ADF7025
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ADF7025

ISM Band Transceiver IC

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warning : NOT RECOMMENDED FOR NEW DESIGNS tooltip
warning : NOT RECOMMENDED FOR NEW DESIGNS tooltip
Part Details
Part Models 3
1ku List Price Starting From $2.89
Features
  • Low Power Zero-IF transceiver
  • Implements complete FSK transceiver solution with few external components. No TRx switch required.
  • Maximum data rate of 384 kbps
  • Operates in Frequency Bands: 431-464 MHz, 862-870 MHz and 902-928 MHz
  • Programmable baseband bandwidths: ±300kHz/±450kHz/±600kHz
  • On-chip 7-bit ADC, temperature sensor and digital RSSI
  • Perfect for price and area sensitive applications
  • Very suitable for wireless audio and video applications
Additional Details
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The ADF7025 is a low power, highly integrated FSK transceiver. It is designed for operation in the license–free ISM bands of 433 MHz, 862 MHz to 870 MHz, and 902 MHz to 928 MHz. The ADF7025 can be used for applications operating under the European ETSI EN300-220 or the North American FCC (Part 15) regulatory standards. The ADF7025 is intended for wideband, high data rate applications with deviation frequencies from 100 kHz to 750 kHz and data rates from 9.6 kbps to 384 kbps. A complete transceiver can be built using a small number of external discrete components, making the ADF7025 very suitable for price-sensitive and area-sensitive applications.

The ADF7025 transceiver is suitable for operation under FCC 15.247 Digital Modulation Specification characterized by large deviation frequencies. This allows up to 1Watt transmit power without the need to frequency hop, thereby significantly reducing protocol overhead.

APPLICATIONS

  • Wireless audio/video
  • Remote control/security systems
  • Wireless metering
  • Keyless entry
  • Home automation
Part Models 3
1ku List Price Starting From $2.89

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADF7025BCPZ
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ADF7025BCPZ-RL
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ADF7025BCPZ-RL7
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Product Lifecycle

PCN

Mar 23, 2012

- 11_0104

Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to ASE-Korea.

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Part Models

Product Lifecycle

PCN

Mar 23, 2012

- 11_0104

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Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to ASE-Korea.

Tools & Simulations

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