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特性
- Internally matched, 0.3 GHz to 6 GHz, 39.5 dBm, GaN power amplifier
- RF input and RF output AC-coupled
- Integrated drain bias inductors
- Output power: 39.5 dBm typical from 0.5 GHz to 5 GHz (PIN = 16.0 dBm)
- Power gain: 23.5 dB typical from 0.5 GHz to 5 GHz (PIN = 16.0 dBm)
- PAE: 40% typical from 0.5 GHz to 5 GHz (PIN = 16.0 dBm)
- Small signal gain: 33.5 dB typical from 0.5 GHz to 5 GHz
- Supply voltage: 28 V
- Quiescent current: 300 mA
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The ADPA1116 is a 0.3 GHz to 6 GHz power amplifier with a saturated output power (POUT) of 39.5 dBm, power added efficiency (PAE) of 40%, and a power gain of 23.5 dB typical from 0.5 GHz to 5 GHz at an input power (PIN) of 16.0 dBm. The RF input and RF output are internally matched and AC-coupled. A drain bias voltage of 28 V is applied to the VDD1 and VDD2 pins, which have integrated bias inductors. The drain current is set by applying a negative voltage to the VGG1 pin.
The ADPA1116 is fabricated on a gallium nitride (GaN) process, is housed in a 32-lead lead frame chip scale package, premolded cavity [LFCSP_CAV], and is specified for operation from −40°C to +85°C.
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产品技术资料帮助
ADI公司所提供的资料均视为准确、可靠。但本公司不为用户在应用过程中侵犯任何专利权或第三方权利承担任何责任。技术指标的修改不再另行通知。本公司既没有含蓄的允许，也不允许借用ADI公司的专利或专利权的名义。本文出现的商标和注册商标所有权分别属于相应的公司。
参考资料
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| 产品型号 | 引脚/封装图-中文版 | 文档 | CAD 符号，脚注和 3D模型 |
|---|---|---|---|
| ADPA1116ACGZN |
32-Lead LFCSP (5mm x 5mm w/ EP)
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|
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| ADPA1116ACGZN-R7 |
32-Lead LFCSP (5mm x 5mm w/ EP)
|
|
- ADPA1116ACGZN
- 引脚/封装图-中文版
-
32-Lead LFCSP (5mm x 5mm w/ EP)
- 文档
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD 符号，脚注和 3D模型
-
Ultra Librarian
-
SamacSys
- ADPA1116ACGZN-R7
- 引脚/封装图-中文版
-
32-Lead LFCSP (5mm x 5mm w/ EP)
- 文档
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD 符号，脚注和 3D模型
-
Ultra Librarian
-
SamacSys
软件和型号相关生态系统
评估套件 1
EVAL-ADPA1116
Evaluating the ADPA1116 0.3 GHz to 6 GHz, 39.5 dBm, GaN Power Amplifier
产品详情
The ADPA1116-EVALZ is a 2-layer printed circuit board (PCB) fabricated from a 10 mil thick Rogers 4350B copper clad mounted to an aluminum heat spreader. The heat spreader provides thermal relief to the ADPA1116 and mechanical support to the PCB. Mounting holes on the heat spreader allow it to be attached to larger heatsinks for improved thermal management. The RFIN and RFOUT ports are populated by Subminiture Version A (SMA) female coaxial connectors, and their respective RF traces are of 50 Ω characteristic impedance. The ADPA1116-EVALZ is populated with components suitable for use over the entire operating temperature range of the ADPA1116.
The RF traces are 50 Ω grounded coplanar waveguide, and the package ground leads connect directly to the ground plane. Multiple vias are used to connect the top and bottom ground planes. Multiple vias under the package paddle ensure adequate electrical and thermal conduction.
The power supply decoupling capacitors shown in Figure 6 represent the configuration that was used to characterize the device. For full details on the ADPA1116, see the ADPA1116 data sheet, which should be consulted in conjunction with this user guide when using the ADPA1116-EVALZ evaluation board.
资料
工具及仿真模型 1
S-参数 1
S-参数