AD5612
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AD5612

2.7 V to 5.5 V, <100 µA, 10-Bit nanoDAC® with I2C Compatible Interface, Tiny SC70 Package

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Info: : PRODUCTION tooltip
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Part Models 8
1ku List Price Starting From $1.38
Features
  • Single 8-, 10-, 12-bit DACs, 2 LSB INL
  • 6-lead LFCSP and SC70 packages
  • Micropower operation: 100 µA max at 5 V
  • Power-down to <150 nA at 3 V
  • 2.7 V to 5.5 V power supply
  • Guaranteed monotonic by design
  • Power-on reset to 0 V with brownout detection
  • 3 power-down functions
  • I2C® compatible serial interface supports standard (100 KHz), fast (400 KHz) and high speed (3.4 MHz) modes
  • On-chip output buffer amplifier, rail-to-rail operation
  • −40ºC to 125ºC Operation
  • AEC-Q100 qualified for automotive applications
Additional Details
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The AD5602 / AD5612 / AD5622, members of the nanoDAC® family, are single 8-/10-/12-bit buffered voltage-out DACs that operate from a single 2.7 V to 5.5 V supply, consuming <100 µA at 5 V. The AD5602 / AD5612 / AD5622 comes in a tiny LFCSP and SC70 packages. Each DAC contains an on-chip precision output amplifier allows rail-to-rail output swing to be achieved.

The AD5602 / AD5612 / AD5622 utilizes a 2-wire I2C-compatible serial interface that operates in standard (100 KHz), fast (400 KHz) and high speed (3.4 MHz) modes.

The references for AD5602 / AD5612 / AD5622 are derived from the power supply inputs and to give the widest dynamic output range. Each part incorporates a power-on-reset circuit that ensures the DAC output powers up to 0 V and remains there until a valid write takes place to the device. The devices contain a power-down feature that reduces the current consumption of the device to <150 nA at 3 V and provides software selectable output loads while in power-down mode. The devices are put into power-down mode over the serial interface. The low power consumption of the AD5602 / AD5612 / AD5622 in normal operation makes them ideally suited to portable, battery operated equipment. The power consumption is 0.4 mW at 5 V.

PRODUCT HIGHLIGHTS

  1. Available in 6-lead LFCSP and SC70 packages.
  2. Max 100µA power consumption, single-supply operation. These devices operate from a single 2.7 V to 5.5 V supply and typically consumes 0.2 mW at 3 V and 0.4 mW at 5 V, making it ideal for battery-powered applications.
  3. The on-chip output buffer amplifier allows the output of the DAC to swing rail-to-rail with a typical slew rate of 0.5 V/µs.
  4. Reference derived from the power supply.
  5. Standard, fast and high speed mode I2C interface.
  6. Designed for very low power consumption.
  7. Power-down capability. When powered down, the DAC typically consumes <150 nA at 3 V.
  8. Power-on reset and brown out detection.

APPLICATIONS

  • Process control
  • Data acquisition systems
  • Portable battery-powered instruments
  • Digital gain and offset adjustment
  • Programmable voltage and current sources
  • Programmable attenuators
Part Models 8
1ku List Price Starting From $1.38

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Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
AD5612ACPZ-2-RL7
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AD5612AKSZ-2500RL7
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AD5612AKSZ-2REEL7
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AD5612BKSZ-2500RL7
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AD5612WAKSZ-2REEL7
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AD5612YKSZ-1500RL7
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AD5612YKSZ-2500RL7
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AD5612YKSZ-2REEL7
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Product Lifecycle

PCN

Aug 8, 2022

- 22_0192

Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages

Oct 18, 2016

- 16_0036

Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products

Aug 6, 2014

- 13_0223

Assembly and Test Transfer of Select 2x3mm and 3x3mm LFCSP Products to STATS ChipPAC China

Feb 8, 2010

- 04_0080

Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.

AD5612AKSZ-2500RL7

PRODUCTION

AD5612AKSZ-2REEL7

PRODUCTION

AD5612BKSZ-2500RL7

PRODUCTION

AD5612YKSZ-1500RL7

PRODUCTION

AD5612YKSZ-2500RL7

PRODUCTION

AD5612YKSZ-2REEL7

PRODUCTION

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Aug 8, 2022

- 22_0192

arrow down

Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages

Oct 18, 2016

- 16_0036

arrow down

Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products

Aug 6, 2014

- 13_0223

arrow down

Assembly and Test Transfer of Select 2x3mm and 3x3mm LFCSP Products to STATS ChipPAC China

Feb 8, 2010

- 04_0080

arrow down

Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.

AD5612AKSZ-2500RL7

PRODUCTION

AD5612AKSZ-2REEL7

PRODUCTION

AD5612BKSZ-2500RL7

PRODUCTION

AD5612YKSZ-1500RL7

PRODUCTION

AD5612YKSZ-2500RL7

PRODUCTION

AD5612YKSZ-2REEL7

PRODUCTION

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