ADG2128
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ADG2128

I2C CMOS 8 X 12 Analog Switch Array with Dual/Single Supplies

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Info: : PRODUCTION tooltip
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Part Models 5
1ku List Price Starting From $7.58
Features
  • I2C compatible interface 
    • 3.4 MHz high speed I2C option
  • 32-lead LFCSP (5 mm × 5 mm)
  • Double-buffered input logic 
  • Simultaneous update of multiple switches
  • Up to 300 MHz bandwidth
  • Fully specified at dual ±5 V/single +12 V operation
  • On resistance 35 Ω maximum
  • Low quiescent current < 20 μA
  • Qualified for automotive applications
Additional Details
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The ADG2128 is an analog cross point switch with an array size of 8 × 12. The switch array is arranged so that there are eight columns by 12 rows, for a total of 96 switch channels. The array is bidirectional, and the rows and columns can be configured as either inputs or outputs. Each of the 96 switches can be addressed and configured through the I2C compatible interface. Standard, full speed, and high speed (3.4 MHz) I2C interfaces are supported. Any simultaneous switch combination is allowed. An additional feature of the ADG2128 is that switches can be updated simultaneously, using the LDSW command. In addition, a RESET option allows all of the switch channels to be reset/off. At power-on, all switches are in the off condition. The device is packaged in a 32-lead, 5 mm × 5 mm LFCSP.

APPLICATIONS

  • AV switching in TV
  • Automotive infotainment
  • AV receivers
  • CCTV
  • Ultrasound applications
  • KVM switching
  • Telecom applications
  • Test equipment/instrumentation
  • PBX systems
Part Models 5
1ku List Price Starting From $7.58

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Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADG2128BCPZ-HS-RL7
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ADG2128BCPZ-REEL
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ADG2128BCPZ-REEL7
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ADG2128WBCPZ-REEL7
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ADG2128YCPZ-REEL7
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Part Models

Product Lifecycle

PCN

Nov 10, 2014

- 14_0047

Conversion of 5x5mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.

ADG2128BCPZ-HS-RL7

PRODUCTION

ADG2128BCPZ-REEL

PRODUCTION

ADG2128BCPZ-REEL7

PRODUCTION

ADG2128YCPZ-REEL7

PRODUCTION

Mar 23, 2012

- 11_0104

Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to ASE-Korea.

Apr 12, 2010

- 09_0224

ADG2128, ADG2188, ADG2108, I2C interface change.

ADG2128BCPZ-HS-RL7

PRODUCTION

ADG2128BCPZ-REEL

PRODUCTION

ADG2128BCPZ-REEL7

PRODUCTION

ADG2128WBCPZ-REEL7

PRODUCTION

ADG2128YCPZ-REEL7

PRODUCTION

Nov 16, 2009

- 06_0157

Qualification of the 8" H6 Thin Film BiPolar Wafer Fab Process at Analog Devices, Limerick, Ireland

ADG2128BCPZ-HS-RL7

PRODUCTION

ADG2128BCPZ-REEL

PRODUCTION

ADG2128BCPZ-REEL7

PRODUCTION

ADG2128WBCPZ-REEL7

PRODUCTION

ADG2128YCPZ-REEL7

PRODUCTION

Feb 15, 2010

- 07_0061

LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC

May 4, 2016

- 14_0178

Conversion of 3x3mm, 4x4mm and 5x5mm LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Nov 10, 2014

- 14_0047

arrow down

Conversion of 5x5mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.

ADG2128BCPZ-HS-RL7

PRODUCTION

ADG2128BCPZ-REEL

PRODUCTION

ADG2128BCPZ-REEL7

PRODUCTION

ADG2128YCPZ-REEL7

PRODUCTION

Mar 23, 2012

- 11_0104

arrow down

Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to ASE-Korea.

Apr 12, 2010

- 09_0224

arrow down

ADG2128, ADG2188, ADG2108, I2C interface change.

ADG2128BCPZ-HS-RL7

PRODUCTION

ADG2128BCPZ-REEL

PRODUCTION

ADG2128BCPZ-REEL7

PRODUCTION

ADG2128WBCPZ-REEL7

PRODUCTION

ADG2128YCPZ-REEL7

PRODUCTION

Nov 16, 2009

- 06_0157

arrow down

Qualification of the 8" H6 Thin Film BiPolar Wafer Fab Process at Analog Devices, Limerick, Ireland

ADG2128BCPZ-HS-RL7

PRODUCTION

ADG2128BCPZ-REEL

PRODUCTION

ADG2128BCPZ-REEL7

PRODUCTION

ADG2128WBCPZ-REEL7

PRODUCTION

ADG2128YCPZ-REEL7

PRODUCTION

Feb 15, 2010

- 07_0061

arrow down

LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC

May 4, 2016

- 14_0178

arrow down

Conversion of 3x3mm, 4x4mm and 5x5mm LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines

Software & Part Ecosystem

Evaluation Kits 1

EVAL-ADG2128

ADG2128 Evaluation Board

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EVAL-ADG2128

ADG2128 Evaluation Board

ADG2128 Evaluation Board

Product Detail

The ADG2128 evaluation board interfaces to the USB port of a PC. Software is available with the evaluation board that allows the user to easily program ADG2128. The EVAL-ADG2128EBZ can be operated    with both single and dual supplies.

Reference Designs 1

CN0565 01 new

Electrical Impedance Tomography Measurement System

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CN0565

Electrical Impedance Tomography Measurement System

CN0565

Circuits from the lab

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Electrical Impedance Tomography Measurement System

Features and Benefits

  • Up to 24 Input Electrodes, Software Selectable 
  • 2-wire or 4-wire Electrode Configuration Supported
  • Real and Imaginary Measurements up to 200 kHz
  • Open Source Image Recreation Algorithms
  • Isolated Power and Digital Domains from the Host
  • Arduino Form Factor Compatible
View Detailed Reference Design external link

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