AD7682
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AD7682

16-Bit, 4-Channel, 250 kSPS PulSAR ADC

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Info: : PRODUCTION tooltip
Info: : PRODUCTION tooltip
Part Details
Part Models 3
1ku List Price Starting From $7.21
Features
  • 16-bit resolution with no missing codes
  • 4-channel (AD7682)/8-channel (AD7689) multiplexer with choice of inputs
  • Unipolar single-ended
  • Differential (GND sense)
  • Pseudobipolar
  • Throughput: 250 kSPS
  • INL: ±0.4 LSB typical, ±1.5 LSB maximum (±23 ppm or FSR)
  • Dynamic range: 93.8 dB
  • SINAD: 92.5 dB at 20 kHz
  • THD: −100 dB at 20 kHz
  • Analog input range: 0 V to VREF with VREF up to VDD
  • Multiple reference types
    • Internal selectable 2.5 V or 4.096 V
    • External buffered (up to 4.096 V)
    • External (up to VDD)
  • Internal temperature sensor (TEMP)
  • Channel sequencer, selectable 1-pole filter, busy indicator
  • No pipeline delay, SAR architecture
  • Single-supply 2.3 V to 5.5 V operation with 1.8 V to 5.5 V logic interface
  • Serial interface compatible with SPI, MICROWIRE, QSPI, and DSP
  • Power dissipation
    • 3.5 mW at 2.5 V/200 kSPS
    • 12.5 mW at 5 V/250 kSPS
  • Standby current: 50 nA
  • Low cost grade available
  • 20-lead 4 mm × 4 mm LFCSP package
  • 20-lead 2.4 mm × 2.4 mm WLCSP package
Additional Details
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The AD7682/AD7689 are 4-channel/8-channel, 16-bit, charge redistribution successive approximation register (SAR) analog-to-digital converters (ADCs) that operate from a single power supply, VDD.

The AD7682/AD7689 contain all components for use in a multichannel, low power data acquisition system, including a true 16-bit SAR ADC with no missing codes; a 4-channel (AD7682) or 8-channel (AD7689) low crosstalk multiplexer that is useful for configuring the inputs as single-ended (with or without ground sense), differential, or bipolar; an internal low drift reference (selectable 2.5 V or 4.096 V) and buffer; a temperature sensor; a selectable one-pole filter; and a sequencer that is useful when channels are continuously scanned in order.

The AD7682/AD7689 use a simple serial port interface (SPI) for writing to the configuration register and receiving conversion results. The SPI interface uses a separate supply, VIO, which is set to the host logic level. Power dissipation scales with throughput.

The AD7682/AD7689 are housed in a tiny 20-lead lead frame chip scale package (LFCSP) and 20-lead wafer level chip scale package (WLCSP) with operation specified from −40°C to +85°C. The AD7689 includes an extended temperature range model with specifications guaranteed to a maximum temperature (TMAX) of +125°C.

APPLICATIONS

  • Multichannel system monitoring
  • Battery-powered equipment
  • Medical instruments: ECG/EKG
  • Mobile communications: GPS
  • Power line monitoring
  • Data acquisition
  • Seismic data acquisition systems
  • Instrumentation
  • Process control
Part Models 3
1ku List Price Starting From $7.21

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
AD7682BCBZ-RL7
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AD7682BCPZ
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AD7682BCPZRL7
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Part Models

Product Lifecycle

PCN

Feb 2, 2024

- 23_0143

Qualification of an Alternate Wafer Fab Site for 0.5um TSMC CMOS Process 

Jul 25, 2017

- 17_0068

CANCELLED: Addition of ASE Korea as an Alternate Assembly Site for Select 3x3mm and 4x4mm Body Sizes LFCSP Devices

May 5, 2014

- 14_0020

Conversion of 4x4mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.

Apr 15, 2009

- 09_0061

AD7682/AD7689/AD7949 Startup Circuitry Design Improvement and Data Sheet Changes

Feb 15, 2010

- 07_0061

LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Feb 2, 2024

- 23_0143

arrow down

Qualification of an Alternate Wafer Fab Site for 0.5um TSMC CMOS Process 

Jul 25, 2017

- 17_0068

arrow down

CANCELLED: Addition of ASE Korea as an Alternate Assembly Site for Select 3x3mm and 4x4mm Body Sizes LFCSP Devices

May 5, 2014

- 14_0020

arrow down

Conversion of 4x4mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.

Apr 15, 2009

- 09_0061

arrow down

AD7682/AD7689/AD7949 Startup Circuitry Design Improvement and Data Sheet Changes

Feb 15, 2010

- 07_0061

arrow down

LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC

Software & Part Ecosystem

Software & Part Ecosystem

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Evaluation Kit

Evaluation Kits 1

EVAL-AD7682

AD7682 Evaluation Kit

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EVAL-AD7682

AD7682 Evaluation Kit

Product Detail

The EVAL-AD7682EDZ is a fully featured evaluation Kit for the AD7682. This board operates in stand alone mode or in conjunction with the Converter Evaluation and Development board, EVAL-CED1Z . When operated with the Converter Evaluation and Development board, software is provided enabling the user to perform detailed analysis of the ADC's performance. This software includes the technical note describing the operation and set up of the evaluation board in standalone operation or when operated with the Converter Evaluation and Development board.

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