LT3040

• Allows prototyping of intelligent, secure, and connected industrial field devices
• Arduino Mega-compatible form factor
• Two Pmod™-compatible connectors
• ARM Cortex-M4 Ultra Efficient Microcontroller with integrated Bluetooth 5.2 LE
• WiFi connectivity
• Long-range, single-pair 10BASE-T1L Ethernet interface
• Built-in security for root-of-trust, mutual authentication, data confidentiality and integrity, secure boot, and secure communications
• Open-source software stack

The AD-APARD32690-SL is a platform for prototyping intelligent, secure, and connected field devices. It has an Arduino Mega-compatible form factor and two Pmod™-compatible connectors.

The system includes the MAX32690 ARM Cortex-M4 with FPU-Based Microcontroller and Bluetooth LE 5.2. The MCU is coupled with external RAM (2 x 512 Mb) and Flash (64 Mb) memories to meet the requirements of the most demanding applications. The MAXQ1065 security coprocessor enables state of the art security features such as for root-of-trust, mutual authentication, data confidentiality and integrity, secure boot, and secure communications.

A 10 Mbps single-pair Ethernet link using the ADIN1110 10BASE-T1L MAC/PHY, enables remote data acquisition and system configuration. The 10BASE-T1L interface also supports Single-pair Power over Ethernet (SPoE) and be used for powering the system via an Arduino shield implementing the required power circuitry.

WiFi connectivity is provided via the on-board NINA-W102 multiradio wireless MCU module with internal antenna.

Power can be supplied either via the USB-C connector or via a 2-pin terminal block. The supported input voltage range is 5 V to 28 V.

The system is accompanied by an open-source software stack and associated collateral, enabling a complete experience from evaluation, and prototyping, all the way to production firmware and application development. The open-source software stack also includes drivers and example applications for a wide variety of ADCs, DACs, sensors, and other devices commonly used in industrial applications, further accelerating the development process. An external programmer such as the MAX32625PICO DAPLink, or any other similar programmer supporting the SWD interface, enables firmware programming and debug. The system’s firmware is based on Analog Devices’ open-source no-OS framework which includes all the tools required for embedded code development and debugging as well as libraries, enabling host-side connectivity for system configuration and data transfer over the UART, USB, WiFi, and 10BASE-T1L interfaces.

APPLICATIONS

• Factory automation
• Process control
• Intelligent buildings
• Secure field instruments
• Internet of Things

Demo board DC2783A features the LT3040, a 200mA high performance, robust voltage reference/DAC buffer. LT3040 has ultralow output noise, ultrahigh power supply rejection ratio (PSRR) and low dropout voltage for powering noise sensitive, high accuracy systems.

DC2783A has two inputs: V+ and V_IN. V+ supplies power to the buffer, operating over a range from 2V to 20V. V_IN is the regulation set-point for the output with a range from 0V to 15V. Current limit is programmable by connecting a resistor, R3, from ILIM to GND. The ILIM can also serve as a current monitor pin with a range from 0V to 300mV.

LT3040 has fast start capability. Connecting FS pin across an input low pass filter resistor, R2, fast starts the LT3040. Fast start circuitry is typically triggered active if V_FS − V_IN ≥ 100mV and stays active until V_FS – V_IN ≤ 7mV. If fast start functionality is not needed, connect FS to V_IN by setting R2 to 0Ω and applying the input voltage at FS.

LT3040 has a fault flag to indicate faults at the output. Built-in protection includes reverse battery protection, reverse current protection, internal current limit with foldback and thermal limit with hysteresis.

The LT3040 datasheet gives a complete description of the part, operation and applications information. The datasheet must be read in conjunction with this Demo Manual for demonstration circuit DC2783A. The LT3040 is assembled in a 12-lead MSOP and a 10-lead (3mm x 3mm) plastic DFN package with an exposed pad on the bottom-side of the IC. Proper board layout is essential for maximum thermal performance.