ADG509A

不推荐用于新设计

CMOS 4通道模拟多路复用器

数据手册 (Rev. D) 产品选型表

产品模型: 6

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产品详情

最大额定电源电压：44 V
模拟信号范围：V_SS 至 V_DD
单/双电源供电
宽电源电压范围：10.8 V至16.5 V

扩展塑性温度范围：−40°C至+85°C
低功耗：28 mW（最大值）
低泄漏：20 pA（典型值）
提供16引脚DIP/SOIC和20引脚PLCC/LCC封装
DG508A/HI-508和DG509A/HI-509的绝佳替代器件

参考资料

ADI 始终高度重视提供符合最高质量和可靠性水平的产品。我们通过将质量和可靠性检查纳入产品和工艺设计的各个范围以及制造过程来实现这一目标。出货产品的“零缺陷”始终是我们的目标。查看我们的质量和可靠性计划和认证以了解更多信息。

产品型号	引脚/封装图-中文版	文档	CAD 符号，脚注和 3D模型
ADG509AKNZ	16-Lead PDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG509AKPZ-REEL	20-Lead Flatpack	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG509AKRZ-REEL	16-Lead SOIC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG509AKRZ-REEL7	16-Lead SOIC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG509ATQ	16-Lead CerDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG509ATQ/883B	16-Lead CerDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys

产品型号	产品生命周期	PCN

3月 29, 2021 - 21_0033 Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek
		PCN21_0033_Form Material_Report Detailed Change Description Qualification Results Summary
ADG509AKNZ
2月 8, 2010 - 04_0080 Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.
		PCN04_0080_Form Material_Report Reliability Report Reliability Report
ADG509AKNZ
ADG509AKRZ-REEL
ADG509AKRZ-REEL7
ADG509ATQ	量产
ADG509ATQ/883B	量产
8月 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
		Material_Report Material_Report Parts List PCN07_0024_Form Qual Data
ADG509AKNZ
2月 6, 2014 - 13_0234 Qualification of ASE Chungli, as an Alternate Assembly Site for Select 16L SOICN Packages
		PCN13_0234_Form Material_Report Detailed Change Description Qualification Report Summary
ADG509AKRZ-REEL
ADG509AKRZ-REEL7
10月 5, 2010 - 10_0146 Halogen Free Material Change for 14/16L SOIC_N Products
		PCN10_0146_Form Material_Report AEC-Q100 Reliability Report ADI0012 Reliability Report
ADG509AKRZ-REEL
ADG509AKRZ-REEL7
11月 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
		PCN12_0199_Form Material_Report Qualification Report Summary Datasheet Specification Comparison
ADG509ATQ	量产
ADG509ATQ/883B	量产
11月 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
		PCN11_0050_Form Material_Report
ADG509ATQ	量产
ADG509ATQ/883B	量产
11月 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
		PCN11_0182_Form Material_Report
ADG509ATQ	量产
ADG509ATQ/883B	量产
4月 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
		PCN16_0026_Form Material_Report Qualification Results Summary
ADG509ATQ/883B	量产

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硬件生态系统

部分模型	产品周期	描述
ADG1209	量产	低电容、4通道、±15 V/+12 V iCMOS™ 多路复用器
ADG5209	推荐新设计使用	高压防闩锁型4通道多路复用器

ADG509A

产品详情

参考资料

数据手册 1

应用笔记 3

技术文章 3

产品选型指南 1

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