ADG819

PRODUCTION

0.5 Ω CMOS 1.8 V to 5.5 V 2:1 Mux/SPDT Switch with BBM Switching Action

Data Sheet (Rev. A) Product Selection Table

Part Models: 6
1ku List Price: Starting From $1.25

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Overview

Low On Resistance 0.8 O Max at 125°C
0.25 Ω Max On-Resistance Flatness
+1.8 V to +5.5 V Single Supply
200 mA Current Carrying Capability
Automotive Temperature Range: -40°C to +125°C
Rail-to-Rail Operation
Fast Switching Times

6-Lead SOT-23 Package, 8-Lead µSOIC
Package, and 6-Bump MicroCSP (Micro Chip Scale Package)
Typical Power Consumption (<0.01 µW)
TTL/CMOS Compatible Inputs
Pin Compatible with the ADG719

The ADG819 is a monolithic, CMOS SPDT (single pole, double throw) switch. This switch is designed on a submicron process, that provides low power dissipation yet gives high switching speed, low On Resistance and low leakage currents. Low-power consumption and operating supply range of +1.8 V to +5.5 V make the ADG819 ideal for battery-powered, portable instruments.

Each switch of the ADG819 conducts equally well in both directions when on. The ADG819 exhibits break-before- make switching action, thus preventing momentary shorting when switching channels. (See the ADG820 for a switch exhibiting make-before-break action.)

The ADG819 is available in a 6-lead SOT-23 package and an 8-lead µSOIC package as well as a 2×3 array MicroCSP package. This chip occupies only a 2.18mm × 1.14mm area, thus making it the ideal candidate for space-constrained applications.

Part Models: 6
1ku List Price: Starting From $1.25

Documentation

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
ADG819BCBZ-REEL7	6-Ball WLCSP (1.14mm x 2.18mm)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADG819BRMZ	8-Lead MSOP	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADG819BRMZ-REEL7	8-Lead MSOP	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADG819BRTZ-500RL7	6-Lead SOT-23	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADG819BRTZ-REEL	6-Lead SOT-23	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADG819BRTZ-REEL7	6-Lead SOT-23	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Nov 27, 2009 - 09_0244 ADG819 metal and via mask change
		Material_Report PCN09_0244_Form Qual Plan
ADG819BCBZ-REEL7	PRODUCTION
ADG819BRMZ	PRODUCTION
ADG819BRMZ-REEL7	PRODUCTION
ADG819BRTZ-500RL7	PRODUCTION
ADG819BRTZ-REEL	PRODUCTION
ADG819BRTZ-REEL7	PRODUCTION
Oct 26, 2015 - 15_0176 Assembly Transfer of Select 8/10L MSOP Products to Amkor Philippines
		PCN15_0176_Form Material_Report Detailed Change Description Qualification Results Summary Qualification Results Summary
ADG819BRMZ	PRODUCTION
ADG819BRMZ-REEL7	PRODUCTION
Feb 8, 2010 - 04_0080 Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.
		PCN04_0080_Form Material_Report Reliability Report Reliability Report
ADG819BRMZ	PRODUCTION
ADG819BRMZ-REEL7	PRODUCTION
ADG819BRTZ-500RL7	PRODUCTION
ADG819BRTZ-REEL7	PRODUCTION
May 15, 2012 - 10_0006 Halogen Free Material Change for mini SOIC Products
		PCN10_0006_Form Material_Report Qualification Report Summary Qualification Report Summary
ADG819BRMZ-REEL7	PRODUCTION
Mar 27, 2019 - 18_0064 Bump Site Transfer and Qualification of Select 6L and 8L SOT23 Flip Chip on Lead Packages
		PCN18_0064_Form Material_Report Qualification Plan Qualification Plan Detailed Change Description Delta Qualification Matrix Qualification Results Summary Qualification Results Summary
ADG819BRTZ-500RL7	PRODUCTION
ADG819BRTZ-REEL	PRODUCTION
ADG819BRTZ-REEL7	PRODUCTION
Apr 20, 2016 - 16_0021 Addition of Amkor Philippines as Alternate Assembly Site for 5L,6L and 8L SOT23 Packages
		PCN16_0021_Form Material_Report Detailed Change Description Qualification Results Summary
ADG819BRTZ-500RL7	PRODUCTION
ADG819BRTZ-REEL	PRODUCTION
ADG819BRTZ-REEL7	PRODUCTION
Feb 4, 2010 - 10_0009 Halogen Free Material Change for SOT_23 Products
		Material_Report PCN10_0009_Form SOT23 Qualification Data
ADG819BRTZ-500RL7	PRODUCTION
ADG819BRTZ-REEL	PRODUCTION
ADG819BRTZ-REEL7	PRODUCTION

This is the most up-to-date revision of the Data Sheet.

Software Resources

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Tools & Simulations

LTspice

Models for the following parts are available in LTspice:

ADG819

SPICE Model 1

ADG819 SPICE Macro Model

LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.

Evaluation Kits

Evaluation Board for 6 lead SOT23 Devices in the Switches/Multiplexers Portfolio

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Features and Benefits

6 lead SOT-23 evaluation board
Clamp to allow the main device to be changed easily
Gold pin connectors to allow the addition of passive components
SMB connectors for the input/output of signals
Additional space on board to allow for prototypin

Product Details

The EVAL-6SOT23EBZ evaluation board evaluates 6-lead SOT-23 devices in the Switches and Multiplexers Portfolio that are purchased separately. A clamp is supplied with the EVAL-6SOT23EBZ to secure a 6-lead SOT-23 device to the evaluation board without the need for soldering, making the board reusable for multiple devices.

A device can be clamped or soldered to the center of the evaluation board. Each pin of the device has a corresponding link from K1 to K6 that can be set to either VDD or GND. A wire screw terminal supplies VDD and GND. SMB connectors on the board allow additional external signals to be supplied to the device. In addition, there is space available at the top of the board for prototyping.

Full specifications of the device under test (DUT) are available in the corresponding product data sheet, which should be consulted in conjunction with user guide UG- 948 when using the evaluation board.