AD5612
2.7 V to 5.5 V, <100 µA, 10-Bit nanoDAC® with I2C Compatible Interface, Tiny SC70 Package
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- Single 8-, 10-, 12-bit DACs, 2 LSB INL
- 6-lead LFCSP and SC70 packages
- Micropower operation: 100 µA max at 5 V
- Power-down to <150 nA at 3 V
- 2.7 V to 5.5 V power supply
- Guaranteed monotonic by design
- Power-on reset to 0 V with brownout detection
- 3 power-down functions
- I2C® compatible serial interface supports standard (100 KHz), fast (400 KHz) and high speed (3.4 MHz) modes
- On-chip output buffer amplifier, rail-to-rail operation
- −40ºC to 125ºC Operation
- AEC-Q100 qualified for automotive applications
The AD5602 / AD5612 / AD5622, members of the nanoDAC® family, are single 8-/10-/12-bit buffered voltage-out DACs that operate from a single 2.7 V to 5.5 V supply, consuming <100 µA at 5 V. The AD5602 / AD5612 / AD5622 comes in a tiny LFCSP and SC70 packages. Each DAC contains an on-chip precision output amplifier allows rail-to-rail output swing to be achieved.
The AD5602 / AD5612 / AD5622 utilizes a 2-wire I2C-compatible serial interface that operates in standard (100 KHz), fast (400 KHz) and high speed (3.4 MHz) modes.
The references for AD5602 / AD5612 / AD5622 are derived from the power supply inputs and to give the widest dynamic output range. Each part incorporates a power-on-reset circuit that ensures the DAC output powers up to 0 V and remains there until a valid write takes place to the device. The devices contain a power-down feature that reduces the current consumption of the device to <150 nA at 3 V and provides software selectable output loads while in power-down mode. The devices are put into power-down mode over the serial interface. The low power consumption of the AD5602 / AD5612 / AD5622 in normal operation makes them ideally suited to portable, battery operated equipment. The power consumption is 0.4 mW at 5 V.
PRODUCT HIGHLIGHTS
- Available in 6-lead LFCSP and SC70 packages.
- Max 100µA power consumption, single-supply operation. These devices operate from a single 2.7 V to 5.5 V supply and typically consumes 0.2 mW at 3 V and 0.4 mW at 5 V, making it ideal for battery-powered applications.
- The on-chip output buffer amplifier allows the output of the DAC to swing rail-to-rail with a typical slew rate of 0.5 V/µs.
- Reference derived from the power supply.
- Standard, fast and high speed mode I2C interface.
- Designed for very low power consumption.
- Power-down capability. When powered down, the DAC typically consumes <150 nA at 3 V.
- Power-on reset and brown out detection.
APPLICATIONS
- Process control
- Data acquisition systems
- Portable battery-powered instruments
- Digital gain and offset adjustment
- Programmable voltage and current sources
- Programmable attenuators
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AD5612
Documentation
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Documentation
Solutions Bulletin & Brochure 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
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AD5612ACPZ-2-RL7 | 6-Lead LFCSP (3mm x 2mm w/ EP) |
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AD5612AKSZ-2500RL7 | 6-Lead SC70 |
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AD5612AKSZ-2REEL7 | 6-Lead SC70 |
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AD5612BKSZ-2500RL7 | 6-Lead SC70 |
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AD5612WAKSZ-2REEL7 | SC-70 |
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AD5612YKSZ-1500RL7 | 6-Lead SC70 |
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AD5612YKSZ-2500RL7 | 6-Lead SC70 |
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AD5612YKSZ-2REEL7 | 6-Lead SC70 |
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- AD5612ACPZ-2-RL7
- Pin/Package Drawing
- 6-Lead LFCSP (3mm x 2mm w/ EP)
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- AD5612AKSZ-2500RL7
- Pin/Package Drawing
- 6-Lead SC70
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- AD5612AKSZ-2REEL7
- Pin/Package Drawing
- 6-Lead SC70
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- AD5612BKSZ-2500RL7
- Pin/Package Drawing
- 6-Lead SC70
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- AD5612WAKSZ-2REEL7
- Pin/Package Drawing
- SC-70
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- AD5612YKSZ-1500RL7
- Pin/Package Drawing
- 6-Lead SC70
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- AD5612YKSZ-2500RL7
- Pin/Package Drawing
- 6-Lead SC70
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- AD5612YKSZ-2REEL7
- Pin/Package Drawing
- 6-Lead SC70
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
Aug 8, 2022
- 22_0192
Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages
AD5612ACPZ-2-RL7
PRODUCTION
Oct 18, 2016
- 16_0036
Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products
Aug 6, 2014
- 13_0223
Assembly and Test Transfer of Select 2x3mm and 3x3mm LFCSP Products to STATS ChipPAC China
AD5612ACPZ-2-RL7
PRODUCTION
Feb 8, 2010
- 04_0080
Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.
AD5612AKSZ-2500RL7
PRODUCTION
AD5612AKSZ-2REEL7
PRODUCTION
AD5612BKSZ-2500RL7
PRODUCTION
AD5612YKSZ-1500RL7
PRODUCTION
AD5612YKSZ-2500RL7
PRODUCTION
AD5612YKSZ-2REEL7
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
Aug 8, 2022
- 22_0192
Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages
AD5612ACPZ-2-RL7
PRODUCTION
Oct 18, 2016
- 16_0036
Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products
Aug 6, 2014
- 13_0223
Assembly and Test Transfer of Select 2x3mm and 3x3mm LFCSP Products to STATS ChipPAC China
AD5612ACPZ-2-RL7
PRODUCTION
Feb 8, 2010
- 04_0080
Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.
AD5612AKSZ-2500RL7
PRODUCTION
AD5612AKSZ-2REEL7
PRODUCTION
AD5612BKSZ-2500RL7
PRODUCTION
AD5612YKSZ-1500RL7
PRODUCTION
AD5612YKSZ-2500RL7
PRODUCTION
AD5612YKSZ-2REEL7
PRODUCTION
Software & Part Ecosystem
Parts | Product Life Cycle | Description |
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PRODUCTION |
10-Bit nanoDAC, I2C Interface and 2 ppm/°C On-Chip Reference |
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