OP467S
製造中Aerospace Quad High-Speed Precision Op Amp
- 製品モデル
- 6
- 1Ku当たりの価格
- 最低価格:$319.93
製品の詳細
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The OP467 is a quad, high speed, precision operational amplifier. It offers the performance of a high speed op amp combined with the advantages of a precision op amp in a single package. The OP467 is an ideal choice for applications where, traditionally, more than one op amp was used to achieve this level of speed and precision.
The internal compensation of the OP467 ensures stable unity-gain operation, and it can drive large capacitive loads without oscillation. With a gain bandwidth product of 28 MHz typ driving a 30 pF load, output slew rate is 170 V/μs, and settling time to 0.01% in less than 200 ns, the OP467 provides excellent dynamic accuracy in high speed data acquisition systems. The channel-to-channel separation is typically 60 dB at 10 MHz.
The low offset and drift plus high speed and low noise make the OP467 usable in applications such as high speed detectors and instrumentation.
ドキュメント
データシート 1
放射線レポート 1
高レベル放射線レポート 1
製品モデル | ピン/パッケージ図 | 資料 | CADシンボル、フットプリント、および3Dモデル |
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5962-9325801V2A | 20-Lead LCC | ||
5962R9325801VCA | 14-Lead CerDIP | ||
5962R9325801VDA | 14-Lead FlatPack (0.26 in x 0.39 in x 0.115 in) | ||
OP467-000C | CHIPS OR DIE | ||
OP467AM-EMX | 14-Lead CerDIP | ||
OP467R000C | CHIPS OR DIE |
製品モデル | 製品ライフサイクル | PCN |
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7 30, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices |
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5962-9325801V2A | 製造中 | |
5962R9325801VCA | 製造中 | |
5962R9325801VDA | 製造中 | |
11 18, 2015 - 15_0219 Laser Marking Standardization for Aerospace Packages |
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5962-9325801V2A | 製造中 | |
5962R9325801VCA | 製造中 | |
5962R9325801VDA | 製造中 | |
6 20, 2014 - 14_0144 OP467S Aerospace Class S Models Change In Wafer Diameter |
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5962-9325801V2A | 製造中 | |
5962R9325801VCA | 製造中 | |
5962R9325801VDA | 製造中 | |
10 2, 2013 - 13_0163 Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices |
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5962-9325801V2A | 製造中 | |
5962R9325801VCA | 製造中 | |
5962R9325801VDA | 製造中 | |
11 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines |
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5962-9325801V2A | 製造中 | |
5962R9325801VCA | 製造中 | |
5962R9325801VDA | 製造中 | |
11 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines |
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5962-9325801V2A | 製造中 | |
5962R9325801VCA | 製造中 | |
5962R9325801VDA | 製造中 | |
6 1, 2011 - 11_0088 Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages |
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5962-9325801V2A | 製造中 | |
11 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages. |
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5962R9325801VCA | 製造中 | |
5962R9325801VDA | 製造中 | |
2 9, 2009 - 08_0073 Change of Seal Glass Material for Cerdip & Cerpak Packages |
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5962R9325801VCA | 製造中 | |
5962R9325801VDA | 製造中 | |
9 21, 2009 - 09_0188 Change of Bottom Brand from Ink to Laser for Aerospace Cerpak Packages |
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5962R9325801VDA | 製造中 |
これは最新改訂バージョンのデータシートです。