OP215S

数据手册 1

• OP215S: Standard Military Drawing 05/13/2008
  • OP215S Space Qualified Die Document

高剂量率辐射报告 1

• OP215S High Dose Rate Radiation Report 07/31/2015

辐射报告 1

• OP215S Displacement Damage Test Report 04/14/2023

ADI 始终高度重视提供符合最高质量和可靠性水平的产品。我们通过将质量和可靠性检查纳入产品和工艺设计的各个范围以及制造过程来实现这一目标。出货产品的“零缺陷”始终是我们的目标。查看我们的质量和可靠性计划和认证以了解更多信息。

产品型号	引脚/封装图-中文版	文档	CAD 符号，脚注和 3D模型
5962R8853801VGA	8 ld Header	Material Declaration Reliablity Data	Ultra Librarian SamacSys
5962R8853801VPA	8-Lead CerDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
5962R8853804V2A	20-Lead LCC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
OP215-000C	CHIPS OR DIE	Material Declaration Reliablity Data	Ultra Librarian SamacSys
OP215R000C	CHIPS OR DIE	Material Declaration Reliablity Data	Ultra Librarian SamacSys

根据型号筛选

产品型号	产品生命周期	PCN
9月 29, 2022 - 22_0195 Shipment Carrier Change for TO-99 Header Package
		PCN22_0195_Form Material_Report Qualification Results Summary
5962R8853801VGA
7月 30, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
		PCN16_0026_Form Material_Report Qualification Results Summary
5962R8853801VGA
5962R8853801VPA
5962R8853804V2A
OP215-000C
OP215R000C
11月 18, 2015 - 15_0219 Laser Marking Standardization for Aerospace Packages
		PCN15_0219_Form Material_Report Qualification Results Summary
5962R8853801VGA
5962R8853801VPA
5962R8853804V2A
OP215-000C
OP215R000C
10月 2, 2013 - 13_0163 Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices
		PCN13_0163_Form Material_Report Qualification Plan Summary
5962R8853801VGA
5962R8853801VPA
5962R8853804V2A
11月 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
		PCN11_0050_Form Material_Report
5962R8853801VGA
5962R8853801VPA
5962R8853804V2A
11月 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
		PCN11_0182_Form Material_Report
5962R8853801VGA
5962R8853801VPA
5962R8853804V2A
11月 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
		PCN12_0199_Form Material_Report Qualification Report Summary Datasheet Specification Comparison
5962R8853801VPA
2月 9, 2009 - 08_0073 Change of Seal Glass Material for Cerdip & Cerpak Packages
		08_0073AQualPlan Material_Report PCN08_0073_Form
5962R8853801VPA
6月 1, 2011 - 11_0088 Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages
		PCN11_0088_Form Material_Report Marking Comparison
5962R8853804V2A