ADG1208
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ADG1208

Low Capacitance, 8-Channel, ±15 V/+12 V iCMOS® Multiplexer

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Part Details
Part Models 6
1ku List Price Starting From $2.89
Features
  • <1 pC charge injection over full signal range
  • 1 pF off capacitance
  • 33 V supply range
  • 120 Ω on resistance
  • Fully specified at ±15 V/+12 V
  • 3 V logic compatible inputs
  • Rail-to-rail operation
  • Break-before-make switching action
  • Available in a 16-lead TSSOP, a 16-lead LFCSP_WQ, and a 16-lead SOIC
  • Typical power consumption < 0.03 μW
Additional Details
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The ADG1208 and ADG1209 are monolithic, iCMOS® analog multiplexers comprising eight single channels and four differential channels, respectively. The ADG1208 switches one of eight inputs to a common output as determined by the 3-bit binary address lines A0, A1, and A2. The ADG1209 switches one of four differential inputs to a common differential output as determined by the 2-bit binary address lines A0 and A1. An EN input on both devices enable or disable the device. When disabled, all channels are switched off. When on, each channel conducts equally well in both directions and has an input signal range that extends to the supplies.

The iCMOS (industrial CMOS) modular manufacturing process combines high voltage CMOS (complementary metal-oxide semiconductor) and bipolar technologies. It enables the development of a wide range of high performance analog ICs capable of 33 V operation in a footprint that no other generation of high voltage devices has been able to achieve. Unlike analog ICs using conventional CMOS processes, iCMOS components can tolerate high supply voltages while providing increased performance, dramatically lower power consumption, and reduced package size.

The ultralow capacitance and exceptionally low charge injection of these multiplexers make them ideal solutions for data acquisition and sample-and-hold applications, where low glitch and fast settling are required. There is minimum charge injection over the entire signal range of the device. iCMOS construction also ensures ultralow power dissipation, making the ds ideally suited for portable and battery-powered instruments.

Applications

  • Audio and video routing
  • Automatic test equipment
  • Data-acquisition systems
  • Battery-powered systems
  • Sample-and-hold systems
  • Communication systems
Part Models 6
1ku List Price Starting From $2.89

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADG1208YCPZ-REEL
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ADG1208YCPZ-REEL7
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ADG1208YRUZ
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ADG1208YRUZ-REEL7
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ADG1208YRZ
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ADG1208YRZ-REEL7
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Part Models

Product Lifecycle

PCN

May 5, 2014

- 14_0020

Conversion of 4x4mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.

Feb 15, 2010

- 07_0061

LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC

Jan 27, 2009

- 09_0013

Changes to Idd Specifications on ADG12xx, ADG14xx and ADG13xx datasheets

ADG1208YCPZ-REEL

PRODUCTION

ADG1208YCPZ-REEL7

PRODUCTION

ADG1208YRUZ

PRODUCTION

ADG1208YRUZ-REEL7

PRODUCTION

ADG1208YRZ

PRODUCTION

ADG1208YRZ-REEL7

PRODUCTION

Oct 13, 2008

- 06_0084

Qualification of the 8" H Wafer Fab process at Analog Devices, Limerick, Ireland.

ADG1208YCPZ-REEL

PRODUCTION

ADG1208YCPZ-REEL7

PRODUCTION

ADG1208YRUZ

PRODUCTION

ADG1208YRUZ-REEL7

PRODUCTION

Apr 5, 2021

- 21_0035

Amkor Philippines as an Alternate Site for TSSOP_4.4

Sep 26, 2012

- 11_0218

Halogen Free Material Change for Certain TSSOP Products at Carsem

Mar 25, 2021

- 21_0080

Amkor Philippines as an Alternate Site for SOICN

Oct 5, 2010

- 10_0146

Halogen Free Material Change for 14/16L SOIC_N Products

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

May 5, 2014

- 14_0020

arrow down

Conversion of 4x4mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.

Feb 15, 2010

- 07_0061

arrow down

LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC

Jan 27, 2009

- 09_0013

arrow down

Changes to Idd Specifications on ADG12xx, ADG14xx and ADG13xx datasheets

ADG1208YCPZ-REEL

PRODUCTION

ADG1208YCPZ-REEL7

PRODUCTION

ADG1208YRUZ

PRODUCTION

ADG1208YRUZ-REEL7

PRODUCTION

ADG1208YRZ

PRODUCTION

ADG1208YRZ-REEL7

PRODUCTION

Oct 13, 2008

- 06_0084

arrow down

Qualification of the 8" H Wafer Fab process at Analog Devices, Limerick, Ireland.

ADG1208YCPZ-REEL

PRODUCTION

ADG1208YCPZ-REEL7

PRODUCTION

ADG1208YRUZ

PRODUCTION

ADG1208YRUZ-REEL7

PRODUCTION

Apr 5, 2021

- 21_0035

arrow down

Amkor Philippines as an Alternate Site for TSSOP_4.4

Sep 26, 2012

- 11_0218

arrow down

Halogen Free Material Change for Certain TSSOP Products at Carsem

Mar 25, 2021

- 21_0080

arrow down

Amkor Philippines as an Alternate Site for SOICN

Oct 5, 2010

- 10_0146

arrow down

Halogen Free Material Change for 14/16L SOIC_N Products

Software & Part Ecosystem

Software & Part Ecosystem

Evaluation Kit

Evaluation Kits 2

reference details image

EVAL-16LFCSP

Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio

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EVAL-16LFCSP

Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio

Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio

Features and Benefits

  • 16-lead, 4 mm × 4 mm LFCSP evaluation board
  • Easily changeable clamshell socket for the main device
  • Gold pin connectors for the addition of passive components
  • SMB connectors for the input and output of signals
  • Additional space on board for prototyping

Product Detail

The EVAL-16LFCSPEBZ enables easy evaluation of the 16-lead lead frame chip scale package (LFCSP) devices in the Switches and Multiplexers Portfolio that are purchased separately. The EVAL-16LFCSPEBZ is supplied with a clamshell socket to secure a 16-lead LFCSP device to the evaluation board without the need for soldering. In addition, there are three sets of gold pin connectors in each trace, for board flexibility and reusability for multiple evaluations.

Figure 1 in the user guide shows the EVAL-16LFCSPEBZ. A 16-lead LFCSP device can be inserted into the socket in the center of the evaluation board. Each device pin has a corresponding three-pin header link, from K1 to K16. This can either be connected to an external signal source by removing the corresponding link or use the link to choose between VDD or GND. A wire screw terminal, J5, supplies the VDD and GND. The Subminiature Version B (SMB) connectors on the EVAL-16LFCSPEBZ allow additional external signals to be supplied to the device. In addition, there is a perfboard space and two 16-lead LFCSP pads (3 mm x 3 mm and 2.1 mm x 2.1 mm) available on top of the EVAL-16LFCSPEBZ for prototyping.

The full specifications of the device under test (DUT) are available in the corresponding product data sheet, which must be consulted with the EVAL-16LFCSPEBZ user guide when using the EVAL-16LFCSPEBZ.

reference details image

EVAL-16TSSOP

Evaluation Board for 16 lead TSSOP Devices in the Switch/Mux Portfolio

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EVAL-16TSSOP

Evaluation Board for 16 lead TSSOP Devices in the Switch/Mux Portfolio

Evaluation Board for 16 lead TSSOP Devices in the Switch/Mux Portfolio

Features and Benefits

  • 16 lead TSSOP evaluation board
  • Clamp to allow the main device to be changed easily
  • Gold pin connectors to allow the addition of passive components
  • SMB connectors for the input/output of signals
  • Additional space on board to allow for prototyping

Product Detail

The EVAL-16TSSOPEBZ evaluation board evaluates 16-lead TSSOP devices in the Switches and Multiplexers Portfolio that are purchased separately. A clamp is supplied with the EVAL-16TSSOPEBZ to secure a 16-lead TSSOP device to the evaluation board without the need for soldering, making the board reusable for multiple devices.

A 16-lead TSSOP device can be clamped or soldered to the center of the evaluation board. Each pin of the device has a corresponding link from K1 to K16 that can be set to either VDD or GND. A wire screw terminal supplies VDD and GND. SMB connectors on the board allow additional external signals to be supplied to the device. In addition, there is space available at the top of the board for prototyping.

Full specifications of the device under test (DUT) are available in the corresponding product data sheet, which should be consulted in conjunction with this user guide when using the evaluation board.

Tools & Simulations

Tools & Simulations 2

LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.

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