The ADL9005-EVALZ consists of a 2-layer printed circuit board (PCB) fabricated from 10 mil thick, Rogers 4350B, copper clad, mounted to an aluminum heat spreader. The heat spreader assists in providing thermal relief to the device as well as mechanical support to the PCB. Mounting holes on the heat spreader allow attachment to larger heat sinks for improved thermal management.
The RFIN and RFOUT ports on the ADL9005-EVALZ are populated with 2.9 mm, female coaxial connectors, and the respective RF traces have a 50 Ω characteristic impedance. The ADL9005-EVALZ is populated with components suitable for use over the entire −40°C to +85°C operating temperature range of the ADL9005.
To calibrate out board trace losses, a through calibration path, THRU CAL, is provided between the RFINTHRU and THRUCAL connectors. RFINTHRU and THRUCAL must be populated with RF connectors to use the through calibration path. The power voltages and ground path are accessed through surfacemounted technology (SMT) test points.
An external wideband bias tee must be connected to RFOUT to provide bias current and ac coupling on RFOUT. The BT2-0040 from Marki Microwave is recommended.
Alternatively, dc bias can be provided by connecting the dc supply voltage to the VDDOPT SMT test point.
The RF traces are 50 Ω, grounded, coplanar waveguide. The package ground leads and the exposed pad directly connect to the ground plane. Multiple vias are used to connect the top and bottom ground planes with particular focus on the area directly beneath the ground pad to provide adequate electrical conduction and thermal conduction to the heat spreader.
For full details on the ADL9005, see the ADL9005 data sheet, which must be consulted in conjunction with the user guide when using the ADL9005-EVALZ.
