power microcontrollers built to thrive in the rapidly evolving Internet of Things (IoT). They are smart, with the biggest memories in their class and a massively scalable memory architecture. They run forever, thanks to wearable-grade power technology. They are durable enough to withstand the most advanced cyberattacks. DARWIN microcontrollers are designed to run any application imaginable—in places where you would not dream of sending other microcontrollers.

Generation UB microcontrollers are designed to handle the increasingly complex applications demanded by today's advanced battery-powered devices and wirelessly connected devices, while providing robust hardware security and Bluetooth® 5 Low Energy (Bluetooth LE) radio connectivity.

The MAX32665/MAX32666 UB class microcontrollers are advanced systems-on-chips featuring an Arm® Cortex®-M4 with FPU CPU for efficient computation of complex functions and algorithms with integrated power management. They also include the newest generation Bluetooth 5 LE radio with high throughput (2Mbps) and ADI's best-in-class hardware security suite trust protection unit (TPU). The devices offer large on-board memory with 1MB flash and 560KB SRAM. Split flash banks of 512KB each support seamless over-the-air upgrades, adding an additional degree of reliability. Memory scalability of data (SRAM) and code (flash) space is supported by two SPI execute-in-place (SPIX) interfaces.

Multiple high-speed interfaces are supported including HS-USB, secure digital interface (SD, SDIO, MMC, SDHC, and microSD™), SPI, UART, and I2C serial interfaces, and an audio subsystem supporting PDM, PCM, I2S, and TDM interfaces. An 8-input, 10-bit ADC is available to monitor analog inputs from external sensors and meters. The devices are available in 109-bump WLP (0.35mm pitch) and 121-bump CTBGA (0.65mm pitch).

Applications

  • Connected Home
  • Gaming Devices
  • Hearables
  • Industrial Sensors
  • Payment/Fitness/Medical Wearables
  • Telemedicine
Part Models 8
1ku List Price Starting From $7.48

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Documentation

Documentation

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Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
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Product Lifecycle

PCN

Mar 19, 2020

- 2032

DESIGN,ELECTRICAL DA

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PRODUCTION

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Software & Part Ecosystem

Software & Part Ecosystem

Evaluation Kit

Evaluation Kits 3

reference details image

AD-PAARRAY3552R-SL

RF Front-end GaN Power Amplifier Biasing, Protection, and Control Reference Design

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AD-PAARRAY3552R-SL

RF Front-end GaN Power Amplifier Biasing, Protection, and Control Reference Design

RF Front-end GaN Power Amplifier Biasing, Protection, and Control Reference Design

Features and Benefits

  • Designed to cover full Tx signal chains with integrated MCU and user-friendly GUI for faster and easier integration
  • Supports fault event protection - overvoltage (OV), overcurrent (OC), and overtemperature (OT)
  • Supports ultrafast sub-µs GaN gate voltage switching ~ (<1 µs)
  • Supports ultrafast (<10 µs) fault event protection from detection up to GaN gate pinch-off
  • Wide range of gate bias voltages from -10 V to +10 V
  • Configurable power-up and power-down sequence

Product Detail

The AD-PAARRAY3552R-SL reference design provides control, protection, and proper biasing sequence for GaN power amplifier (PA) arrays. The design incorporates the AD3553R high-speed, dual-channel, 16-bit DAC to support the ultrafast sub-µs voltage settling time of GaN gates.

Key fault events, including overvoltage, overcurrent, and overtemperature, are effectively managed by the LTC7000, a static switch driver responsible for system fault protection.

The on-board MAX32666 ultralow-power ARM® Cortex®-M4 microprocessor provides essential debug and programming features for a comprehensive software development experience with the system. The system's firmware is built on ADI's open-source no-OS framework and includes a user-friendly graphical interface (GUI) for evaluation. Updates are easily applied through an SWD UART bootloader, streamlining prototyping.

The system can be powered by an external +48 V supply, requiring high current capabilities.

APPLICATIONS

  • 5G massive MIMOs
  • Macro base stations
Specifications
Fault Events
Fault Default Limit
Overvoltage +55 V
Overcurrent 3.5 A
Overtemperature 75°C
Output Ports
Port Name No. of ports
GaN gate ports 6
+48 V Gan drain ports 4
+5 V ports 5
Enable ports 2
Power Supply
External +48 V DC at 5 A
Operating Conditions
Temperature Range 45°C to +75°C
reference details image

MAX32666EVKIT

Evaluation Kit for the MAX32665/MAX32666/MAX32667/MAX32668

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MAX32666EVKIT

Evaluation Kit for the MAX32665/MAX32666/MAX32667/MAX32668

Evaluation Kit for the MAX32665/MAX32666/MAX32667/MAX32668

Features and Benefits

  • Bluetooth SMA connector with a 2.4GHz Hinged Whip Antenna
  • 1.28in 128 × 128 Monochrome TFT Display
  • 64MB XIP Flash
  • 1MB XIP RAM
  • Stereo Audio Codec with Line-In and Line-Out 3.5mm Jacks
  • Digital Audio Microphone
  • USB 2.0 Micro B Interface
  • USB 2.0 Micro B to Serial UARTs
    • Selection with Jumpers Between UART1 and UART2
  • Micro SD Card Interface
  • Select GPIOs Accessed Through a 0.1in Header
  • Access to the 8 Analog Inputs Through a 0.1in Header
  • Arm® or SWD JTAG 20-Pin Header
  • 1-Wire RJ11 Port
  • Can Be Solely Sourced by a Coin Cell Battery
  • Board Power Provided by Either USB Port
  • Individual Power Measurement on All IC Rails Through Jumpers
  • On-Board 1.8V and 3.3V Regulators
  • Two General-Purpose LEDs and Two General-Purpose Pushbutton Switches

Product Detail

The MAX32666 EV kit provides a platform for evaluat- ing the capabilities of the MAX32665 and MAX32666 high-efficiency Arm® microcontrollers and audio DSP for wearable and hearable device applications.

Applications

  • Connected Home
  • Gaming Devices
  • Hearables
  • Industrial Sensors
  • Payment/Fitness/Medical Wearables
  • Telemedicine

MAX32666FTHR

Evaluation Kit for the MAX32666

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MAX32666FTHR

Evaluation Kit for the MAX32666

Evaluation Kit for the MAX32666

Features and Benefits

  • MAX32666 Microcontroller
    • Dual Arm Cortex-M4F, 96MHz
    • 1MB Flash Memory
    • 560KB SRAM
    • 3 x 16KB Cache
    • Bluetooth 5 Low Energy Radio
    • High-Speed USB 2.0
    • Three QSPI Master/Slave
    • Three I2C Master/Slave
    • Three UARTS
    • SD/SDIO 3.0
    • 1-Wire® Master
    • 48 GPIO
    • 8 Input, 10-Bit ADC
  • MAX1555 1-Cell Li+ Battery Charger
    • Charge from USB
    • On-Chip Thermal Limiting
    • Charge Status Indicator
  • Expansion Connections
    • Breadboard Compatible Headers
    • 10-Pin Cortex Debug Header
    • Micro USB Connector
    • Micro SD Card Connector
  • Integrated Peripherals
    • RGB Indicator LED
    • User Pushbutton
    • 6-Axis Accelerometer/Gyro
    • Bluetooth Surface Mount Antenna
  • SWD/MAXDAP Debug Interface
    • Drag-and-Drop Programming
    • SWD Debugger
    • Virtual UART Console

Product Detail

The MAX32666FTHR board is a rapid development platform to help engineers quickly implement battery optimized Bluetooth® 5 solutions with the MAX32666 Arm® Cortex®-M4 processor with FPU. The board also includes the MAX1555 1-Cell Li+ battery charger for battery management. The form factor is a small 0.9in by 2.0in dual-row header footprint that is compatible with breadboards and off-the-shelf peripheral expansion boards. The board also includes a variety of peripherals, such as a micro SD card connector, 6-axis accelerometer/gyro, RGB indicator LED, and pushbutton. This platform provides power-optimized flexible for quick proof-of-concepts and early software development to enhance time to market.

Applications

  • Connected Home
  • Gaming Devices
  • Hearables
  • Industrial Sensors
  • Payment/Fitness/Medical Wearables
  • Telemedicine
Reference Designs

Reference Designs 3

MAXREFDES106 Health Sensor Platform 4.0

Health Sensor Platform 4.0

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MAXREFDES106

Health Sensor Platform 4.0

Health Sensor Platform 4.0

Features and Benefits

Features

  • Photoplethysmography (PPG)
  • Biopotential Measurement (ECG)
  • Bioimpedance Measurement (BioZ)
  • Skin and Ambient Temperature
  • Embedded Heart Rate (HR), Respiration Rate (RR), Oxygen Saturation (SpO2), Impedance Cardiography (ICG), and Body Impedance Analysis (BIA) Algorithms
  • Location Finder to Determine the Optimal Placement Location on the Chest
  • Motion and Acceleration
  • Chest-Worn Form Factor

Application

  • Remote Patient Monitoring/Vital Sign Patch
View Detailed Reference Design external link

Design & Integration Tools

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ZIP

12.59 M

Videos

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Feb 08, 2023

02:38

Body Vitals on Wearables: Your Body, Talking to You

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Nov 30, 2023

04:23

Unboxing MAXREFDES106

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Dec 13, 2022

03:29

Unboxing the Health Sensor Platform 4.0 (HSP4.0) / MAXREFDES106

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Dec 13, 2022

02:28

ADI´s Health Sensor Platform 4.0

Health Sensor Platform 3.0

Health Sensor Platform 3.0

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MAXREFDES104

Health Sensor Platform 3.0

Health Sensor Platform 3.0

Features and Benefits

Features

  • Photoplethysmography (PPG)
  • Biopotential measurement (ECG)
  • Skin temperature measurement
  • Embedded heart-rate (HRM) and oxygen saturation (SpO2) algorithms
  • Motion and acceleration
  • Wearable form factor

What's in the Box

  • Complete Assembled Wearable
  • BLE USB Dongle (CY5677)
  • USB-A to USB-C cable
  • USB-A to Micro-USB cable
  • Programmer Board (MAXDAP-USB-C)
View Detailed Reference Design external link

Design & Integration Tools

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ZIP

50.66 M

Videos

Thumbnail Image

Oct 04, 2022

02:35

MAXREFDES104: Health Sensor Platform 3.0

MAXREFDES178: Artificial Intelligence Applications

Artificial Intelligence Applications

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MAXREFDES178

Artificial Intelligence Applications

Artificial Intelligence Applications

Features and Benefits

  • Two MAX78000 ARM Cortex M4F Microcontrollers with CNN Accelerator
  • BLE5 Wireless Connectivity
  • Li-Ion Battery Powered
  • Color Image Sensor
  • Digital Microphone
  • Multiple audio codecs with stereo audio input and output
  • Color TFT Capacitive Touch LCD
  • Micro SD Connector
  • On-Board QSPI FLASH and QSPI SRAM
View Detailed Reference Design external link

Design & Integration Tools

pdf icon

ZIP

12.92 M

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