OP27
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OP27

Low-Noise, Precision Op Amps

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Part Details
Part Models 12
1ku List Price Starting From $1.36
Part Models 12
1ku List Price Starting From $1.36

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
OP27AJ/883C
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OP27AZ
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OP27AZ/883C
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  • HTML
OP27EPZ
  • HTML
  • HTML
OP27EZ
  • HTML
  • HTML
OP27GJZ
  • HTML
  • HTML
OP27GPZ
  • HTML
  • HTML
OP27GSZ
  • HTML
  • HTML
OP27GSZ-REEL
  • HTML
  • HTML
OP27GSZ-REEL7
  • HTML
  • HTML
OP27GZ
  • HTML
  • HTML
OP27NBC
  • HTML
  • HTML

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Part Models

Product Lifecycle

PCN

Apr 9, 2018

- 16_0026

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

Sep 7, 2017

- 17_0079

Qualification of TeamQuest Technology Inc., Philippines as an Alternate Test Site for TC-Vos Testing

OP27AJ/883C

PRODUCTION

OP27AZ

PRODUCTION

OP27AZ/883C

PRODUCTION

OP27EZ

PRODUCTION

OP27GJZ

PRODUCTION

OP27GSZ-REEL7

PRODUCTION

OP27GZ

PRODUCTION

OP27NBC

PRODUCTION

Jun 6, 2012

- 12_0066

Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite

Nov 9, 2011

- 11_0050

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

OP27AJ/883C

PRODUCTION

OP27AZ

PRODUCTION

OP27AZ/883C

PRODUCTION

OP27EZ

PRODUCTION

OP27GJZ

PRODUCTION

OP27GZ

PRODUCTION

Nov 9, 2011

- 11_0182

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

OP27AJ/883C

PRODUCTION

OP27AZ

PRODUCTION

OP27AZ/883C

PRODUCTION

OP27EZ

PRODUCTION

OP27GJZ

PRODUCTION

OP27GZ

PRODUCTION

Jun 1, 2011

- 11_0088

Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages

Jul 31, 2009

- 09_0106

Removal of Die Fab Code from Topside Marking of Remaining Mil-Grade Products

OP27AJ/883C

PRODUCTION

OP27AZ/883C

PRODUCTION

Nov 7, 2012

- 12_0199

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

Aug 19, 2009

- 07_0024

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

Nov 23, 2010

- 10_0004

Halogen Free Material Change for SOIC Narrow Body Products Assembled at Amkor

OP27GSZ

PRODUCTION

OP27GSZ-REEL

PRODUCTION

OP27GSZ-REEL7

PRODUCTION

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Apr 9, 2018

- 16_0026

arrow down

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

Sep 7, 2017

- 17_0079

arrow down

Qualification of TeamQuest Technology Inc., Philippines as an Alternate Test Site for TC-Vos Testing

OP27AJ/883C

PRODUCTION

OP27AZ

PRODUCTION

OP27AZ/883C

PRODUCTION

OP27EZ

PRODUCTION

OP27GJZ

PRODUCTION

OP27GSZ-REEL7

PRODUCTION

OP27GZ

PRODUCTION

OP27NBC

PRODUCTION

Jun 6, 2012

- 12_0066

arrow down

Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite

Nov 9, 2011

- 11_0050

arrow down

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

OP27AJ/883C

PRODUCTION

OP27AZ

PRODUCTION

OP27AZ/883C

PRODUCTION

OP27EZ

PRODUCTION

OP27GJZ

PRODUCTION

OP27GZ

PRODUCTION

Nov 9, 2011

- 11_0182

arrow down

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

OP27AJ/883C

PRODUCTION

OP27AZ

PRODUCTION

OP27AZ/883C

PRODUCTION

OP27EZ

PRODUCTION

OP27GJZ

PRODUCTION

OP27GZ

PRODUCTION

Jun 1, 2011

- 11_0088

arrow down

Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages

Jul 31, 2009

- 09_0106

arrow down

Removal of Die Fab Code from Topside Marking of Remaining Mil-Grade Products

OP27AJ/883C

PRODUCTION

OP27AZ/883C

PRODUCTION

Nov 7, 2012

- 12_0199

arrow down

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

Aug 19, 2009

- 07_0024

arrow down

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

Nov 23, 2010

- 10_0004

arrow down

Halogen Free Material Change for SOIC Narrow Body Products Assembled at Amkor

OP27GSZ

PRODUCTION

OP27GSZ-REEL

PRODUCTION

OP27GSZ-REEL7

PRODUCTION

Software & Part Ecosystem

Software & Part Ecosystem

Tools & Simulations

Tools & Simulations 3

LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.

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