Silicon SP4T Switch 100 MHz to 30 GHz, faster switching speed
Features and Benefits
- Ultrawideband frequency range: 9 kHz to 30 GHz
- Nonreflective 50 Ω design
- Low insertion loss: 2.4 dB at 20 GHz to 30 GHz
- High isolation: 45 dB at 20 GHz to 30 GHz
- High input linearity
- P1dB: 28 dBm typical
- IP3: 50 dBm typical
- High power handling
- 24 dBm through path
- 24 dBm terminated path
- ESD rating: 1500 V HBM
- No low frequency spurious
- 0.1 dB settling time (50% VCTL to 0.1 dB final RF output): 6 µs
- 24-terminal LGA package
The ADRF5045 is a general-purpose, single-pole, four-throw (SP4T) switch manufactured using a silicon process. It comes in a 24-terminal land grid array (LGA) package and provides high isolation and low insertion loss from 9 kHz to 30 GHz.
This broadband switch requires dual supply voltages, +3.3 V and −3.3 V, and provides complementary metal-oxide semiconductor (CMOS)/low voltage transistor-transistor logic (LVTTL) logiccompatible control.
- Test instrumentation
- Microwave radios and very small aperture terminals (VSATs)
- Military radios, radars, electronic counter measures (ECMs)
- Broadband telecommunications systems
Product Lifecycle Recommended for New Designs
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.
Evaluation Kits (1)
The ADRF5045-EVALZ is a 4-layer evaluation board. Each copper layer is 0.7 mil (0.5 oz) and separated by dielectric materials.
All RF and dc traces are routed on the top copper layer whereas the inner and bottom layers are grounded planes that provide a solid ground for the RF transmission lines. Top dielectric material is 8 mil Rogers RO4003, offering optimal high frequency performance. The middle and bottom dielectric materials provide mechanical strength. The overall board thickness is 62 mil, which allows 2.4 mm RF launchers to be connected at the board edges.
The RF transmission lines were designed using a coplanar waveguide (CPWG) model, with trace width of 14 mil and ground clearance of 5 mil to have a characteristic impedance of 50 Ω. For optimal RF and thermal grounding, as many plated through vias as possible are arranged around transmission lines and under the exposed pad of the package.
Two power supply ports are connected to the VDD and VSS test points, TP1 and TP4, control voltages are connected to the V1 and V2 test points, TP2 and TP3, and the ground reference is connected to the GND test point, TP5.
On the control traces, V1 and V2, a 0 Ohm resistor is used to connect the test points to the pins on the part. On the supply traces, VDD and VSS, a 100 pF bypass capacitor is used to filter high frequency noise. Additionally, unpopulated components positions are available for applying extra bypass capacitors.
The RF input and output ports (RFC, RF1, RF2, RF3, and RF4) are connected through 50 Ω transmission lines to the 2.4 mm RF launchers, J1 to J5. These high frequency RF launchers are by contact and not soldered onto the board. A thru calibration line connects the unpopulated J6 and J7 launchers; this transmission line is used to estimate the loss of the PCB over the environmental conditions being evaluated.
Tools & Simulations
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.
Sample & Buy
The USA list pricing shown is for BUDGETARY USE ONLY, shown in United States dollars (FOB USA per unit for the stated volume), and is subject to change. International prices may differ due to local duties, taxes, fees and exchange rates. For volume-specific price or delivery quotes, please contact your local Analog Devices, Inc. sales office or authorized distributor. Pricing displayed for Evaluation Boards and Kits is based on 1-piece pricing.