ADSP-BF704
Low Power 400MHz Blackfin+ Embedded Processor with 512KByte L2 SRAM
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Features
- Blackfin+ core with up to 400 MHz performance
- Dual 16-bit or single 32-bit MAC support per cycle
- 16-bit complex MAC and many other instruction set enhancements
- Instruction set compatible with previous Blackfin product
- On-Chip Memory
- 136KB L1 SRAM with multi-parity-bit protection (64KB instruction, 64KB data, 8KB scratchpad)
- 512KByte on-chip L2 SRAM with ECC protection
- 512KByte On-chip L2 ROM
- Key Peripherals include
- USB2.0 HS OTG
- 2x CAN2.0B
- ePPI Video I/O
- 2x SPORTs (w/I2S)
- 2xQuad-SPI / 1xDual-SPI (w/ Host mode option)
- I2C
- 2xUART
- SD/SDIO/MMC (4-bit)
- Security and one-time-programmable memory
- Crypto hardware accelerators for fast secure boot/IP protection
- memDMA encryption/decryption for fast run-time security
- Low-cost packaging
- 88-Lead LFCSP (QFN) package (12 mm × 12mm), RoHS compliant
- Low system power with < 100 mW at 400 MHz (< 0.25 mW/MHz) at 25°C TJUNCTION
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The processor offers performance up to 400 MHz, as well as lowest power consumption at <100mW. Produced with a low-power and low-voltage design methodology, they provide world-class power management and performance.
By integrating a rich set of industry-leading system peripherals and large on-chip memory, this Blackfin processor is the platform of choice for next-generation applications that require RISC-like programmability, multimedia support, and leading-edge signal processing in one integrated package. These applications span a wide array of markets, from automotive systems to embedded industrial, instrumentation, video/image analysis, biometric and control applications.
2
Ask a Question
Submit your question below and we will return the best answer from ADI’s knowledge database:
Search
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Support
Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.
Visit the ADI Support Page
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ADSP-BF704
Documentation
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Application Note
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Emulator Manual
4
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4.04 M
Processor Manual
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Data Sheet 1
User Guide 1
Application Note 12
EE-261: Understanding Jitter Requirements of PLL-Based Processors (Rev.1)
EE-360: Utilizing the Trigger Routing Unit for System Level Synchronization (Rev.1)
EE-385: Implementing the RSA Cryptosystem with the Public Key Accelerator
EE-374: Implementing Second-Stage Loaders on ADSP-BF707 Blackfin® Processors (Rev.1)
EE-386: Using the Security Packet Engine to Protect Data (Rev.1)
EE-378: Processor Comparison Guide (ADSP-BF60x/BF70x vs ADSP-SC58x/2158x) (Rev.1)
EE-376: ADSP-BF70x Blackfin+ Processor System Optimization Techniques
EE-394: ADSP-BF70x Blackfin+™ Processor Optimization Techniques (Rev.1)
EE-395: Interfacing the AD7689 ADC to ADSP-BF70x Blackfin+™ Processors (Rev.1)
EE-373: Tuning the Dynamic Branch Predictor for ADSP-BF70x Blackfin™ Processors (Rev.1)
EE-368: ADSP-BF70x Blackfin+ Processors Cryptographic Algorithm Validation (Rev.1)
EE-366: Secure Booting Guide for Blackfin+® and SHARC+® Processors (Rev.2)
Processor Manual 3
Product Highlight 1
Emulator Manual 2
Integrated Circuit Anomaly 1
Informational 1
Product Highlight 1
Webcast 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
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| ADSP-BF704BCPZ-3 |
88-Lead LFCSP (12mm x 12mm w/ EP)
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| ADSP-BF704BCPZ-4 |
88-Lead LFCSP (12mm x 12mm w/ EP)
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| ADSP-BF704KCPZ-3 |
88-Lead LFCSP (12mm x 12mm w/ EP)
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| ADSP-BF704KCPZ-4 |
88-Lead LFCSP (12mm x 12mm w/ EP)
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- ADSP-BF704BCPZ-3
- Pin/Package Drawing
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88-Lead LFCSP (12mm x 12mm w/ EP)
- Documentation
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HTML
Material Declaration
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HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
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Ultra Librarian
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SamacSys
- ADSP-BF704BCPZ-4
- Pin/Package Drawing
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88-Lead LFCSP (12mm x 12mm w/ EP)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADSP-BF704KCPZ-3
- Pin/Package Drawing
-
88-Lead LFCSP (12mm x 12mm w/ EP)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADSP-BF704KCPZ-4
- Pin/Package Drawing
-
88-Lead LFCSP (12mm x 12mm w/ EP)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
Apr 20, 2023
- 23_0018
Conversion of 12x12 LFCSP Package Outline from Punch to Sawn and Transfer of Assembly Site to UTAC Thailand
ADSP-BF704BCPZ-3
PRODUCTION
ADSP-BF704BCPZ-4
PRODUCTION
ADSP-BF704KCPZ-3
PRODUCTION
ADSP-BF704KCPZ-4
PRODUCTION
Sep 14, 2021
- 20_0257
CANCELLED: Assembly Site Transfer of Select LFCSP Products to UTAC Thailand
ADSP-BF704BCPZ-3
PRODUCTION
ADSP-BF704BCPZ-4
PRODUCTION
ADSP-BF704KCPZ-3
PRODUCTION
ADSP-BF704KCPZ-4
PRODUCTION
Jul 19, 2017
- 17_0134
ADSP-BF70x Data Sheet Update
ADSP-BF704BCPZ-3
PRODUCTION
ADSP-BF704BCPZ-4
PRODUCTION
ADSP-BF704KCPZ-3
PRODUCTION
ADSP-BF704KCPZ-4
PRODUCTION
Jun 22, 2016
- 16_0103
Die Revision 1.1 for ADSP-BF70x Blackfin Processor Products
ADSP-BF704BCPZ-3
PRODUCTION
ADSP-BF704BCPZ-4
PRODUCTION
ADSP-BF704KCPZ-3
PRODUCTION
ADSP-BF704KCPZ-4
PRODUCTION
Sep 25, 2015
- 15_0181
Data Sheet change for ADSP-BF70x
ADSP-BF704BCPZ-3
PRODUCTION
ADSP-BF704BCPZ-4
PRODUCTION
ADSP-BF704KCPZ-3
PRODUCTION
ADSP-BF704KCPZ-4
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
Apr 20, 2023
- 23_0018
Conversion of 12x12 LFCSP Package Outline from Punch to Sawn and Transfer of Assembly Site to UTAC Thailand
ADSP-BF704BCPZ-3
PRODUCTION
ADSP-BF704BCPZ-4
PRODUCTION
ADSP-BF704KCPZ-3
PRODUCTION
ADSP-BF704KCPZ-4
PRODUCTION
Sep 14, 2021
- 20_0257
CANCELLED: Assembly Site Transfer of Select LFCSP Products to UTAC Thailand
ADSP-BF704BCPZ-3
PRODUCTION
ADSP-BF704BCPZ-4
PRODUCTION
ADSP-BF704KCPZ-3
PRODUCTION
ADSP-BF704KCPZ-4
PRODUCTION
Jul 19, 2017
- 17_0134
ADSP-BF70x Data Sheet Update
ADSP-BF704BCPZ-3
PRODUCTION
ADSP-BF704BCPZ-4
PRODUCTION
ADSP-BF704KCPZ-3
PRODUCTION
ADSP-BF704KCPZ-4
PRODUCTION
Jun 22, 2016
- 16_0103
Die Revision 1.1 for ADSP-BF70x Blackfin Processor Products
ADSP-BF704BCPZ-3
PRODUCTION
ADSP-BF704BCPZ-4
PRODUCTION
ADSP-BF704KCPZ-3
PRODUCTION
ADSP-BF704KCPZ-4
PRODUCTION
Sep 25, 2015
- 15_0181
Data Sheet change for ADSP-BF70x
ADSP-BF704BCPZ-3
PRODUCTION
ADSP-BF704BCPZ-4
PRODUCTION
ADSP-BF704KCPZ-3
PRODUCTION
ADSP-BF704KCPZ-4
PRODUCTION
Software & Part Ecosystem
Evaluation Kits 2
EVAL-BF706M-EZLITE
The ADSP-BF706 EZ-Kit Lite mini evaluation hardware provides an ultra low-power, low-cost hardware solution for evaluating the ADSP-BF70x Blackfin+ processor family.
Features and Benefits
- ADSP-BF706 EZ-KIT Mini features:
- ADSP-BF706 Blackfin Processor
- 400 MHz/800 MMACs performance at <100 mW
- 1160 kB on-chip SRAM (136 kB L1, 1 MB L2)
- 88-lead LFCSP (QFN) package
- Small form factor: 4 in × 2 in (10 cm × 5 cm)
- 4 MB quad SPI flash
- ADAU1761 SigmaDSP® low power stereo audio codec
- Line-in and headphone jacks
- Direct USB 2.0 HS PHY interface to ADSP-BF706
- External connections for EPPI0, SPORT, SPI, I2C, timer, and GPIOs
- On-board debug agent (JTAG/SWD) via separate USB interface
- Other features
- USB bus powered
- Push buttons and LEDs
- Boot mode strapped to SPI master
- Resistors for processor current measurement
- Arduino Uno R3 connection compatibility
- ADSP-BF706 Blackfin Processor
- CrossCore® embedded studio software tools
- Full featured development suite and board support package
- Complete real-time debug capability included
- Full featured one year evaluation license
Product Detail
Analog Devices has developed a low cost, low power DSP evaluation platform targeting an array of real-time applications. The ADSP-BF706 EZ-KIT Mini® leverages the latest entry within the industry-leading, low power Blackfin® processor family as well as ADI’s optimized development tools and third party software deliverables. With on-board, high quality audio connectivity, multiple expansion options, and an integrated debug agent, the EZ-KIT Mini offers designers a complete small form factor, low cost starter platform for multiple applications.
The ADSP-BF706 Blackfin processor is a high performance DSP that delivers a class-leading 800 MMACS of processing power at less than 100 mW. With glueless connectivity options including USB and over 1 MB of internal SRAM, this reduces BOM cost and eliminates the need for external memory in many applications. Using the enhanced Blackfin+ core, the combination of performance, power efficiency, memory integration, sophisticated security, and great value, allows designers to incorporate advanced 16- and 32-bit processing into a wide range of new power sensitive use cases.
Target ADSP-BF70x applications include:
- Portable audio, DJ equipment, and effects
- Automotive audio and sensors
- Portable communications
- Military and aerospace
- Portable healthcare
- Intelligent lighting and occupancy detection*
- Industrial imaging and biometrics*
Resources
EMULATOR-ADSP
Low Cost ICE-1000 and High Performance ICE-2000 USB-based JTAG Emulators
Features and Benefits
- JTAG/SWD support for Blackfin, Blackfin+, SHARC and multi-core SHARC+ with ARM
- Plug-n-Play, USB 2.0 compliant
- USB bus-powered device
- Windows® 8.1, Window 7 compatible
- Multiple processor I/O voltage support: 1.8V, 2.5V, and 3.3V
- Multiprocessor support
- JTAG/SWD clock operation of 5 MHz on the ICE-1000
- JTAG/SWD clock operation up to 46 MHZ on the ICE-2000
- Multi-colored LED for enhanced status indication
- Software controlled target reset to support remote debug
Product Detail
New debug feature added for the ICE-1000/ICE-2000:
- Coresight Serial Wire Debug (SWD)
Tools & Simulations 2
IBIS Model 1
IBIS Model
BSDL Model File 1
