MAX2657
PRODUCTIONGPS/GNSS Low-Noise Amplifiers
Low-Noise-Figure GPS LNAs in an Ultra-Small WLP Package Offer Higher Linearity Version for Increased Sensitivity
- Part Models
- 2
- 1ku List Price
- price unavailable
Part Details
- High-Power Gain: 19dB (MAX2657)
- Ultra-Low-Noise Figure: 0.8dB
- Integrated 50Ω Output Matching Circuit
- Low Supply Current: 4.1mA (MAX2657)
- Wide Supply Voltage Range: 1.6V to 3.3V
- Low Bill of Materials: One Inductor, Two Capacitors
- Small Footprint: 0.86mm x 1.26mm
- Thin Profile: 0.65mm
- 0.4mm-Pitch Wafer-Level Package (WLP)
The MAX2657/MAX2658 high-gain, low-noise amplifiers (LNAs) are designed for GPS L1, Galileo, and GLONASS applications. Designed in Maxim's advanced SiGe process, the devices achieve a high gain and an ultra-low-noise figure while maximizing the input-referred 1dB compression point and the 3rd-order intercept point.
The MAX2657/MAX2658 operate from a +1.6V to +3.3V single supply. The MAX2657 is optimized for low current. The MAX2658 is optimized for high linearity. The shutdown feature in the device reduces the supply current to be less than 1µA. The MAX2657/MAX2658 are available in a very small, lead-free, RoHS-compliant, 0.86mm x 1.26mm x 0.65mm, wafer-level package (WLP).
Applications
- Avionics
- Cellular Phones with GPS
- Location-Enabled Mobile Devices
- Notebook PCs/Ultra-Mobile PCs
- Personal Navigation Devices (PNDs)
- Recreational, Marine Navigation
- Telematics (Asset Tracking and Management)
- Watches
Documentation
Data Sheet 1
Reliability Data 1
Technical Articles 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
---|---|---|---|
MAX2657EWT+ | Wafer-Level Package 3x2 Bump, Full Array | ||
MAX2657EWT+T | Wafer-Level Package 3x2 Bump, Full Array |
Part Models | Product Lifecycle | PCN |
---|---|---|
Aug 14, 2023 - 2275A WAFER FAB |
||
MAX2657EWT+ | PRODUCTION | |
MAX2657EWT+T | PRODUCTION |
This is the most up-to-date revision of the Data Sheet.
Hardware Ecosystem
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