Products
OP27S
PRODUCTIONAerospace Low Noise Precision Op Amp
- Part Models
- 12
- 1ku List Price
- Starting From $69.62
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Overview
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The OP27 precision operational amplifier combines the low offset and drift of the OP07 with both high speed and low noise. Offsets down to 25µV and drift of 0.6µV/°C maximum make the OP27 ideal for precision instrumentation applications. Exceptionally low noise, a low 1/f noise corner frequency, and high gain (1.8 million), allow accurate high-gain amplification of low-level signals. A gain-bandwidth product of 8MHz and a 2.8V/µsec slew rate provides excellent dynamic accuracy in high-speed data-acquisition systems.
A low input bias current of ±10nA typical is achieved by use of a bias-current-cancellation circuit.
The output stage has good load driving capability. A guaranteed swing of ±10V into 600 Ohms and low output distortion make the OP27 an excellent choice for audio applications.
PSRR and CMRR exceed 120dB. These characteristics, coupled with long-term drift of 0.2µV/month, allow the circuit designer to achieve performance levels previously attained only by discrete designs.
Documentation
Data Sheet 3
Cross Reference Guide 1
High Dose Rate Radiation Reports 1
Low Dose Rate Radiation Reports 1
Radiation Report 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| 5962L9468003VHA | 10-Lead FlatPack | ||
| 5962R9468002V2A | 20-Lead LCC | ||
| 5962R9468002VGA | 8-Pin TO-99 | ||
| 5962R9468002VHA | 10-Lead FlatPack | ||
| 5962R9468002VPA | 8-Lead CerDIP | ||
| JM38510/13503BGA | 8-Pin TO-99 | ||
| JM38510/13503BPA | 8-Lead CerDIP | ||
| JM38510/13503SGA | 8-Pin TO-99 | ||
| JM38510/13503SPA | 8-Lead CerDIP | ||
| OP270000C | DIE | ||
| OP27AL-EMX | 10-Lead FlatPack | ||
| OP27R000C | DIE |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
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Jul 30, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices |
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| 5962L9468003VHA | PRODUCTION | |
| 5962R9468002V2A | PRODUCTION | |
| 5962R9468002VGA | PRODUCTION | |
| 5962R9468002VHA | PRODUCTION | |
| 5962R9468002VPA | PRODUCTION | |
| JM38510/13503SGA | ||
| JM38510/13503SPA | ||
| OP270000C | PRODUCTION | |
| OP27R000C | PRODUCTION | |
|
Oct 29, 2017 - 17_0079 Qualification of TeamQuest Technology Inc., Philippines as an Alternate Test Site for TC-Vos Testing |
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| 5962L9468003VHA | PRODUCTION | |
| 5962R9468002V2A | PRODUCTION | |
| 5962R9468002VGA | PRODUCTION | |
| 5962R9468002VHA | PRODUCTION | |
| 5962R9468002VPA | PRODUCTION | |
| JM38510/13503SGA | ||
| JM38510/13503SPA | ||
|
Nov 18, 2015 - 15_0219 Laser Marking Standardization for Aerospace Packages |
||
| 5962L9468003VHA | PRODUCTION | |
| 5962R9468002V2A | PRODUCTION | |
| 5962R9468002VGA | PRODUCTION | |
| 5962R9468002VHA | PRODUCTION | |
| 5962R9468002VPA | PRODUCTION | |
| JM38510/13503BGA | PRODUCTION | |
| JM38510/13503BPA | PRODUCTION | |
| JM38510/13503SGA | ||
| JM38510/13503SPA | ||
| OP270000C | PRODUCTION | |
| OP27R000C | PRODUCTION | |
|
Oct 2, 2013 - 13_0163 Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices |
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| 5962L9468003VHA | PRODUCTION | |
| 5962R9468002V2A | PRODUCTION | |
| 5962R9468002VGA | PRODUCTION | |
| 5962R9468002VHA | PRODUCTION | |
| 5962R9468002VPA | PRODUCTION | |
| JM38510/13503SGA | ||
| JM38510/13503SPA | ||
|
Nov 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages. |
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| 5962L9468003VHA | PRODUCTION | |
| 5962R9468002VHA | PRODUCTION | |
| 5962R9468002VPA | PRODUCTION | |
| JM38510/13503BPA | PRODUCTION | |
| JM38510/13503SPA | ||
|
Nov 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines |
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| 5962L9468003VHA | PRODUCTION | |
| 5962R9468002V2A | PRODUCTION | |
| 5962R9468002VGA | PRODUCTION | |
| 5962R9468002VHA | PRODUCTION | |
| 5962R9468002VPA | PRODUCTION | |
| JM38510/13503BGA | PRODUCTION | |
| JM38510/13503BPA | PRODUCTION | |
| JM38510/13503SGA | ||
| JM38510/13503SPA | ||
|
Nov 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines |
||
| 5962L9468003VHA | PRODUCTION | |
| 5962R9468002V2A | PRODUCTION | |
| 5962R9468002VGA | PRODUCTION | |
| 5962R9468002VHA | PRODUCTION | |
| 5962R9468002VPA | PRODUCTION | |
| JM38510/13503BGA | PRODUCTION | |
| JM38510/13503BPA | PRODUCTION | |
| JM38510/13503SGA | ||
| JM38510/13503SPA | ||
|
Jun 1, 2011 - 11_0088 Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages |
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| 5962R9468002V2A | PRODUCTION | |
| JM38510/13503BGA | PRODUCTION | |
| JM38510/13503SGA | ||
|
Sep 29, 2022 - 22_0195 Shipment Carrier Change for TO-99 Header Package |
||
| 5962R9468002VGA | PRODUCTION | |
| JM38510/13503SGA | ||
|
Sep 21, 2009 - 09_0188 Change of Bottom Brand from Ink to Laser for Aerospace Cerpak Packages |
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| 5962R9468002VHA | PRODUCTION | |
|
Feb 9, 2009 - 08_0073 Change of Seal Glass Material for Cerdip & Cerpak Packages |
||
| 5962R9468002VHA | PRODUCTION | |
| 5962R9468002VPA | PRODUCTION | |
| JM38510/13503SPA | ||
|
Dec 3, 2025 - 25_0151 Qualification of Wafer Fabrication Site Analog Devices, Inc. Camas WA for (6um Bipolar) Products |
||
| JM38510/13503BGA | PRODUCTION | |
| JM38510/13503BPA | PRODUCTION | |
|
Apr 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices |
||
| JM38510/13503BGA | PRODUCTION | |
| JM38510/13503BPA | PRODUCTION | |
|
Jun 6, 2012 - 12_0066 Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite |
||
| JM38510/13503BGA | PRODUCTION | |
| JM38510/13503BPA | PRODUCTION | |
|
Feb 1, 2010 - 09_0196 Change In Location of Q Compliance Indicator Location for JAN/38510 Product |
||
| JM38510/13503BGA | PRODUCTION | |
| JM38510/13503BPA | PRODUCTION | |
| JM38510/13503SGA | ||
| JM38510/13503SPA | ||
|
Jul 31, 2009 - 09_0106 Removal of Die Fab Code from Topside Marking of Remaining Mil-Grade Products |
||
| JM38510/13503BGA | PRODUCTION | |
| JM38510/13503BPA | PRODUCTION | |
|
Jun 15, 2026 - 26_0043 Obsolescence Notification for Select Aerospace Products |
||
| JM38510/13503SGA | ||
| JM38510/13503SPA | ||
This is the most up-to-date revision of the Data Sheet.
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LTspice
Models for the following parts are available in LTspice:
- OP27
LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.