ADUC7020
PRODUCTIONPrecision Analog Microcontroller, 12-Bit Analog I/O, ARM7TDMI® MCU
- Part Models
- 5
- 1ku List Price
- Starting From $9.11
Part Details
- Analog I/O
Multichannel, 12-bit, 1 MSPS ADC
Up to 16 ADC channels
Fully differential and single-ended modes
0 V to VREF analog input range12-bit voltage output DACs
Up to 4 DAC outputs available
On-chip voltage reference
On-chip temperature sensor (±3°C)
Voltage comparator
- Microcontroller
ARM7TDMI core, 16-bit/32-bit RISC architecture
JTAG port supports code download and debug - Clocking options
Trimmed on-chip oscillator (±3%)
External watch crystal
External clock source up to 44 MHz
41.78 MHz PLL with programmable divider - See datasheet for additional features
The ADuC7019 / ADuC7020 / ADuC7021 / ADuC7022 / ADuC7024 / ADuC7025 / ADuC7026 / ADuC7027 / ADuC7028 / ADuC7029 are fully integrated, 1 MSPS, 12-bit data acquisition systems incorporating high performance multichannel ADCs, 16-bit/32-bit MCUs, and Flash®/EE memory on a single chip.
The ADC consists of up to 12 single-ended inputs. An additional four inputs are available but are multiplexed with the four DAC output pins. The four DAC outputs are available only on certain models (ADuC7020, ADuC7026, ADuC7028, and ADuC7029). However, in many cases where the DAC outputs are not present, these pins can still be used as additional ADC inputs, giving a maximum of 16 ADC input channels. The ADC can operate in single-ended or differential input mode. The ADC input voltage is 0 V to VREF. A low drift band gap reference, temperature sensor, and voltage comparator complete the ADC peripheral set.
Depending on the part model, up to four buffered voltage output DACs are available on-chip. The DAC output range is programmable to one of three voltage ranges.
The devices operate from an on-chip oscillator and a PLL generating an internal high frequency clock of 41.78 MHz (UCLK). This clock is routed through a programmable clock divider from which the MCU core clock operating frequency is generated. The microcontroller core is an ARM7TDMI®, 16-bit/32-bit RISC machine, which offers up to 41 MIPS peak performance. Eight kilobytes of SRAM and 62 kilobytes of nonvolatile Flash/EE memory are provided on-chip. The ARM7TDMI core views all memory and registers as a single linear array.
On-chip factory firmware supports in-circuit serial download via the UART or I2C serial interface port; nonintrusive emulation is also supported via the JTAG interface. These features are incorporated into a low cost QuickStart™ development system supporting this MicroConverter® family.
The parts operate from 2.7 V to 3.6 V and are specified over an industrial temperature range of −40°C to +125°C. When operating at 41.78 MHz, the power dissipation is typically 120 mW. The ADuC7019 / ADuC7020 / ADuC7021 / ADuC7022 / ADuC7024 / ADuC7025 / ADuC7026 / ADuC7027 / ADuC7028 / ADuC7029 are available in a variety of memory models and packages (see Ordering Guide).
APPLICATIONS
- Industrial control and automation systems
- Smart sensors, precision instrumentation
- Base station systems, optical networking
Documentation
Data Sheet 1
Application Note 13
Technical Articles 5
Circuit Note 2
Analog Dialogue 5
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
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ADUC7020BCPZ62 | 40-Lead LFCSP (6mm x 6mm w/ EP) | ||
ADUC7020BCPZ62-RL7 | 40-Lead LFCSP (6mm x 6mm w/ EP) | ||
ADUC7020BCPZ62I | 40-Lead LFCSP (6mm x 6mm w/ EP) | ||
ADUC7020BCPZ62I-RL | 40-Lead LFCSP (6mm x 6mm w/ EP) | ||
ADUC7020BCPZ62IRL7 | 40-Lead LFCSP (6mm x 6mm w/ EP) |
Part Models | Product Lifecycle | PCN |
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No Match Found | ||
Nov 10, 2022 - 22_0277 Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages |
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ADUC7020BCPZ62 | PRODUCTION | |
ADUC7020BCPZ62-RL7 | PRODUCTION | |
ADUC7020BCPZ62I | PRODUCTION | |
ADUC7020BCPZ62I-RL | PRODUCTION | |
ADUC7020BCPZ62IRL7 | PRODUCTION | |
Aug 1, 2016 - 16_0035 Assembly Relocation of Select LFCSP, Mini-LFCSP and LFCSP Side Solderable Products to STATS ChipPAC China Jiangyin |
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ADUC7020BCPZ62 | PRODUCTION | |
ADUC7020BCPZ62-RL7 | PRODUCTION | |
May 23, 2014 - 13_0233 Assembly Transfer of Select 6x6 and 7x7mm LFCSP Products to STATS ChipPAC China. |
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ADUC7020BCPZ62 | PRODUCTION | |
ADUC7020BCPZ62-RL7 | PRODUCTION | |
Mar 7, 2012 - 10_0241 Conversion of LFCSP package outline from Punch to Sawn of package sizes 4x4, 5x5, 6x6 and 7x7mm and a transfer of assembly site. |
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ADUC7020BCPZ62 | PRODUCTION | |
ADUC7020BCPZ62-RL7 | PRODUCTION | |
ADUC7020BCPZ62I | PRODUCTION | |
ADUC7020BCPZ62I-RL | PRODUCTION | |
ADUC7020BCPZ62IRL7 | PRODUCTION | |
Oct 18, 2016 - 16_0036 Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products |
||
ADUC7020BCPZ62I | PRODUCTION | |
ADUC7020BCPZ62I-RL | PRODUCTION | |
ADUC7020BCPZ62IRL7 | PRODUCTION | |
Aug 6, 2014 - 13_0232 Assembly and Test Transfer of Select 6x6 and 7x7mm LFCSP Products to STATS ChipPAC China |
||
ADUC7020BCPZ62I | PRODUCTION | |
ADUC7020BCPZ62I-RL | PRODUCTION | |
ADUC7020BCPZ62IRL7 | PRODUCTION |
This is the most up-to-date revision of the Data Sheet.
Software Resources
ADuC7019/ADuC702x Code Examples 2