AD5601
Info: : PRODUCTION
searchIcon
cartIcon

AD5601

2.7 V to 5.5 V, <100 μA, 8-Bit nanoDAC, SPI Interface in LFCSP and SC70

Show More showmore-icon

Info: : PRODUCTION tooltip
Info: : PRODUCTION tooltip
Part Details
Part Models 3
1ku List Price Starting From $0.68
Features
  • 6-lead SC70 and LFCSP packages
  • Micropower operation: 100 μA maximum at 5 V
  • Power-down typically to 0.2 μA at 3 V
  • 2.7 V to 5.5 V power supply
  • Guaranteed monotonic by design
  • Power-on reset to 0 V with brownout detection
  • 3 power-down functions
  • Low power serial interface with Schmitt-triggered inputs
  • On-chip output buffer amplifier, rail-to-rail operation
  • SYNC interrupt facility
  • Minimized zero-code error
  • AD5601 buffered 8-bit DAC
    • B version: ±0.5 LSB INL
  • AD5611 buffered 10-bit DAC
    • B version: ±0.5 LSB INL
    • A version: ±4 LSB INL
  • AD5621 buffered 12-bit DAC
    • B version: ±1 LSB INL
    • A version: ±6 LSB INL
Additional Details
show more Icon

The AD5601/AD5611/AD5621, members of the nanoDAC® family, are single, 8-/10-/12-bit, buffered voltage output DACs that operate from a single 2.7 V to 5.5 V supply, consuming typically 75 μA at 5 V. The parts come in tiny LFCSP and SC70 packages. Their on-chip precision output amplifier allows rail-to-rail output swing to be achieved. The AD5601/AD5611/AD5621 utilize a versatile 3-wire serial interface that operates at clock rates up to 30 MHz and is compatible with SPI, QSPI, MICROWIRE, and DSP interface standards.

The reference for the AD5601/AD5611/AD5621 is derived from the power supply inputs and, therefore, gives the widest dynamic output range. The parts incorporate a power-on reset circuit, which ensures that the DAC output powers up to 0 V and remains there until a valid write to the device takes place.

The AD5601/AD5611/AD5621 contain a power-down feature that reduces current consumption to typically 0.2 μA at 3 V.

They also provide software-selectable output loads while in power-down mode. The parts are put into power-down mode over the serial interface.

The low power consumption of these parts in normal operation makes them ideally suited to portable battery-operated equip-ment. The combination of small package and low power makes these nanoDAC devices ideal for level-setting requirements, such as generating bias or control voltages in space-constrained and power-sensitive applications.

Product Highlights

  1. Available in 6-lead LFCSP and SC70 packages.
  2. Low power, single-supply operation. The AD5601/ AD5611/AD5621 operate from a single 2.7 V to 5.5 V supply with a maximum current consumption of 100 μA, making them ideal for battery-powered applications.
  3. The on-chip output buffer amplifier allows the output of the DAC to swing rail-to-rail with a typical slew rate of 0.5 V/μs.
  4. Reference is derived from the power supply.
  5. High speed serial interface with clock speeds up to 30 MHz. Designed for very low power consumption. The interface powers up only during a write cycle.
  6. Power-down capability. When powered down, the DAC typically consumes 0.2 μA at 3 V. Power-on reset with brownout detection.

Applications

  • Voltage level setting
  • Portable battery-powered instruments
  • Digital gain and offset adjustment
  • Programmable voltage and current sources
  • Programmable attenuators
Part Models 3
1ku List Price Starting From $0.68

close icon
Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
AD5601BCPZ-RL7
  • HTML
  • HTML
AD5601BKSZ-500RL7
  • HTML
  • HTML
AD5601BKSZ-REEL7
  • HTML
  • HTML

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Aug 8, 2022

- 22_0192

Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages

Oct 18, 2016

- 16_0036

Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products

Aug 6, 2014

- 13_0223

Assembly and Test Transfer of Select 2x3mm and 3x3mm LFCSP Products to STATS ChipPAC China

Feb 8, 2010

- 04_0080

Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Aug 8, 2022

- 22_0192

arrow down

Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages

Oct 18, 2016

- 16_0036

arrow down

Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products

Aug 6, 2014

- 13_0223

arrow down

Assembly and Test Transfer of Select 2x3mm and 3x3mm LFCSP Products to STATS ChipPAC China

Feb 8, 2010

- 04_0080

arrow down

Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.

Software & Part Ecosystem

Software & Part Ecosystem

Can't find the software or driver you need?

Request a Driver/Software
Tools & Simulations

Tools & Simulations 2

Recently Viewed