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  5. ADM3252E


Overview

Features and Benefits

  • 2.5 kV fully isolated (power and data) RS-232 transceiver
  • isoPower integrated, isolated dc-to-dc converter
  • Operational from single 3.3 V or 5 V supply
  • 460 kbps data rate
  • 2 × Tx and 2 × Rx channels
  • ESD protection on RINx and TOUTx pins
    Contact discharge: ±8 kV
    Air gap discharge: ±15 kV
  • 0.1 μF charge pump capacitors
  • High common-mode transient immunity: >25 kV/μs
  • Operating temperature range: −40°C to +85°C
  • 44-ball chip scale package ball grid array (CSP_BGA)
  • Meets EIA/TIA-232E specifications
  • See data sheet for additional features

Product Details

The ADM3252E is a high speed, 2.5 kV fully isolated, dual-channel RS-232/V.28 transceiver device that is operational from a single 3.3 V or 5 V power supply. Because of high ESD protection on the RIN1, RIN2, TOUT1, and TOUT2 pins, the ADM3252E is ideally suited for operation in electrically harsh environments or where RS-232 cables are frequently plugged and unplugged.

The ADM3252E provides four independent isolation channels using the integrated and isolated power of isoPower. There is no requirement to use a separate isolated dc-to-dc converter. Chip scale transformer iCoupler® technology from Analog Devices, Inc., is used for both the isolation of the logic signals and the integrated dc-to-dc converter. The result is a total isolation solution.

isoPower technology in the ADM3252E uses high frequency switching elements to transfer power through its transformer. Special care must be taken during printed circuit board (PCB) layout to meet emissions standards. Refer to Application Note AN-0971, Recommendations for Control of Radiated Emissions with isoPower Devices, for details on board layout considerations.

The ADM3252E conforms to the EIA/TIA-232E and ITU-T V.28 specifications and operates at data rates of up to 460 kbps. Four external 0.1 μF charge pump capacitors are used for the voltage doubler/inverter, permitting operation from a single 3.3 V or 5 V supply. The ADM3252E is available in a 44-ball, chip scale package ball grid array (CSP_BGA) and is specified over the −40°C to +85°C temperature range.

APPLICATIONS

  • Isolated RS-232 interface
  • High noise data communications
  • Industrial communications
  • Industrial/telecommunications diagnostic ports
  • Medical equipment

Product Lifecycle icon-recommended Production

At least one model within this product family is in production and available for purchase. The product is appropriate for new designs but newer alternatives may exist.

Evaluation Kits (2)

Documentation & Resources

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  • Data Sheets (1)
  • Application Notes (1)
  • User Guides (3)
  • Safety and Regulatory Compliance (1)
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  • Circuit Note (1)
  • Videos (1)
  • Press Releases (1)
  • Technical Articles (2)
  • Webcasts (1)
  • Reference Designs (1)

    Design Resources

    ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well.  "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.

    Part Number Material Declaration Reliability Data Pin/Package Drawing CAD Symbols, Footprints & 3D Models
    ADM3252EABCZ Material Declaration Reliability Data 44-Ball CSPBGA (12mm x 12mm x 1.4mm)
    Wafer Fabrication Data

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