DAC08S
PRODUCTIONAerospace 8-Bit High Speed Multiplying DAC
- Part Models
- 12
- 1ku List Price
- price unavailable
Part Details
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The DAC-08 series of 8-bit monolithic digital-to-analog converters provide very high-speed performance coupled with low cost and outstanding applications flexibility.
Advanced circuit design achieves 85 ns typical settling times with very low "glitch" energy and at low power consumption. Monotonic multiplying performance is attained over a wide 20 to 1 reference current range. Matching to within 1 LSB between reference and full-scale currents eliminates the need for full-scale trimming in most applications. Direct interface to all popular logic families with full noise immunity is provided by the high swing, adjustable threshold logic input.
High voltage compliance complementary current outputs are provided, increasing versatility and enabling differential operation to effectively double the peak-to-peak output swing. In many applications, the outputs can be directly converted to voltage without the need for an external op amp.
All DAC08 series models guarantee full 8-bit monotonicity, and nonlinearities as tight as ±0.1% over the entire operating temperature range are available. Device performance is essentially unchanged over the ±4.5 V to ±18 V power supply range, with 33 mW power consumption attainable at ±5 V supplies.
Documentation
Data Sheet 1
Cross Reference Guide 1
High Dose Rate Radiation Reports 1
Low Dose Rate Radiation Reports 1
Radiation Report 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
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5962L8993203VFA | 16-Lead Flatpak Glass Sealed (Hermetic) | ||
5962R8993201V2A | 20-Lead LCC | ||
5962R8993201VEA | 20 ld LCC | ||
5962R8993201VFA | 16-Lead Flatpak Glass Sealed (Hermetic) | ||
5962R8993202V2A | 20-Lead LCC | ||
5962R8993202VEA | 20 ld LCC | ||
5962R8993202VFA | 16-Lead Flatpak Glass Sealed (Hermetic) | ||
DAC080000C | CHIPS OR DIE | ||
DAC08AF-EMX | 16-Lead Flatpak Glass Sealed (Hermetic) | ||
DAC08ARC-EMX | 20-Lead LCC | ||
DAC08R000C | CHIPS OR DIE | ||
JM38510/11302SEA | CERDIP GLASS SEAL |
Part Models | Product Lifecycle | PCN |
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No Match Found | ||
Jul 30, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices |
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5962L8993203VFA | ||
5962R8993201V2A | ||
5962R8993201VEA | ||
5962R8993201VFA | ||
5962R8993202V2A | ||
5962R8993202VEA | ||
5962R8993202VFA | ||
DAC080000C | ||
DAC08AF-EMX | ||
DAC08R000C | ||
JM38510/11302SEA | ||
Nov 18, 2015 - 15_0219 Laser Marking Standardization for Aerospace Packages |
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5962L8993203VFA | ||
5962R8993201V2A | ||
5962R8993201VEA | ||
5962R8993201VFA | ||
5962R8993202V2A | ||
5962R8993202VEA | ||
5962R8993202VFA | ||
DAC080000C | ||
DAC08AF-EMX | ||
DAC08R000C | ||
JM38510/11302SEA | ||
Oct 2, 2013 - 13_0163 Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices |
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5962L8993203VFA | ||
5962R8993201V2A | ||
5962R8993201VEA | ||
5962R8993201VFA | ||
5962R8993202V2A | ||
5962R8993202VEA | ||
5962R8993202VFA | ||
DAC08AF-EMX | ||
JM38510/11302SEA | ||
Nov 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines |
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5962R8993201V2A | ||
5962R8993201VEA | ||
5962R8993201VFA | ||
5962R8993202V2A | ||
5962R8993202VEA | ||
5962R8993202VFA | ||
DAC08AF-EMX | ||
JM38510/11302SEA | ||
Nov 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines |
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5962R8993201V2A | ||
5962R8993201VEA | ||
5962R8993201VFA | ||
5962R8993202V2A | ||
5962R8993202VEA | ||
5962R8993202VFA | ||
DAC08AF-EMX | ||
JM38510/11302SEA | ||
Jun 1, 2011 - 11_0088 Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages |
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5962R8993201V2A | ||
5962R8993202V2A | ||
Nov 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages. |
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5962R8993201VEA | ||
5962R8993201VFA | ||
5962R8993202VEA | ||
5962R8993202VFA | ||
JM38510/11302SEA | ||
Feb 9, 2009 - 08_0073 Change of Seal Glass Material for Cerdip & Cerpak Packages |
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5962R8993201VEA | ||
5962R8993201VFA | ||
5962R8993202VEA | ||
5962R8993202VFA | ||
DAC08AF-EMX | ||
JM38510/11302SEA | ||
Jul 27, 2011 - 11_0198 Change to DAC08A Non-linearity test limits for Device Type 02, QMLR and JANS only. |
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5962R8993202V2A | ||
5962R8993202VEA | ||
5962R8993202VFA | ||
JM38510/11302SEA | ||
Sep 21, 2009 - 09_0188 Change of Bottom Brand from Ink to Laser for Aerospace Cerpak Packages |
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5962R8993202VFA | ||
Feb 1, 2010 - 09_0196 Change In Location of Q Compliance Indicator Location for JAN/38510 Product |
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JM38510/11302SEA |
This is the most up-to-date revision of the Data Sheet.