DAC08S
量产航空航天用8位高速乘法DAC
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产品详情
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DAC-08系列8位单芯片数模转换器在提供高速性能的同时,还具有低成本优势和出色的应用灵活性。
先进的电路设计实现了典型值85 ns的建立时间,毛刺能量非常低,功耗也很低。它在20:1的宽基准电流范围内实现了单芯片乘法性能。基准电流与满量程电流之间的匹配精度在1 LSB以内,因此在大多数应用中无需进行满量程调整。高摆幅、可调整的阈值逻辑输入支持与所有常用的逻辑系列直接接口,抗扰度极佳。
该器件提供高顺从电压互补电流输出,从而增强其多功能性,并支持差分操作,事实上使峰峰值输出摆幅加倍。在许多应用中,输出可以直接转换为电压,无需外部运算放大器。
DAC08系列的所有型号都保证8位单调性,并可在整个工作温度范围内实现低至±0.1%的非线性度。在±4.5 V至±18 V电源电压范围内,器件性能基本保持不变;采用±5 V电源时,功耗为33 mW。
参考资料
数据手册 1
交叉参考指南 1
辐射报告 1
高剂量率辐射报告 1
低剂量率辐射报告 1
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产品型号 | 引脚/封装图-中文版 | 文档 | CAD 符号,脚注和 3D模型 |
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5962L8993203VFA | 16-Lead Flatpak Glass Sealed (Hermetic) | ||
5962R8993201V2A | 20-Lead LCC | ||
5962R8993201VEA | 20 ld LCC | ||
5962R8993201VFA | 16-Lead Flatpak Glass Sealed (Hermetic) | ||
5962R8993202V2A | 20-Lead LCC | ||
5962R8993202VEA | 20 ld LCC | ||
5962R8993202VFA | 16-Lead Flatpak Glass Sealed (Hermetic) | ||
DAC080000C | CHIPS OR DIE | ||
DAC08AF-EMX | 16-Lead Flatpak Glass Sealed (Hermetic) | ||
DAC08ARC-EMX | 20-Lead LCC | ||
DAC08R000C | CHIPS OR DIE | ||
JM38510/11302SEA | CERDIP GLASS SEAL |
产品型号 | 产品生命周期 | PCN |
---|---|---|
7月 30, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices |
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5962L8993203VFA | ||
5962R8993201V2A | ||
5962R8993201VEA | ||
5962R8993201VFA | ||
5962R8993202V2A | ||
5962R8993202VEA | ||
5962R8993202VFA | ||
DAC080000C | ||
DAC08AF-EMX | ||
DAC08R000C | ||
JM38510/11302SEA | ||
11月 18, 2015 - 15_0219 Laser Marking Standardization for Aerospace Packages |
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5962L8993203VFA | ||
5962R8993201V2A | ||
5962R8993201VEA | ||
5962R8993201VFA | ||
5962R8993202V2A | ||
5962R8993202VEA | ||
5962R8993202VFA | ||
DAC080000C | ||
DAC08AF-EMX | ||
DAC08R000C | ||
JM38510/11302SEA | ||
10月 2, 2013 - 13_0163 Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices |
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5962L8993203VFA | ||
5962R8993201V2A | ||
5962R8993201VEA | ||
5962R8993201VFA | ||
5962R8993202V2A | ||
5962R8993202VEA | ||
5962R8993202VFA | ||
DAC08AF-EMX | ||
JM38510/11302SEA | ||
11月 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines |
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5962R8993201V2A | ||
5962R8993201VEA | ||
5962R8993201VFA | ||
5962R8993202V2A | ||
5962R8993202VEA | ||
5962R8993202VFA | ||
DAC08AF-EMX | ||
JM38510/11302SEA | ||
11月 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines |
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5962R8993201V2A | ||
5962R8993201VEA | ||
5962R8993201VFA | ||
5962R8993202V2A | ||
5962R8993202VEA | ||
5962R8993202VFA | ||
DAC08AF-EMX | ||
JM38510/11302SEA | ||
6月 1, 2011 - 11_0088 Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages |
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5962R8993201V2A | ||
5962R8993202V2A | ||
11月 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages. |
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5962R8993201VEA | ||
5962R8993201VFA | ||
5962R8993202VEA | ||
5962R8993202VFA | ||
JM38510/11302SEA | ||
2月 9, 2009 - 08_0073 Change of Seal Glass Material for Cerdip & Cerpak Packages |
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5962R8993201VEA | ||
5962R8993201VFA | ||
5962R8993202VEA | ||
5962R8993202VFA | ||
DAC08AF-EMX | ||
JM38510/11302SEA | ||
7月 27, 2011 - 11_0198 Change to DAC08A Non-linearity test limits for Device Type 02, QMLR and JANS only. |
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5962R8993202V2A | ||
5962R8993202VEA | ||
5962R8993202VFA | ||
JM38510/11302SEA | ||
9月 21, 2009 - 09_0188 Change of Bottom Brand from Ink to Laser for Aerospace Cerpak Packages |
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5962R8993202VFA | ||
2月 1, 2010 - 09_0196 Change In Location of Q Compliance Indicator Location for JAN/38510 Product |
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JM38510/11302SEA |
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