The AD9119/AD9129 are high performance, 11-/14-bit RF digital-to-analog converters (DACs) supporting data rates up to 2.8 GSPS. The DAC core is based on a quad-switch architecture that enables dual-edge clocking operation, effectively increasing the DAC update rate to 5.6 GSPS when configured for Mix-Mode™ or 2× interpolation. The high dynamic range and bandwidth enable multicarrier generation up to 4.2 GHz.
In baseband mode, wide bandwidth capability combines with high dynamic range to support from 1 to 158 contiguous carriers for CATV infrastructure applications. A choice of two optional 2× interpolation filters is available to simplify the postreconstruction filter by effectively increasing the DAC update rate by a factor of 2. In Mix-Mode operation, the AD9119/AD9129 can reconstruct RF carriers in the second and third Nyquist zone while still maintaining exceptional dynamic range up to 4.2 GHz. The high performance NMOS DAC core features a quad-switch architecture that enables industry-leading direct RF synthesis performance with minimal loss in output power. The output current can be programmed over a range of 9.5 mA to 34.4 mA.
The AD9119/AD9129 include several features that may further simplify system integration. A dual-port, source synchronous LVDS interface simplifies the data interface to a host FPGA/ASIC. A differential frame/parity bit is also included to monitor the integrity of the interface. On-chip delay locked loops (DLLs) are used to optimize timing between different clock domains.
A serial peripheral interface (SPI) is used to configure the AD9119/AD9129 and monitor the status of readback registers. The AD9119/AD9129 is manufactured on a 0.18 μm CMOS process and operates from +1.8 V and −1.5 V supplies. It is supplied in a 160-ball chip scale package ball grid array.PRODUCT HIGHLIGHTS
|Title||Content Type||File Type|
|AD9119/AD9129: 11-/14-Bit, 5.7 GSPS, RF Digital-to-Analog Converter Data Sheet (Rev A, 09/2013) (pdf, 905 kB)||Data Sheets|
|Analog Devices’ DOCSIS 3.0-Compliant RF D/A Converter Operates at One-Third the Power of Competing Devices and Reduces PCB Space by 25 Percent (16 Oct 2012)||Press Releases||HTML|
|Glossary of EE Terms||Glossary||HTML|
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