Not the part you were looking for?
Ask a Question
Submit your question below and we will return the best answer from ADI’s knowledge database:
Other places you can find help
Support
Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.
Visit the ADI Support PageFeatures
- Download ADA4800-KGD Data Sheet. Available as Known Good Die and fully guaranteed to data sheet specifications.
- Integrated active load and gain of 1 buffer
- Very low buffer power consumption as low as 20 mW on chip
- Power save feature to reduce active load current by GPO control
- Fast settling time to 1%, 2 V step: 5 ns
- High buffer speed
- 400 MHz, −3 dB bandwidth
- 415 V/μs slew rate
- Adjustable buffer bandwidth
- Push-pull output stage
- Adjustable active load current
- Small package: 1.6 mm × 1.6 mm × 0.55 mm
The buffer of the ADA4800 employs a push-pull output stage architecture, providing drive current and maximum slew capability for both rising and falling signal transitions. At a 5 mA quiescent current setting, it provides 400 MHz, −3 dB bandwidth, which makes this buffer well suited for CCD sensors from machine vision to digital still camera applications.
The ADA4800 is ideal for driving the input of the Analog Devices, Inc., 12-bit and 14-bit high resolution analog front ends (AFE) such as the AD9928, AD9990, AD9920A, AD9923A, and AD997x family.
The versatility of the ADA4800 allows for seamless interfacing with many CCD sensors from various manufacturers.
The ADA4800 is designed to operate at supply voltages as low as 4 V and up to 17 V. It is available in a 1.6 mm × 1.6 mm × 0.55 mm, 6-lead LFCSP package and is rated to operate over the industrial temperature range of −40°C to +85°C.
Applications
- CCD image sensor output buffer
- Digital still cameras
- Camcorders
Ask a Question
Submit your question below and we will return the best answer from ADI’s knowledge database:
Other places you can find help
Support
Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.
Visit the ADI Support Page{{modalTitle}}
{{modalDescription}}
{{dropdownTitle}}
- {{defaultSelectedText}} {{#each projectNames}}
- {{name}} {{/each}} {{#if newProjectText}}
- {{newProjectText}} {{/if}}
{{newProjectTitle}}
{{projectNameErrorText}}
ADA4800
Documentation
Filters
1 Applied
Documentation
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
---|---|---|---|
ADA4800-KGD-WP | CHIPS OR DIE |
|
|
ADA4800ACPZ-R7 | 6-Lead LFCSP (1.6mm x 1.6mm w/ EP) |
|
|
ADA4800ACPZ-RL | 6-Lead LFCSP (1.6mm x 1.6mm w/ EP) |
|
- ADA4800-KGD-WP
- Pin/Package Drawing
- CHIPS OR DIE
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- ADA4800ACPZ-R7
- Pin/Package Drawing
- 6-Lead LFCSP (1.6mm x 1.6mm w/ EP)
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- ADA4800ACPZ-RL
- Pin/Package Drawing
- 6-Lead LFCSP (1.6mm x 1.6mm w/ EP)
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
Aug 8, 2022
- 22_0192
Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages
ADA4800ACPZ-R7
PRODUCTION
ADA4800ACPZ-RL
PRODUCTION
Oct 18, 2016
- 16_0036
Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products
ADA4800ACPZ-R7
PRODUCTION
ADA4800ACPZ-RL
PRODUCTION
Aug 6, 2014
- 13_0244
Assembly and Test Transfer of Select 2x2 and 1.6x1.6 mm Mini-LFCSP Products to STATS ChipPAC China
ADA4800ACPZ-R7
PRODUCTION
ADA4800ACPZ-RL
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
Aug 8, 2022
- 22_0192
Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages
ADA4800ACPZ-R7
PRODUCTION
ADA4800ACPZ-RL
PRODUCTION
Oct 18, 2016
- 16_0036
Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products
ADA4800ACPZ-R7
PRODUCTION
ADA4800ACPZ-RL
PRODUCTION
Aug 6, 2014
- 13_0244
Assembly and Test Transfer of Select 2x2 and 1.6x1.6 mm Mini-LFCSP Products to STATS ChipPAC China
ADA4800ACPZ-R7
PRODUCTION
ADA4800ACPZ-RL
PRODUCTION
Software & Part Ecosystem
Evaluation Kits 1
AD-96TOF1-EBZ
3D Time of Flight Development Platform
Product Detail
The AD-96TOF1-EBZ is a proven hardware platform for depth perception. When paired with processor board from the 96Boards eco system, it can be used for 3D software and algorithm development. While the software and algorithms are being developed, the hardware design can be leveraged for productization. ADI can suggest 3rd party developers to help customize the platform to meet individual application needs.
Depending on customer preferences and development experience, different 96Boards processor boards can be used for overall system evaluation and custom development. There is also a Raspberry Pi interface available on the Mezzanine board for extra customer flexibility.
This solution offers the ability to be very small and low power while measuring depth at up to 6m distances, good outdoor and indoor performance and VGA resolution.
It can be used for applications like:
- Robotics
- Industrial automation
- SLAM (Simultaneous Localization and Mapping)
- Augmented Reality
- Virtual Reality
- Drones
- Automotive sensing
Resources