OP470S
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OP470S

Aerospace Very Low-Noise Quad Op Amp

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Info: : PRODUCTION tooltip
Info: : PRODUCTION tooltip
Part Models 8
1ku List Price
price unavailable
Features
  • Very Low-Noise
  • Excellent Input Offset Voltage, 0.4 mV Max
  • Low Offset Voltage Drift
  • Very High Gain, 1000 V/mV Min
  • Outstanding CMR, 110 dB Min
  • Slew Rate, 2 V/µs Typ
  • Gain-Bandwidth Product, 6 MHz Typ
Additional Details
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The OP470 is a high-performance monolithic quad operational amplifier with exceptionally low voltage noise offering comparable performance to ADI's industry standard OP27.

The OP470 features an input offset voltage below 0.4mV, excellent for a quad op amp, guaranteed over the full military temperature range. Open-loop gain of the OP470 is over 1,000,000 into a 10k Ohm load insuring excellent gain accuracy and linearity, even in high-gain applications. Input bias is under 25nA which reduces errors due to signal source reisitance. The OP470's CMR of over 110dB and PSRR of less than 1.8µV/V significantly reduce errors due to ground noise and power supply fluctuations. Power consumption of the quad OP470 is half that of four OP27s, a significant advantage for power conscious applications. The OP470 is unity-gain stable with a gain-bandwidth product of 6MHz and a slew rate of 2V/µs typical.

The OP470 offers excellent amplifier matching which is important for applications such as multiple gain blocks, low-noise instrumentation amplifiers, quad buffers, and low-noise active filters.

The OP470 conforms to the industry standard 14-pin DIP pinout. It is pin compatible with the OP11 and LM 148 quad op amps and can be used to upgrade systems using these devices.

Part Models 8
1ku List Price
price unavailable

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Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
5962-8856501V2A
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5962L8856503VCA
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5962R8856501V2A
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5962R8856501VCA
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5962R8856501VKA
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OP470-000C
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OP4700903TC
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OP470R000C
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Filter by Model

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Part Models

Product Lifecycle

PCN

Jul 30, 2018

- 16_0026

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

5962-8856501V2A

5962L8856503VCA

5962R8856501V2A

5962R8856501VCA

5962R8856501VKA

OP470-000C

OP4700903TC

OP470R000C

Nov 18, 2015

- 15_0219

Laser Marking Standardization for Aerospace Packages

5962-8856501V2A

5962L8856503VCA

5962R8856501V2A

5962R8856501VCA

5962R8856501VKA

OP470-000C

OP4700903TC

OP470R000C

Oct 2, 2013

- 13_0163

Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices

5962-8856501V2A

5962L8856503VCA

5962R8856501V2A

5962R8856501VCA

5962R8856501VKA

OP4700903TC

Nov 9, 2011

- 11_0050

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

5962-8856501V2A

5962R8856501V2A

5962R8856501VCA

5962R8856501VKA

OP4700903TC

Nov 9, 2011

- 11_0182

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

5962-8856501V2A

5962R8856501V2A

5962R8856501VCA

5962R8856501VKA

OP4700903TC

Nov 7, 2012

- 12_0199

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

Jun 1, 2011

- 11_0088

Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages

Feb 9, 2009

- 08_0073

Change of Seal Glass Material for Cerdip & Cerpak Packages

Sep 21, 2009

- 09_0188

Change of Bottom Brand from Ink to Laser for Aerospace Cerpak Packages

Oct 17, 2022

- 22_0087

OP4700903TC Obsolescence

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Jul 30, 2018

- 16_0026

arrow down

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

5962-8856501V2A

5962L8856503VCA

5962R8856501V2A

5962R8856501VCA

5962R8856501VKA

OP470-000C

OP4700903TC

OP470R000C

Nov 18, 2015

- 15_0219

arrow down

Laser Marking Standardization for Aerospace Packages

5962-8856501V2A

5962L8856503VCA

5962R8856501V2A

5962R8856501VCA

5962R8856501VKA

OP470-000C

OP4700903TC

OP470R000C

Oct 2, 2013

- 13_0163

arrow down

Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices

5962-8856501V2A

5962L8856503VCA

5962R8856501V2A

5962R8856501VCA

5962R8856501VKA

OP4700903TC

Nov 9, 2011

- 11_0050

arrow down

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

5962-8856501V2A

5962R8856501V2A

5962R8856501VCA

5962R8856501VKA

OP4700903TC

Nov 9, 2011

- 11_0182

arrow down

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

5962-8856501V2A

5962R8856501V2A

5962R8856501VCA

5962R8856501VKA

OP4700903TC

Nov 7, 2012

- 12_0199

arrow down

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

Jun 1, 2011

- 11_0088

arrow down

Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages

Feb 9, 2009

- 08_0073

arrow down

Change of Seal Glass Material for Cerdip & Cerpak Packages

Sep 21, 2009

- 09_0188

arrow down

Change of Bottom Brand from Ink to Laser for Aerospace Cerpak Packages

Oct 17, 2022

- 22_0087

arrow down

OP4700903TC Obsolescence

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