Precision Signal Chain µModule Solutions
Analog Devices’ precision signal chain μModule® solutions utilize heterogeneous integration to provide a complete solution to precision data conversion. These solutions reduce design iterations by transferring the component selection, optimization, and layout from the designer to the device. They also significantly reduce the footprint, total cost of ownership, and time to market for system-level designers.
Heterogeneous integration based on system in package (SiP) technology enables the use of the best process for each stage in the signal chain. ADI’s precision signal chain µModule solutions combine our broad portfolio of industry-leading products with our iPassives® technology and advanced 2.5D/3D assembly technology to maximize density. The µModule devices are thoroughly tested signal chain building blocks that enable system designers to quickly achieve their end goal—no debugging or optimizing of external circuitry required.
SiP technology is enabling the next wave of heterogeneous integration within the semiconductor industry, referred to as “More than Moore.”
The Benefits
Reduced Solution Footprint
By leveraging our iPassives technology via system in package assembly techniques, ADI’s precision signal chain μModule solutions minimize PCB footprint while maintaining performance. This approach reduces the interconnectivity parasitics (R, L, C), enabling higher signal integrity and reducing power consumption. The significant footprint reduction enables more functionality in a smaller footprint and the placement of the data conversion system closer to the sensor.
Reduced System-Level Development Cost and Time-To-Market
A precision signal chain µModule solution is a complete solution with performance specified by data sheet limits. The passive components that impact performance are incorporated to reduce the debug cycle when integrating into the system. Data sheet limits also cover performance variation over environmental conditions and batch to batch variation, reducing time spent on system-level characterization.
ADI’s iPassives technology integrates performance sensitive passive components to improve the gain drift and offset drift performance of the signal chain, removing the burden on the system-level designer to select the right passive components and allowing them to focus their time on validating new sections of their system.
Reduced Total Cost of Ownership
There are many secondary costs associated with supporting a system over its lifetime. A system built with a precision signal chain µModule solution has lower secondary costs because the passive components that impact performance and yield during manufacturing are integrated in the µModule device.
The signal chain µModule data sheet limits cover the full signal chain, enabling consistent performance and high yield in manufacturing. Reducing the occurrence of a yield issue in manufacturing minimizes tech support costs and maximizes manufacturing throughput.
By integrating the passive components that influence parametric drift, ADI’s iPassives technology reduces temperature dependent error sources and removes the need for signal chain calibration vs. temperature in manufacturing, which is time consuming and expensive.
Minimizing the number of discrete components and interconnects on the PCB also improves system reliability due to fewer solder joints, which reduces field support costs.
New Products Highlights
ADAQ7980
The ADAQ7980 16-bit analog-to-digital converter (ADC) µModule® data acquisition solution uses system-in-package (SiP) technology to speed up the design process by optimizing multiple signal chain blocks within one components.
ADAQ4003
The ADAQ4003 18-bit analog-to-digital converter (ADC) µModule® data acquisition solution leverages ADI’s iPASSIVES technology to minimize time and temperature dependent drift errors critical to precision applications.
ADAQ23878
The ADAQ23878 is an 18-Bit, 15 MSPS µModule data acquisition solution that reduces the development cycle of precision measurement systems by transferring the design burden of component selection, optimization, and layout from the designer to the device.
Contact Us
If you have a density challenge and would like to explore a custom signal chain µModule solution, please email custom-solutions@analog.com or contact your local Analog Devices, Inc. sales office.
