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Package/Assembly Qualification Test Report: Plastic Encapsulated QSOP (QTR: 02015 REV: 11)3/22/2019PDF1 M
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Semiconductor Qualification Test Report: MESFET-F (QTR: 2013-00247)4/22/2015PDF798 K
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HMC Legacy PDN: PCN1400258/18/2014PDF56 K
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HMC Legacy PCN: QS##, QS##E and QS##G,QS##GE packages - Relocation of pre-existing production equipment to new building2/1/2013PDF405 K
HMC380
PCS/UMTS高IP3下变频器，采用SMT封装，1.7 - 2.2 GHz
顶部
评估套件 (1)
参考资料
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QSOP 16 Tape Specification (QS16, QS16G)4/1/2015PDF422 K
工具及仿真模型
S参数
ZIP
HMC380 S-Parameters
26.86 K
