OP400S
OP400S
製造中Aerospace Quad Low-Offset, Low-Power Op Amp
- 製品モデル
- 8
- 1Ku当たりの価格
- 価格は未定
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製品の詳細
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The OP400 is the first monolithic quad operational amplifier that features OP77-type performance. Precision performance is not sacrificed with the OP400 to obtain the space and cost savings offered by quad amplifiers.
The OP400 features an extremely low input offset voltage of less than 150 μV with a drift of less than 1.2 μV/°C, guaranteed over the full military temperature range. Open-loop gain of the OP400 is more than 5 million into a 10 kΩ load, input bias current is less than 3 nA, CMR is more than 120 dB, and PSRR is less than 1.8 μV/V. On-chip Zener zap trimming is used to achieve the low input offset voltage of the OP400 and eliminates the need for offset nulling. The OP400 conforms to the industry-standard quad pinout, which does not have null terminals.
The OP400 features low power consumption, drawing less than 725 μA per amplifier. The total current drawn by this quad amplifier is less than that of a single OP07, yet the OP400 offers significant improvements over this industry-standard op amp. Voltage noise density of the OP400 is a low 11 nV/√Hz at 10 Hz, half that of most competitive devices. The OP400 is pin-compatible with the LM148 and LT1014 operational amplifiers and can be used to upgrade systems having these devices. The OP400 is an ideal choice for applications requiring multiple precision operational amplifiers and where low power consumption is critical.
ドキュメント
低レベル放射線レポート 1
高レベル放射線レポート 1
製品モデル | ピン/パッケージ図 | 資料 | CADシンボル、フットプリント、および3Dモデル |
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5962-8777101V3A | 28-Lead LCC | ||
5962-8777101VCA | 14-Lead CerDIP | ||
5962-8777101VKA | 24-Lead Flatpack | ||
5962L8777102VKA | 24-Lead Flatpack | ||
5962R8777101VCA | 14-Lead CerDIP | ||
5962R8777101VKA | 24-Lead Flatpack | ||
OP400-000C | CHIPS OR DIE | ||
OP400AN-EMX | 24-Lead Flatpack |
製品モデル | 製品ライフサイクル | PCN |
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7 30, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices |
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5962-8777101V3A | ||
5962-8777101VCA | ||
5962-8777101VKA | ||
5962R8777101VCA | ||
5962R8777101VKA | ||
OP400-000C | ||
10 29, 2017 - 17_0079 Qualification of TeamQuest Technology Inc., Philippines as an Alternate Test Site for TC-Vos Testing |
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5962-8777101V3A | ||
5962-8777101VCA | ||
2 1, 2017 - 17_0024 OP400S Change In Wafer Diameter & Wafer Fab Site for Aerospace Models |
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5962-8777101V3A | ||
5962-8777101VCA | ||
5962-8777101VKA | ||
OP400-000C | ||
11 18, 2015 - 15_0219 Laser Marking Standardization for Aerospace Packages |
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5962-8777101V3A | ||
5962-8777101VCA | ||
5962-8777101VKA | ||
OP400-000C | ||
10 2, 2013 - 13_0163 Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices |
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5962-8777101V3A | ||
5962-8777101VCA | ||
5962-8777101VKA | ||
11 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines |
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5962-8777101V3A | ||
5962-8777101VCA | ||
5962-8777101VKA | ||
11 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines |
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5962-8777101V3A | ||
5962-8777101VCA | ||
5962-8777101VKA | ||
6 1, 2011 - 11_0088 Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages |
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5962-8777101V3A | ||
11 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages. |
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5962-8777101VCA | ||
5962-8777101VKA | ||
2 9, 2009 - 08_0073 Change of Seal Glass Material for Cerdip & Cerpak Packages |
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5962-8777101VCA | ||
5962-8777101VKA | ||
9 21, 2009 - 09_0188 Change of Bottom Brand from Ink to Laser for Aerospace Cerpak Packages |
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5962-8777101VKA |
これは最新改訂バージョンのデータシートです。