PM156S
PM156S
製造中Aerospace Monolithic JFET Input Operational Amplifier
- 製品モデル
- 5
- 1Ku当たりの価格
- 最低価格:$48.65
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製品の詳細
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The PM156 provides low input current, high slew rate, and direct interchangeability with LF156 type. This operational amplifier uses a new process which allows fabrication of matched JFET transistors and standard bipolar transistors on the same chip. High accuracy make the PM156 useful in new designs and as replacements for modular and hybrid types. Unlike many designs, nulling the input offset voltage does not degrade common-mode rejection ratio or input offset voltage drift. Low input voltage noise and current noise plus a low 1/f noise corner frequency allow these amplifiers to be used in a variety of low noise, wide-bandwidth applications.
Dynamic specifications for the PM156 include a typical slew rate of 12V/µs, a 2.5MHz gain bandwidth product, and settling time to within ±0.01% of final value in 4.0µs.
ドキュメント
データシート 1
クロスリファレンス・ガイド 1
高レベル放射線レポート 1
製品モデル | ピン/パッケージ図 | 資料 | CADシンボル、フットプリント、および3Dモデル |
---|---|---|---|
5962R9863602VGA | 8 ld Header | ||
JM38510/11402BPA | 8-Lead CerDIP | ||
JM38510/11405BGA | ROUND HEADER/METAL CAN | ||
JM38510/11405BPA | 8-Lead CerDIP | ||
JM38510/11405SGA | ROUND HEADER/METAL CAN |
製品モデル | 製品ライフサイクル | PCN |
---|---|---|
4 25, 2024 - 24_0056 PM155S and PM156S SMD Datasheet Update |
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5962R9863602VGA | ||
9 29, 2022 - 22_0195 Shipment Carrier Change for TO-99 Header Package |
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5962R9863602VGA | ||
JM38510/11405SGA | ||
7 30, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices |
||
5962R9863602VGA | ||
JM38510/11405SGA | ||
11 18, 2015 - 15_0219 Laser Marking Standardization for Aerospace Packages |
||
5962R9863602VGA | ||
JM38510/11402BPA | 製造中 | |
JM38510/11405BGA | 製造中 | |
JM38510/11405BPA | 製造中 | |
JM38510/11405SGA | ||
10 2, 2013 - 13_0163 Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices |
||
5962R9863602VGA | ||
JM38510/11405SGA | ||
11 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines |
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5962R9863602VGA | ||
JM38510/11402BPA | 製造中 | |
JM38510/11405BGA | 製造中 | |
JM38510/11405BPA | 製造中 | |
JM38510/11405SGA | ||
11 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines |
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5962R9863602VGA | ||
JM38510/11402BPA | 製造中 | |
JM38510/11405BGA | 製造中 | |
JM38510/11405BPA | 製造中 | |
JM38510/11405SGA | ||
4 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices |
||
JM38510/11402BPA | 製造中 | |
JM38510/11405BGA | 製造中 | |
JM38510/11405BPA | 製造中 | |
11 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages. |
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JM38510/11402BPA | 製造中 | |
JM38510/11405BPA | 製造中 | |
6 6, 2012 - 12_0066 Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite |
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JM38510/11402BPA | 製造中 | |
JM38510/11405BGA | 製造中 | |
JM38510/11405BPA | 製造中 | |
2 1, 2010 - 09_0196 Change In Location of Q Compliance Indicator Location for JAN/38510 Product |
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JM38510/11402BPA | 製造中 | |
JM38510/11405BGA | 製造中 | |
JM38510/11405BPA | 製造中 | |
JM38510/11405SGA | ||
7 31, 2009 - 09_0106 Removal of Die Fab Code from Topside Marking of Remaining Mil-Grade Products |
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JM38510/11402BPA | 製造中 | |
JM38510/11405BGA | 製造中 | |
JM38510/11405BPA | 製造中 | |
6 1, 2011 - 11_0088 Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages |
||
JM38510/11405BGA | 製造中 | |
JM38510/11405SGA | ||
10 29, 2017 - 17_0079 Qualification of TeamQuest Technology Inc., Philippines as an Alternate Test Site for TC-Vos Testing |
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JM38510/11405SGA |
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