AD568
最終販売12-Bit Ultrahigh Speed Monolithic D/A Converter
- 製品モデル
- 1
- 1Ku当たりの価格
- 価格は未定
製品情報
- Ultrahigh Speed: Current Settling to 1 LSB in 35 ns
- High Stability Buried Zener Reference on Chip
- Monotonicity Guaranteed Over Temperature
- 10.24 mA Full-Scale Output Suitable for Video Applications
- Integral and Differential Linearity Guaranteed Over Temperature
- 0.3" “Skinny DIP” Packaging
- Variable Threshold Allows TTL and CMOS Interface
- MIL-STD-883 Compliant Versions Available
The AD568 is an ultrahigh-speed, 12-bit digital-to-analog converter (DAC) settling to 0.025% in 35 ns. The monolithic device is fabricated using Analog Devices' Complementary Bipolar (CB) Process. This is a proprietary process featuring high-speed NPN and PNP devices on the same chip without the use of dielectric isolation or multichip hybrid techniques. The high speed of the AD568 is maintained by keeping impedance levels low enough to minimize the effects of parasitic circuit capacitances.
The DAC consists of 16 current sources configured to deliver a 10.24 mA full-scale current. Multiple matched current sources and thin-film ladder techniques are combined to produce bit weighting. The DAC's output is a 10.24 mA full scale (FS) for current output applications or a 1.024 V FS unbuffered voltage output. Additionally, a 10.24 V FS buffered output may be generated using an onboard 1 k(ohm) span resistor with an external op amp. Bipolar ranges are accomplished by pin strapping.
Laser wafer trimming insures full 12-bit linearity. All grades of the AD568 are guaranteed monotonic over their full operating temperature range. Furthermore, the output resistance of the DAC is trimmed to 100(ohm) =/-1.0%. The gain temperature coefficient of the voltage output is 30 ppm/°C max (K).
The AD568 is available in three performance grades. The AD568JQ and KQ are available in 24-pin cerdip (0.3") packages and are specified for operation from 0°C to +70°C. The AD568SQ features operation from -55°C to +125°C and is also packaged in the hermetic 0.3" cerdip.
ドキュメント
データシート 2
| 製品モデル | ピン／パッケージ図 | 資料 | CADシンボル、フットプリント、および3Dモデル |
|---|---|---|---|
| 5962-8980801LA | 24-Lead CerDIP (Narrow 0.3 Inch) |
| 製品モデル | 製品ライフサイクル | PCN |
|---|---|---|
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4 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices |
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| 5962-8980801LA | 製造中止 | |
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11 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages. |
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| 5962-8980801LA | 製造中止 | |
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6 6, 2012 - 12_0066 Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite |
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| 5962-8980801LA | 製造中止 | |
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11 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines |
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| 5962-8980801LA | 製造中止 | |
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11 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines |
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| 5962-8980801LA | 製造中止 | |
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6 23, 2020 - 20_0037 Discontinuance of AD568 |
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| 5962-8980801LA | 製造中止 | |
これは最新改訂バージョンのデータシートです。