OP77S

PRODUCTION

OP77S

Aerospace Ultralow Offset Voltage Operational Amplifier

PRODUCTION

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Features

Outstanding Gain Linearity
Ultrahigh Gain 5000 V/mV Min
Low V_OS Over Temperature 60 µV Max

Excellent TCV_OS
High PSRR
Low Power Consumption 60 mW Max
Fits OP07, 725, 108A/308A, 741 Sockets

Additional Details

The OP77 significantly advances the state-of-the-art in precision op amps. The OP77's outstanding fgain of 10,000,000 or more is maintained over the full ±10V output range. This exceptional gain-linearity eliminates incorrectable system nonlinearities common in previous monolithic op amps, and provides superior performance in high closed-loop-gain applications. Low intitial V_OS drift and rapid stabilization time, combined with only 50mW power consumption, are significant imporvements over previous designs. These characteristics, plus the exceptional TCV_OS and the low V_OS of 25µV maximum, eliminates the need for V_OS adjustment and increases system accuracy over temperature.

PSRR of 3µV/V (110dB) and CMRR of 1.0µV/V maximum virtually eliminates errors caused by power supply drifts and common-mode signals. This combination of outstanding characteristics makes the OP77 ideally suited for high-resolution instrumentation and other tight error budget systems.

The OP77 is a direct or upgrade replacement for the OP07, 05, 725, or 108A op amps. 741-types can be replaced by eliminating the V_OS adjust pot.

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Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.

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FAQs

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Part Models 4

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Technical Documents 1

OP77S: Military Data Sheet 05/14/2008

Design Resources 4

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
5962-8773802V2A	20-Lead LCC	HTML Material Declaration HTML Reliablity Data	Ultra Librarian SamacSys
5962-8773802VGA	20 ld LCC	HTML Material Declaration HTML Reliablity Data	Ultra Librarian SamacSys
5962-8773802VHA	10-Lead FlatPack	HTML Material Declaration HTML Reliablity Data	Ultra Librarian SamacSys
5962-8773802VPA	8-Lead CerDIP	HTML Material Declaration HTML Reliablity Data	Ultra Librarian SamacSys

5962-8773802V2A
Pin/Package Drawing
20-Lead LCC
Documentation

HTML Material Declaration

HTML Reliablity Data

CAD Symbols, Footprints, and 3D Models
Ultra Librarian
SamacSys

5962-8773802VGA
Pin/Package Drawing
20 ld LCC
Documentation

HTML Material Declaration

HTML Reliablity Data

CAD Symbols, Footprints, and 3D Models
Ultra Librarian
SamacSys

5962-8773802VHA
Pin/Package Drawing
10-Lead FlatPack
Documentation

HTML Material Declaration

HTML Reliablity Data

CAD Symbols, Footprints, and 3D Models
Ultra Librarian
SamacSys

5962-8773802VPA
Pin/Package Drawing
8-Lead CerDIP
Documentation

HTML Material Declaration

HTML Reliablity Data

CAD Symbols, Footprints, and 3D Models
Ultra Librarian
SamacSys

PCN/PDN Information

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Jul 30, 2018

- 16_0026

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

5962-8773802V2A

5962-8773802VGA

5962-8773802VHA

5962-8773802VPA

pdf

PCN16_0026_Form

xls

Material_Report

Qualification Results Summary

Nov 18, 2015

- 15_0219

Laser Marking Standardization for Aerospace Packages

5962-8773802V2A

5962-8773802VGA

5962-8773802VHA

5962-8773802VPA

pdf

PCN15_0219_Form

xls

Material_Report

pdf

Qualification Results Summary

Oct 2, 2013

- 13_0163

Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices

5962-8773802V2A

5962-8773802VGA

5962-8773802VHA

5962-8773802VPA

pdf

PCN13_0163_Form

xls

Material_Report

pdf

Qualification Plan Summary

Nov 9, 2011

- 11_0050

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

5962-8773802V2A

5962-8773802VGA

5962-8773802VHA

5962-8773802VPA

pdf

PCN11_0050_Form

xls

Material_Report

Nov 9, 2011

- 11_0182

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

5962-8773802V2A

5962-8773802VGA

5962-8773802VHA

5962-8773802VPA

pdf

PCN11_0182_Form

xls

Material_Report

Sep 29, 2022

- 22_0195

Shipment Carrier Change for TO-99 Header Package

5962-8773802VGA

pdf

PCN22_0195_Form

xls

Material_Report

pdf

Qualification Results Summary

Oct 29, 2017

- 17_0079

Qualification of TeamQuest Technology Inc., Philippines as an Alternate Test Site for TC-Vos Testing

5962-8773802VGA

5962-8773802VHA

5962-8773802VPA

pdf

PCN17_0079_Form

xls

Material_Report

pdf

Test Correlation Report

Jun 1, 2011

- 11_0088

Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages

5962-8773802VGA

pdf

PCN11_0088_Form

xls

Material_Report

pdf

Marking Comparison

Nov 7, 2012

- 12_0199

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

5962-8773802VHA

5962-8773802VPA

pdf

PCN12_0199_Form

xls

Material_Report

pdf

Qualification Report Summary

pdf

Datasheet Specification Comparison

Sep 21, 2009

- 09_0188

Change of Bottom Brand from Ink to Laser for Aerospace Cerpak Packages

5962-8773802VHA

pdf

09_0188supportingInfo

xls

Material_Report

pdf

PCN09_0188_Form

Feb 9, 2009

- 08_0073

Change of Seal Glass Material for Cerdip & Cerpak Packages

5962-8773802VHA

5962-8773802VPA

pdf

08_0073AQualPlan

xls

Material_Report

pdf

PCN08_0073_Form

Filter by Model

Part Models

Product Lifecycle

PCN

Jul 30, 2018

- 16_0026

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

5962-8773802V2A

5962-8773802VGA

5962-8773802VHA

5962-8773802VPA

pdf

PCN16_0026_Form

xls

Material_Report

Qualification Results Summary

Nov 18, 2015

- 15_0219

Laser Marking Standardization for Aerospace Packages

5962-8773802V2A

5962-8773802VGA

5962-8773802VHA

5962-8773802VPA

pdf

PCN15_0219_Form

xls

Material_Report

pdf

Qualification Results Summary

Oct 2, 2013

- 13_0163

Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices

5962-8773802V2A

5962-8773802VGA

5962-8773802VHA

5962-8773802VPA

pdf

PCN13_0163_Form

xls

Material_Report

pdf

Qualification Plan Summary

Nov 9, 2011

- 11_0050

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

5962-8773802V2A

5962-8773802VGA

5962-8773802VHA

5962-8773802VPA

pdf

PCN11_0050_Form

xls

Material_Report

Nov 9, 2011

- 11_0182

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

5962-8773802V2A

5962-8773802VGA

5962-8773802VHA

5962-8773802VPA

pdf

PCN11_0182_Form

xls

Material_Report

Sep 29, 2022

- 22_0195

Shipment Carrier Change for TO-99 Header Package

5962-8773802VGA

pdf

PCN22_0195_Form

xls

Material_Report

pdf

Qualification Results Summary

Oct 29, 2017

- 17_0079

Qualification of TeamQuest Technology Inc., Philippines as an Alternate Test Site for TC-Vos Testing

5962-8773802VGA

5962-8773802VHA

5962-8773802VPA

pdf

PCN17_0079_Form

xls

Material_Report

pdf

Test Correlation Report

Jun 1, 2011

- 11_0088

Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages

5962-8773802VGA

pdf

PCN11_0088_Form

xls

Material_Report

pdf

Marking Comparison

Nov 7, 2012

- 12_0199

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

5962-8773802VHA

5962-8773802VPA

pdf

PCN12_0199_Form

xls

Material_Report

pdf

Qualification Report Summary

pdf

Datasheet Specification Comparison

Sep 21, 2009

- 09_0188

Change of Bottom Brand from Ink to Laser for Aerospace Cerpak Packages

5962-8773802VHA

pdf

09_0188supportingInfo

xls

Material_Report

pdf

PCN09_0188_Form

Feb 9, 2009

- 08_0073

Change of Seal Glass Material for Cerdip & Cerpak Packages

5962-8773802VHA

5962-8773802VPA

pdf

08_0073AQualPlan

xls

Material_Report

pdf

PCN08_0073_Form

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